Open earphone

ABSTRACT

The present disclosure relates to a waterproof open earphone. The waterproof open earphone may include a housing, at least one button, at least one elastic pad, and at least one pair of speaker units. The housing may be placed on a head or at least one ear of a user while not blocking an ear canal of the user. The at least one button may be set on the housing, wherein each of the at least one button corresponds to a button hole. The at least one elastic pad may correspond to the at least one button, respectively, wherein each elastic pad prevents the corresponding button from moving relative to the button hole. Each pair of the at least one pair of speaker units may generate sound within a frequency range from two sound guiding holes through two sound guiding tubes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of International Application No.PCT/CN2020/088482, filed on Apr. 30, 2020, which designates the UnitedStates of America and claims priority to Chinese Patent Application No.201910888067.6, filed on Sep. 19, 2019, Chinese Patent Application No.201910888762.2, filed on Sep. 19, 2019, and Chinese Patent ApplicationNo. 201910364346.2, filed on Apr. 30, 2019, the contents of each ofwhich are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure generally relates to the field of electronicdevices, and in particular, to an open earphone.

BACKGROUND

As indispensable electronic devices in daily life, earphones are widelyused in various fields. The most common earphones are in-ear earphonesand headphones, which form closed couplings with user's ears and hencehave low sound leakage. However, long-term use of such earphones maycause ear pain and hearing damage. Moreover, it is difficult for theuser to hear external sound when wearing such earphones, which ispotentially dangerous. Therefore, open earphone is designed and used.However, there is generally a sound leakage when using the openearphone. When the volume is relatively high and the environment isrelatively quiet, sound leakage may be especially prominent and obvious,which not only affects the work or life of people around it, but alsoleaks what the user hears.

In addition, a user may hope to use an open earphone when he/she isswimming or outside in rainy days. The user may press buttons of theopen earphone to achieve certain functions (e.g., pausing/playing musicand answering a call). However, when the user presses the buttons, evenif the open earphone is claimed to be waterproof, liquid may enter theopen earphone through space or holes near the buttons. Therefore, it isdesirable to provide an open earphone with improved waterproofperformance and sound leakage reduction capability.

SUMMARY

In response to the problem, the present disclosure provides an openearphone. By performing frequency division processing of audio signalsand setting a plurality of sound guiding holes with adjusting distancesbetween the sound guiding holes, the sound leakage prevention capabilityof the open earphone may be improved, thereby improving the userexperience. By improving sealing performances of one or more componentsof the open earphone (e.g., circuit housings, buttons, etc.), thewaterproof performance of the open earphone may be improved.

In order to achieve the purposes, the technical solutions provided bythe present disclosure are as follows:

According to one aspect of the present disclosure, a waterproof openearphone is provided. The waterproof open earphone may include ahousing, at least one button, at least one elastic pad, and at least onepair of speaker units. The housing is placed on a head or at least oneear of a user while not blocking an ear canal of the user. The at leastone button is set on the housing, wherein each of the at least onebutton corresponds to a button hole. The at least one elastic padcorresponds to the at least one button, respectively, wherein eachelastic pad prevents the corresponding button from moving relative tothe button hole. Each pair of the at least one pair of speaker unitsgenerate sound within a frequency range from two sound guiding holesthrough two sound guiding tubes.

In some embodiments, the at least one pair of speaker unit includes apair of low-frequency speaker units and a pair of high-frequency speakerunits, wherein the pair of first frequency speaker units generate soundwithin a first frequency range from two first sound guiding holesthrough two first sound guiding tubes, and the pair of second frequencyspeaker units generate sound within a second frequency range from twosecond sound guiding holes through two second sound guiding tubes,wherein the second frequency range includes a frequency higher than thefirst frequency range.

In some embodiments, the first frequency range includes a frequencylower than 650 Hz and the second frequency range includes a frequencyhigher than 1000 Hz.

In some embodiments, the first frequency range and the second frequencyrange overlap each other.

In some embodiments, the two first guiding holes are spaced apart fromeach other by a first distance, and the two second guiding holes arespaced apart from each other by a second distance, the first distancebeing greater than the second distance.

In some embodiments, the first distance is not greater than 40 mm andthe second distance is not greater than 7 mm.

In some embodiments, the first distance is 30 mm and the second distanceis 5 mm.

In some embodiments, a center point of one of the first sound guidingholes or the second sound guiding holes is not greater than 10 cm from acenter point of the ear canal of the user.

In some embodiments, a radius of the first guiding tubes or the secondguiding tubes is between 1.75 mm and 5 mm.

In some embodiments, a length of the first guiding tubes or the secondguiding tubes is not greater than 100 mm.

In some embodiments, a length-diameter ratio of the first guiding tubesor the second guiding tubes is not greater than 200 mm.

In some embodiments, the sound generated by the pair of first frequencyspeaker units or the pair of second frequency speaker units are inopposite phases.

In some embodiments, the waterproof open earphone further includes acircuit housing including an accommodating body and a cover, wherein acavity that has an opening at one end of the accommodating body is seton the accommodating body and the cover is covered on the opening of thecavity to seal the cavity.

In some embodiments, the elastic pad is set on a first recessed area anda second recessed area corresponding to the button hole is set on theelastic pad, the second recesses area extending to inside of the buttonhole.

In some embodiments, the button includes a button body and a buttoncontact point, wherein the button body is disposed on a side of theelastic pad away from the circuit housing and the button contact pointextends to inside of the second recessed area.

In some embodiments, the circuit housing further includes a mainsidewall and an auxiliary sidewall connected to the main sidewall,wherein the first recessed area is configured on an outer surface of theauxiliary side wall.

In some embodiments, the circuit housing further includes a buttoncircuit board, and a button switch corresponding to the button hole isset on the button circuit board, wherein when the user presses thebutton, the button contact point contacts and triggers the buttonswitch.

In some embodiments, the button includes at least two button singlebodies disposed away from each other and a connecting portion connectedto the at least two button single bodies, wherein the button contactpoint is set on each of the at least two button single bodies and aelastic bump for supporting the connecting portion is set on the elasticpad.

In some embodiments, the waterproof open earphone further includes arigid pad disposed between the elastic pad and the circuit housing,wherein a through hole is set on the rigid pad and the second recessedarea further extends to the inside of the button hole through thethrough hole.

In some embodiments, the elastic pad and the rigid pad abut each other.

In some embodiments, the waterproof open earphone further includes ahousing casing covering periphery of the circuit housing and peripheryof the button.

In some embodiments, the housing casing includes a bag-shaped structurewith one end open and the circuit housing and the button enter theinside of the housing casing through the open end.

In some embodiments, an annular flange protruding inward is set on theopen end of the housing casing, an end of the circuit housing is set asa stair shape and forms an annular platform, wherein when the housingcasing covers periphery of the circuit housing, the annular flange is incontact with the annular platform.

In some embodiments, a sealant is applied in a joint region of theannular flange and the annular platform to firmly connect the housingcasing with the circuit housing.

In some embodiments, the waterproof open earphone further includes anauxiliary piece, wherein the auxiliary piece includes a board.

In some embodiments, a hollowed area is set on the board and a mountinghole is set on the main sidewall and located inside the hollowed area.

In some embodiments, the waterproof open earphone further includes aconductive column inserted into the mounting hole, wherein a glue grooveis formed at periphery of the conductive column.

In some embodiments, a notch is set in the hollowed area of theauxiliary piece and a first strip rib is integrally formed on the innersurface of the main sidewall corresponding to the notch, wherein thefirst strip rib fit and the auxiliary piece cooperate to make the gluegroove closed.

In some embodiments, the conductive column includes a columnar bodyinserted into the mounting hole and a positioning protrusion is set onan outer peripheral surface of the columnar body, wherein thepositioning protrusion is engaged with the inner surface of the mainsidewall to fix the conductive column to the mounting hole.

In some embodiments, the columnar body is divided into a first columnarbody and a second columnar body, with respect to an insertion directionof the columnar body along the mounting hole, wherein a cross section ofthe first columnar body is larger than a cross section of the secondcolumnar body. The mounting hole is divided into a first hole sectionand a second hole section corresponding to the first columnar body andthe second columnar body in cross section along the insertion directionand an annular platform is formed at a junction of the first holesection and the second hole section, wherein when the columnar body isinserted into the mounting hole, a side of the first columnar bodyfacing the second columnar body is supported on the annular platform andthe positioning protrusion is engaged with the inner surface of the mainsidewall.

In some embodiments, an accommodating cavity along an axial direction isset on the columnar body, wherein an open end of the accommodatingcavity is on an end surface of the second columnar body facing an insideof the circuit housing. The conductive column includes a spring insidethe accommodating cavity and a conductive contact point, wherein one endof the conductive contact point abuts the spring inside theaccommodating cavity and another end of the conductive contact point isexposed to the inside of the circuit housing through the open end of theaccommodating cavity. A main control circuit board is set in the circuithousing, including a contact corresponding to the conductive contactpoint of the conductive column wherein the conductive contact point iselastically pressed on the contact of the main control circuit board.

In some embodiments, the insertion direction of the conductive column isperpendicular to a main surface of the main control circuit board.

In some embodiments, the cover includes a rigid support and a coverlayer, wherein the rigid support is physically connected to theaccommodating body and the cover layer provides a seal for the cavityafter the rigid support is connected to the accommodating body.

In some embodiments, a shape of a side of the rigid support facing theaccommodating body is matched with the opening and the cover layercovers the outer surface of the rigid support away from theaccommodating body.

In some embodiments, the rigid support includes an insertion portion anda cover portion, wherein the cover portion is covered on the opening andthe insertion portion is set on a side of the cover portion and extendsinto the cavity along an inner wall of the cavity to fix the coverportion on the opening.

In some embodiments, the accommodating body includes an opening edgethat matches with the opening, the covering portion is pressed on aninner region of the opening edge close to the opening, and the coverlayer cover an outer surface of the cover portion away from theaccommodating body and is pressed on an outer region on the periphery ofthe inner region of the opening edge which achieves a sealing with theopening edge.

In some embodiments, a contact end surface of the cover portion and theopening edge and a contact end surface of the cover layer and theopening edge are flat as each other. The cover layer further extendsalong a region between the cover portion and the opening edge to aninner region of the opening edge.

In some embodiments, a switch hole corresponding to the switch is set onthe rigid support, the cover layer covers the switching hole, and apressing portion is set at a position corresponding to the switchinghole, wherein the pressing portion extends toward the inside of thecavity through the switching hole, wherein when a corresponding positionof the cover layer is pressed, the pressing portion press the switch ofthe circuit component and trigger the circuit component 130 to execute apreset function.

Additional features will be set forth in part in the description whichfollows, and in part will become apparent to those skilled in the artupon examination of the following and the accompanying drawings or maybe learned by production or operation of the examples. The features ofthe present disclosure may be realized and attained by practice or useof various aspects of the methodologies, instrumentalities, andcombinations set forth in the detailed examples discussed below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure may be further described in terms of exemplaryembodiments. The exemplary embodiments are described in detail withreference to the drawings. These embodiments are non-limiting exemplaryembodiments, in which like reference numerals represent similarstructures throughout the several views of the drawings, and wherein:

FIG. 1 is a flowchart illustrating an exemplary process that a speakerdevice generates hearing in a human ear according to some embodiments ofthe present disclosure;

FIG. 2 is a schematic diagram illustrating an open exemplary earphoneaccording to some embodiments of the present disclosure;

FIG. 3 is a schematic diagram illustrating an exemplary explodedstructure of the open earphone shown in FIG. 2 according to someembodiments of the present disclosure;

FIG. 4 is a schematic diagram illustrating exemplary two point sourcesaccording to some embodiments of the present disclosure;

FIG. 5 is a schematic diagram illustrating a variation of a soundleakage of two point sources and a single point source as a function offrequency according to some embodiments of the present disclosure;

FIGS. 6A-6B are exemplary graphs illustrating a volume of a near-fieldsound and a volume of a far-field leakage as a function of a distancebetween two point sources according to some embodiments of the presentdisclosure;

FIG. 7 is a schematic diagram illustrating an exemplary acoustic outputapparatus according to some embodiments of the present disclosure;

FIGS. 8A-8B are schematic diagrams illustrating exemplary acousticoutput apparatuses according to some embodiments of the presentdisclosure;

FIGS. 9A-9C are schematic diagrams illustrating sound output scenariosaccording to some embodiments of the present disclosure;

FIGS. 10A-10B are schematic diagrams illustrating acoustic outputapparatuses according to some embodiments of the present disclosure;

FIGS. 11A-11C are schematic diagrams illustrating acoustic routesaccording to some embodiments of the present disclosure;

FIG. 12 shows a curve of a sound leakage of an acoustic output apparatusunder the action of two sets of two point sources (a set ofhigh-frequency two point sources and a set of low-frequency two pointsources) according to some embodiments of the present disclosure;

FIG. 13 is a schematic diagram illustrating another exemplary acousticoutput apparatus according to some embodiments of the presentdisclosure;

FIG. 14 is a schematic diagram illustrating two point sources and alistening position according to some embodiments of the presentdisclosure;

FIG. 15 is a graph illustrating a variation of the volume of the soundheard by the user of two point sources with different distances as afunction of a frequency of sound according to some embodiments of thepresent disclosure;

FIG. 16 is a graph illustrating a variation of a normalized parameter ofdifferent distances between two point sources in the far field alongwith a frequency of sound according to some embodiments of the presentdisclosure;

FIG. 17 is a diagram illustrating an exemplary baffle provided betweentwo point sources according to some embodiments of the presentdisclosure;

FIG. 18 is a graph illustrating a variation of the volume of a soundheard by a user as a function of the frequency of sound when the auricleis located between two point sources according to some embodiments ofthe present disclosure;

FIG. 19 is a graph illustrating a variation of the volume of a leakedsound as a function of the frequency of sound when the auricle islocated between two point sources according to some embodiments of thepresent disclosure;

FIG. 20 is a graph illustrating a variation of a normalized parameter asa function of the frequency of sound when two point sources of anacoustic output apparatus is distributed on both sides of the auricleaccording to some embodiments of the present disclosure;

FIG. 21 is a graph illustrating a variation of a volume of sound heardby the user and a volume of leaked sound as a function of frequency withand without a baffle between two point sources according to someembodiments of the present disclosure;

FIG. 22 is a graph illustrating a variation of a volume of sound heardby the user and a volume of leaked sound as a function of distancebetween two point sources at a frequency of 300 Hz and with or without abaffle according to some embodiments of the present disclosure;

FIG. 23 is a graph illustrating a variation of a volume of sound heardby the user and a volume of leaked sound as a function of distancebetween two point sources at a frequency of 1000 Hz and with or withouta baffle according to some embodiments of the present disclosure;

FIG. 24 is a graph illustrating a variation of a volume of sound heardby the user and a volume of leaked sound as a function of distance at afrequency of 5000 Hz and with or without a baffle between the two pointsources according to some embodiments of the present disclosure;

FIGS. 25-27 are graphs illustrating a variation of a volume of soundheard by the user as a function of frequency when a distance d of twopoint sources is 1 cm, 2 cm, 3 cm, respectively, according to someembodiments of the present disclosure;

FIG. 28 is a graph illustrating a variation of a normalized parameter asa function of frequency when a distance d of two point sources is 1 cmaccording to some embodiments of the present disclosure;

FIG. 29 is a graph illustrating a variation of a normalized parameter asa function of frequency when a distance d of two point sources is 2 cmaccording to some embodiments of the present disclosure;

FIG. 30 is a graph illustrating a variation of a normalized parameter asa function of frequency when a distance d of two point sources is 4 cmaccording to some embodiments of the present disclosure;

FIG. 31 is a graph illustrating exemplary distributions of differentlistening positions according to some embodiments of the presentdisclosure;

FIG. 32 is a graph illustrating a volume of sound heard by the user froma two point sources without baffle at different listening positions in anear field as a function of frequency according to some embodiments ofthe present disclosure;

FIG. 33 is a graph illustrating a normalized parameter of two pointsources without baffle at different listening positions in a near fieldaccording to some embodiments of the present disclosure;

FIG. 34 is a graph illustrating a volume of sound heard by the user fromtwo point sources with a baffle at different listening positions in anear field as a function of frequency according to some embodiments ofthe present disclosure;

FIG. 35 is a graph illustrating a normalized parameter of two pointsources with a baffle at different listening positions in a near fieldaccording to some embodiments of the present disclosure;

FIG. 36 is a schematic diagram illustrating two point sources and abaffle according to some embodiments of the present disclosure;

FIG. 37 is a graph illustrating a variation of a volume of thenear-field sound as a function of frequency when a baffle is atdifferent positions according to some embodiments of the presentdisclosure;

FIG. 38 is a graph illustrating a variation of a volume of the far-fieldleakage as a function of frequency when a baffle is at differentpositions according to some embodiments of the present disclosure;

FIG. 39 is a graph illustrating a variation of a normalization parameteras a function of frequency when a baffle is at different positionsaccording to some embodiments of the present disclosure;

FIG. 40 is a schematic diagram illustrating another exemplary acousticoutput apparatus according to some embodiments of the presentdisclosure;

FIG. 41 is a cross-sectional structure diagram of an exemplary openearphone according to some embodiments of the present disclosure;

FIG. 42 is a schematic diagram illustrating a vocal structure of anexemplary open earphone according to some embodiments of the presentdisclosure;

FIG. 43 is a schematic cross-sectional view of an exemplary structure ofa baffle of an exemplary open earphone according to some embodiments ofthe present disclosure;

FIG. 44 is a schematic diagram illustrating an exemplary open earphoneaccording to some embodiment of the present disclosure;

FIGS. 45A and 45B are schematic graphs illustrating exemplary frequencyresponses of speaker units according to some embodiments of the presentdisclosure;

FIG. 46 is a schematic diagram illustrating an exemplary open earphoneaccording to some embodiments of the present disclosure;

FIG. 47 is a schematic diagram illustrating an exemplary structure of anear hook of the open earphone 200 shown in FIG. 3 according to someembodiments of the present disclosure;

FIG. 48 is a schematic diagram illustrating a partial cross-sectionalview of the open earphone 200 shown in FIG. 3 according to someembodiments of the present disclosure;

FIG. 49 is a schematic diagram illustrating a partially enlarged view ofpart E in FIG. 3 according to some embodiments of the presentdisclosure;

FIG. 50 is a schematic diagram illustrating an exemplary exploded viewof a circuit housing and a button structure according to someembodiments of the present disclosure;

FIG. 51 is a schematic diagram illustrating an exemplary partialcross-sectional view of a circuit housing, a button structure, and anear hook according to some embodiments of the present disclosure;

FIG. 52 is schematic diagram illustrating an exemplary partial enlargedview of part G shown in FIG. 51 according to some embodiments of thepresent disclosure;

FIG. 53 is a schematic diagram illustrating an exemplary exploded viewof a partial structure of a circuit housing and auxiliary pieceaccording to some embodiments of the present disclosure;

FIG. 54 is schematic diagram illustrating an exemplary partial structureof a circuit housing and an auxiliary piece according to someembodiments of the present disclosure;

FIG. 55 is a schematic diagram illustrating an exemplary cross-sectionalview of a circuit housing, a conductive column, and a main controlcircuit board according to some embodiments of the present disclosure;

FIG. 56 is a schematic diagram illustrating an exemplary partialenlarged view of part H in FIG. 11 according to some embodiments of thepresent disclosure;

FIG. 57 is a schematic diagram illustrating an exemplary conductivecolumn according to some embodiments of the present disclosure;

FIG. 58 is a schematic diagram illustrating an exemplary explodedstructure of an electronic component according to some embodiments ofthe present disclosure;

FIG. 59 is a schematic diagram illustrating an exemplary partialcross-sectional view of an electronic component according to someembodiments of the present disclosure;

FIG. 60 is a schematic diagram illustrating an exemplary enlarged viewof part A in FIG. 59 according to some embodiments of the presentdisclosure;

FIG. 61 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along A-A axis inFIG. 58 according to some embodiments of the present disclosure;

FIG. 62 is a schematic diagram illustrating an exemplary enlarged viewof part B in FIG. 61 according to some embodiments of the presentdisclosure;

FIG. 63 is a schematic diagram illustrating an exemplary partialcross-sectional view of an electronic component according to someembodiments of the present disclosure;

FIG. 64 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along B-B axis inFIG. 58 according to some embodiments of the present disclosure; and

FIG. 65 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along C-C axis inFIG. 58 according to some embodiments of the present disclosure.

DETAILED DESCRIPTION

In the following detailed description, numerous specific details are setforth by way of examples in order to provide a thorough understanding ofthe relevant disclosure. However, it should be apparent to those skilledin the art that the present disclosure may be practiced without suchdetails. In other instances, well-known methods, procedures, systems,components, and/or circuitry have been described at a relativelyhigh-level, without detail, in order to avoid unnecessarily obscuringaspects of the present disclosure. Various modifications to thedisclosed embodiments will be readily apparent to those skilled in theart, and the general principles defined herein may be applied to otherembodiments and applications without departing from the spirit and scopeof the present disclosure. Thus, the present disclosure is not limitedto the embodiments shown, but to be accorded the widest scope consistentwith the claims.

As used in the disclosure and the appended claims, the singular forms“a,” “an,” “an,” and “the” include plural referents unless the contentclearly dictates otherwise. In general, the terms “comprise,”“comprises,” and/or “comprising,” “include,” “includes,” and/or“including,” merely prompt to include steps and elements that have beenclearly identified, and these steps and elements do not constitute anexclusive listing, and the methods or systems may also include othersteps or elements. The term “based on” may refer to “based at least inpart on.” The term “one embodiment” may refers to “at least oneembodiment.” The term “another embodiment” may refer to “at least onefurther embodiment”. Related definitions of other terms may be describedin the description below.

It should be understood that the terms “data block”, “system”, “engine”,“unit”, “component”, “module” and/or “block” used herein are one methodto distinguish different components, elements, parts, sections, orassemblies of different levels in ascending order. However, the termsmay be displaced by other expression if they may achieve the samepurpose.

Various terms may be used to describe the spatial and functionalrelationships between elements (e.g., between layers), including“connected to,” “joined with,” “interfaced with,” and “coupled to.” Whendescribing a relationship between a first element and a second elementin the present disclosure, the relationship may include a directrelationship in which there are no other intermediate elements betweenthe first and second elements and an indirect relationship in which oneor more intermediate elements exist between the first and secondelements (in space or function), unless explicitly described as“directly”. In contrast, when an element is described as being“directly” connected to, joined with, interfaced with, or coupled toanother element, there are no intermediate elements. In addition, thespatial and functional relationships between elements may be implementedin various ways. For example, the mechanical connection between twoelements may include a solder connection, a key connection, a pinconnection, an interference fit connection, or the like, or anycombination thereof. Other words used to describe the relationshipbetween elements should be interpreted in a similar way (e.g.,“between”, “between . . . and”, “adjacent” and “directly adjacent”,etc.).

FIG. 1 is a flowchart illustrating an exemplary process that a speakerdevice generates hearing in a human ear according to some embodiments ofthe present disclosure. A speaker device may transmit sound to a humanhearing system via a bone conduction or an air conduction, therebygenerating hearing. As shown in FIG. 1, the process that the speakercauses the human ear to generate the hearing may include followingsteps.

In 101, the speaker device may acquire or generate a signal containingsound information. In some embodiments, the sound information may referto a video or audio file with a specific data format. The soundinformation may also refer to data or files which may be eventuallyconverted into sound in a specific way. In some embodiments, the signalcontaining sound information may be obtained from a storage unit of thespeaker device, an information generation system, a storage system, or atransmission system other than the speaker device. It should be notedthat the sound signals described here are not limited to electricalsignals but may include forms other than electrical signals, such asoptical signals, magnetic signals, mechanical signals, or the like. Inprinciple, as long as a signal contains information that the speakerdevice can use to generate sound, the signal may be referred to as asound signal. The sound signal may be generated by a single signalsource or a plurality of signal sources. The plurality of signal sourcesmay be related or not related to each other. In some embodiments, thetransmission of the sound signals may be in a wired or a wirelessmanner, in a real-time manner or a delayed manner. For example, togenerate a sound signal, the speaker device may receive an electricsignal containing sound information in a wired or wireless manner, orobtain data directly from a storage medium. Taking bone conductiontechnology as an example, a component with a sound collection functionmay be installed on the bone conduction speaker. By picking up sound inthe environment, the mechanical vibrations of the sound may be convertedinto an electrical signal, which is further processed by an amplifier togenerate an electrical signal that meets specific requirements. Thewired connection may include but not limited to a metal cable, anoptical cable, or a metal and optical hybrid cable, such as a coaxialcable, a communication cable, a flexible cable, a spiral cable, anon-metallic sheathed cable, a metal sheathed cable, a multi-core cable,a twisted pair cable, a ribbon cable, a shielded cable, atelecommunication cable, a twisted pair cable, a parallel twisted pairconductor, etc. The above descriptions are merely for purposes ofillustration. The medium of the wired connection for electronic signalsor optical signals may include other types of transmission carriers.

The storage device/storage unit mentioned herein may include a storagedevice on a storage system. The storage system may include a directattached storage, a network attached storage, a storage area network,etc. The storage device may include a solid-state storage device (e.g.,solid state disk, hybrid hard disk, etc.), a mechanical hard disk, a USBflash memory, a memory stick, a memory card (e.g., CF, SD, etc.), otherdrivers (e.g., CD, DVD, HD DVD, Blu-ray, etc.), a random access memory(RAM), a read-only memory (ROM), or the like, or any combinationthereof. The RAM may include a dekatron, a selectron, a delay linememory, Williams tubes, a dynamic random access memory (DRAM), a staticrandom access memory (SRAM), a thyristor random access memory (T-RAM), azero capacitor random access memory (Z-RAM), etc. The ROM may include abubble memory, a twistor memory, a film memory, a plated wire memory, amagnetic-core memory, a drum memory, a CD-ROM, a hard disk, a tape, anon-volatile random access memory (NVRAM), a phase-change memory, amagneto-resistive random access memory, a ferroelectric random accessmemory, a non-volatile SRAM, a flash memory, an electrically erasableprogrammable read-only memory, an erasable programmable read-onlymemory, a programmable read-only memory, a mask ROM, a floating gaterandom access memory, a Nano random access memory, a racetrack memory, aresistive random access memory, a programmable metallization unit, etc.The storage device/storage unit may not be limited to those mentionedabove.

In 102, the speaker device may convert a signal containing soundinformation into a vibration and generate a sound due to such vibration.The generation of vibration may be accompanied by a conversion ofenergy. The speaker device may use a specific transducer to convert thesignal to the mechanical vibration. The conversion process may includecoexistence and/or conversion of many different types of energy. Forexample, an electrical signal may be directly converted into amechanical vibration through a transducer to generate a sound. Asanother example, sound information may be contained in an opticalsignal, and a specific transducer may convert the optical signal into avibration signal. Other types of energy that may coexist and beconverted during the operation of the transducer may include thermalenergy, magnetic field energy, etc. In some embodiments, according tothe energy conversion of the transducer, the transducer may beclassified into a moving coil type, an electrostatic type, apiezoelectric type, a moving iron type, a pneumatic type, anelectromagnetic type, or the like. A frequency response range and asound quality of the speaker device may be affected by differenttransduction type and performances of various physical components in thetransducer. For example, in a dynamic coil type transducer, a weldcylindrical coil may be connected to a vibration plate, and a coildriven by a signal current may drive the vibration plate to generatesound in a magnetic field. The stretching and shrinking of the material,the deformation, size, shape and degree of fixation of the folds, themagnetic density of permanent magnets, etc. of the vibration plate maygreatly affect the final sound quality of the speaker device.

The term “sound quality” as used herein may be understood to reflect thequality of the sound, and may refer to a fidelity of an audio afterprocessing, transmission and other processes. In a sound device, thesound quality usually includes several aspects, including an intensityand amplitude of the audio, a frequency of the audio, overtone orharmonic components of the audio, etc. When assessing sound quality,there are not only measurement methods and evaluation criteria forobjectively evaluating sound quality, but also methods that evaluatevarious attributes of sound quality by combining different elements ofthe sound and subjective feelings. Therefore, the processes of soundgeneration, transmission and reception may affect the sound quality ofthe sound to a certain extent.

In 103, the sound may be transmitted through a transmission system. Insome embodiments, the transmission system may refer to a substance thattransmits vibration signals containing sound information, such as askull, a bone labyrinth, an inner ear lymph fluid, and a spiral organ ofa human and/or an animal with a hearing system. As another example, thesubstance may include a medium that transmits the sound (e.g., the air,a liquid). Taking a bone conduction speaker as an example, the boneconduction speaker may directly transmit sound waves (vibration signals)converted from electrical signals through the bone to an auditorycenter. Taking an air conduction speaker as an example, the airconduction speaker may include one or more groups of sound sources. Eachgroup of sound sources may include two sound sources for generatingsound waves with opposite phases. The air conduction speaker maytransmit two sound waves with opposite phases to the auditory centerthrough the air.

In 104, the sound information may be transmitted to a sensing terminal.Specifically, the sound information may be transmitted to the sensingterminal through the transmission system. Without loss of generality, asubject of a sensing terminal, a hearing system, a sensory organ, etc.described above may be a human or an animal with a hearing system. Itshould be noted that the following description of the use of the speakerdevice by humans may not constitute a limitation on the scenarios of theuse of the speaker device. Similar descriptions may also be applicableto other animals.

The above description of the general process of the speaker device isonly a specific example, and should not be considered as the onlyfeasible implementation. In the following, without loss of generality,“speaker device” or “speaker” may be used in the present disclosureregarding conduction related technologies. This description may be onlya form of conduction application. For those of ordinary skill in theart, “speaker device” may also be replaced by other similar terms, suchas “vocal device”, “hearing aid”, or “speaking device” and other devicesthat have a speaker function. In fact, the various implementations inthe present disclosure may be easily applied to other and non-speakerhearing devices. For example, for those skilled in the art, afterunderstanding the basic principles of the speaker device, it may bepossible to make various modifications and changes in the form anddetails of the specific way and steps of implementing the speaker devicewithout departing from the principle. In particular, an environmentalsound picking up and processing function may be added to the speakerdevice, such that the speaker device may implement the function of ahearing aid. For example, a microphone may pick up a sound around auser/wearer. The microphone may send a processed sound (or a generatedelectrical signal) to the speaker using a certain algorithm. That is,the speaker device may be modified to include the function of picking upthe sound around the user/wearer, and after a certain signal processing,the sound may be transmitted to the user/wearer through a speakermodule. As an example, the algorithm mentioned here may include noisecancellation, automatic gain control, acoustic feedback suppression,wide dynamic range compression, active environment recognition, activeanti-noise, directional processing, tinnitus processing, multi-channelwide dynamic range compression, active howling suppression, volumecontrol or the like, or any combination thereof.

The speaker device in the present disclosure may include a headphone, anMP3 player, a hearing aid, or other device with a speaker function. Whena user wears the speaker device, the speaker device may be located on atleast one side of the user's head and close to but not block the user'sear canal. Such speaker device may also be referred to as an open(binaural/uniaural) speaker device. In some embodiments, the shape ofthe speaker device may be set according to the type it is worn (e.g., anear hook type or a headband type) and specific requirements of use, andis not specifically limited herein. For example, a speaker device of theear hook type may match with the user's auricle, such that it may notfall easily when hung on the user's ear. As another example, a speakerdevice of the headband type may straddle the user's head and be fixed onthe head of the user in a manner similar to a headband. Two ends of thespeaker device may be at certain distances from the user's ears. In thefollowing specific embodiments of the present disclosure, an earphonemay be taken as an example to specifically describe the speaker device.

FIG. 2 is a schematic diagram illustrating an exemplary open earphoneaccording to some embodiments of the present disclosure. FIG. 3 is aschematic diagram illustrating an exemplary exploded structure of theopen earphone shown in FIG. 2 according to some embodiments of thepresent disclosure. As shown in FIGS. 2 and 3, the structure of the openearphone 200 may be designed such that both ear canals are not blocked,which may also be referred to as a binaural open earphone 200. The openearphone 200 may include primary components such as two ear hooks 10,two chip housings 20, two circuit housings 30, a rear hook 40, twoearphone chips (also referred to as vocal structures) 50, a controlcircuit (also referred to as a circuit board) 60, a battery (alsoreferred to as a power module) 70, etc. Each of the ear hooks 10 mayinclude a protective casing 16 and a housing casing 17 on which one ormore exposed holes 175 are set. Each of the chip housings 20 may includea socket 22. Each of the circuit housings 30 may include two mainsidewalls 33 and two auxiliary sidewalls 34. A chip housing 20 and acircuit housing 30 may be disposed at two ends of an ear hook 10,respectively. Two ends of the rear hook 40 may be connected to the twocircuit housings 30, respectively. The two chip housings 20 may be usedto accommodate the two earphone chips 50, respectively. The two circuithousings 30 may be used to accommodate the control circuit 60 and thebattery 70, respectively. When the open earphone 200 is worn, the twoear hooks 10 may correspond to the left and right ears of the user,respectively. The rear hook 40 may correspond to the back of the user'shead. The open earphone 200 may transmit sound to a human hearing systemthrough a bone conduction or an air conduction to cause the user togenerate a hearing. In some embodiments, the shape of the open earphone200 may be designed as a shape of an open earphone 4100 shown in FIG. 41or an open earphone 4600 as shown in FIG. 46, and is not limited herein.In some embodiments, the open earphone 200 may also include one or moreadditional components or one or more components shown in FIGS. 1 and 2may be omitted. Merely by way of example, the open earphone 200 mayinclude one or more buttons 4 d, a Bluetooth module, a microphone, etc.,which may be described elsewhere in the present disclosure (e.g., FIGS.41-65 and the descriptions thereof).

In some embodiments, the open earphone 200 may have an improved soundleakage prevention capability. The open earphone 200 may include anacoustic output component. The acoustic output component may include atleast two sets of acoustic drivers, e.g., a set of high-frequencyacoustic drivers and a set of low-frequency acoustic drivers. Each setof acoustic drivers may be used to generate a sound in a certainfrequency range. The sound may propagate outward through at least twosound guiding holes that are acoustically coupled to the set of acousticdrivers. A frequency division process may be performed on an audiosignal (e.g., decomposing the audio signal into a high-frequency signaland a low-frequency signal). For frequency division signals in differentfrequency bands, different distances between the sound guiding holes maybe set. For example, the distance between two sound guiding holescorresponding to the low-frequency acoustic drivers may be set to begreater than that between two sound guiding holes corresponding to thehigh-frequency acoustic drivers, which may improve the ability of theopen earphone 200 for reducing sound leakage.

In some embodiments, a baffle may be set on the acoustic outputcomponent of the open earphone 200, such that the at least two soundguiding holes may be distributed on two sides of the baffle,respectively. In some embodiments, the at least two sound guiding holesmay be distributed on two sides of the user's auricle, respectively. Inthis situation, the auricle may serve as a baffle to separate the atleast two sound guiding holes, such that propagation paths of soundstransmitted from the at least two sound guiding holes to the user's earcanal are different. By setting the baffle to make the propagation pathsof the sounds transmitted from different sound guiding holes to theuser's ear canal different, the ability of the open earphone 200 forreducing sound leakage may be improved. More descriptions regardingimproving the sound leakage prevention capability of the earphone 200may be found elsewhere in the present disclosure (e.g., FIGS. 4-45 andthe descriptions thereof).

In some embodiments, the open earphone 200 may show a good waterproofperformance. Merely by way of example, one or more buttons may be set onthe open earphone 200. An elastic pad may be set between the one or morebuttons and corresponding button holes to prevent liquid from enteringthe open earphone 200 through the button holes. More descriptionsregarding improving the waterproof performance of the open earphone 200may be found elsewhere in the present disclosure (e.g., FIGS. 46-65 andthe descriptions thereof).

FIG. 4 is a schematic diagram illustrating exemplary two point sourcesaccording to some embodiments of the present disclosure. In order tofurther explain the effect of the setting of the sound guiding holes onthe acoustic output apparatus, and considering that the sound may beconsidered as propagating outwards from the sound guiding holes, thepresent disclosure describes sound guiding holes on an acoustic outputapparatus as sound sources that output sound to outside.

Just for the convenience of description and for the purpose ofillustration, when sizes of the sound guiding holes on the acousticoutput apparatus are small, each sound guiding hole may be approximatedas a point source (or referred to as a point source or a sound source).In some embodiments, any sound guiding hole provided on the acousticoutput apparatus for outputting sound may be approximated as a singlepoint (sound) source on the acoustic output apparatus. The sound fieldpressure p generated by the single point source may satisfy Equation(1):

$\begin{matrix}{{p = {\frac{{j{\omega\rho}}_{0}}{4{\pi r}}Q_{0}{{\exp j}\left( {{\omega t} - {kr}} \right)}}},} & (1)\end{matrix}$

where ω denotes an angular frequency, ρ₀ denotes an air density, rdenotes a distance between a target point and the point source, Q₀denotes a volume velocity of the point source, and k denotes the wavenumber. It may be concluded that the magnitude of the sound fieldpressure of the point source at the target point is inverselyproportional to the distance from the target point to the point source.

It should be noted that the sound guiding holes for outputting sound aspoint sources may only serve as an explanation of the principle andeffect of the present disclosure, and may not limit the shapes and sizesof the sound guiding holes on practical applications. In someembodiments, if an area of a sound guiding hole is large enough, thesound guiding hole may also be equivalent to a planar sound source. Insome embodiments, the point source may also be realized by otherstructures, such as a vibration surface and a sound radiation surface.For those skilled in the art, without creative activities, it may beknown that sounds produced by structures such as a sound guiding hole, avibration surface, and an acoustic radiation surface may be similar to apoint source at the spatial scale discussed in the present disclosure,and may have similar sound propagation characteristics and the similarmathematical description method. Further, for those skilled in the art,without creative activities, it may be known that the acoustic effectachieved by “an acoustic driver outputting sound from at least two firstsound guiding holes” described in the present disclosure may alsoachieve the same effect by other acoustic structures, for example, “atleast two acoustic drivers each may output sound from at least oneacoustic radiation surface.” According to actual situations, otheracoustic structures may be selected for adjustment and combination, andthe same acoustic output effect may also be achieved. The principle ofspreading sound outward with structures such as planar sound sources maybe similar to that of point sources, and is not repeated here.

As mentioned above, at least two sound guiding holes corresponding to asame acoustic driver may be set on the acoustic output apparatusprovided in the specification. In this case, two point sources may beformed, which may reduce sound transmitted to the surroundingenvironment. For brevity, sound output from the acoustic outputapparatus to the surrounding environment may be referred to as afar-field leakage since it can be heard by others in the environment.The sound output from the acoustic output apparatus to the ears of theuser wearing the acoustic output apparatus may be referred to as anear-field sound since a distance between the acoustic output apparatusand the user is relatively short. In some embodiments, the sound outputfrom two sound guiding holes (i.e., two point sources) may have acertain phase difference. When the distance between the two pointsources and the phase difference of the two point sources meet a certaincondition, the acoustic output apparatus may output sounds withdifferent sound effects in the near field (for example, the position ofthe user's ear) and the far field. For example, if the phases of thepoint sources corresponding to the two sound guiding holes are opposite,that is, an absolute value of the phase difference between the two pointsources is 180 degrees, the far-field leakage may be reduced accordingto the principle of reversed phase cancellation. More details regardingan enhancement of the acoustic output apparatus by adjusting theamplitude and/or phase of each point source may be found inInternational application No. PCT/CN2019/130884, filed on Dec. 31, 2019,the entire content of which may be hereby incorporated by reference.

As shown in FIG. 5, a sound field pressure p generated by two pointsources may satisfy Equation (2):

$\begin{matrix}{{p = {{\frac{A_{1}}{r_{1}}{{\exp j}\left( {{\omega t} - {kr_{1}} + \varphi_{1}} \right)}} + {\frac{A_{2}}{r_{2}}{{\exp j}\left( {{\omega t} - {kr_{2}} + \varphi_{2}} \right)}}}},} & (2)\end{matrix}$where A₁ and A₂ denote intensities of the two point sources, and φ₁ andφ₂ denote phases of the two point sources, respectively, d denotes adistance between the two point sources, and r₁ and r₂ may satisfyEquation (3):

$\begin{matrix}\left\{ {\begin{matrix}{r_{1} = \sqrt{r^{2} + \left( \frac{d}{2} \right)^{2} - {2*r*\frac{d}{2}*{cos\theta}}}} \\{r_{2} = \sqrt{r^{2} + \left( \frac{d}{2} \right)^{2} + {2*r*\frac{d}{2}*{cos\theta}}}}\end{matrix},} \right. & (3)\end{matrix}$where r denotes a distance between a target point and the center of thetwo point sources in the space, and θ indicates an angle between a lineconnecting the target point and the center of the two point sources andthe line on which the two point sources are located.

It may be concluded from Equation (3) that a magnitude of the soundpressure p at the target point in the sound field may relate to theintensity of each point source, the distance d, the phase of each pointsource, and the distance r.

Two point sources with different output effects may be achieved bydifferent settings of sound guiding holes, such that the volume of thenear-field sound may be improved, and the far-field leakage may bereduced. For example, an acoustic driver may include a vibrationdiaphragm. When the vibration diaphragm vibrates, sounds may betransmitted from the front and rear sides of the vibration diaphragm,respectively. The front side of the vibration diaphragm in the acousticoutput apparatus may be provided with a front chamber for transmittingsound. The front chamber may be acoustically coupled with a soundguiding hole. The sound on the front side of the vibration diaphragm maybe transmitted to the sound guiding hole through the front chamber andfurther transmitted outwards. The rear side of the vibration diaphragmin the acoustic output apparatus may be provided with a rear chamber fortransmitting sound. The rear chamber may be acoustically coupled withanother sound guiding hole. The sound on the rear side of the vibrationdiaphragm may be transmitted to the sound guiding hole through the rearchamber and propagate further outwards. It should be noted that, whenthe vibration diaphragm is vibrating, the front side and the rear sideof the vibration diaphragm may generate sounds with opposite phases. Insome embodiments, the structures of the front chamber and rear chambermay be specially set so that the sound output by the acoustic driver atdifferent sound guiding holes may meet a specific condition. Forexample, lengths of the front chamber and rear chamber may be speciallydesigned such that sounds with a specific phase relationship (e.g.,opposite phases) may be output at the two sound guiding holes. As aresult, a problem that the acoustic output apparatus has a low volume inthe near-field and a sound leakage in the far-field may be effectivelyresolved.

Under certain conditions, compared to the volume of a far-field leakageof a single point source, the volume of a far-field leakage of two pointsources may increase with the frequency. In other words, the leakagereduction capability of the two point sources in the far field maydecrease when the frequency increases. For further description, a curveillustrating a relationship between a far-field leakage and a frequencymay be described in connection with FIG. 5.

FIG. 5 is a schematic diagram illustrating a variation of a soundleakage of two point sources and a single point source as a function offrequency according to some embodiments of the present disclosure. Thedistance between the two point sources in FIG. 5 may be fixed, and thetwo point sources may have a substantially same amplitude and oppositephases. The dotted line may indicate a variation curve of a volume of aleaked sound of the single point source at different frequencies. Thesolid line may indicate a variation curve of a volume of a leaked soundof the two point sources at different frequencies. The abscissa of thediagram may represent the sound frequency (f), and the unit may be Hertz(Hz). The ordinate of the diagram may use a normalization parameter a toevaluate the volume of a leaked sound. The parameter a may be determinedaccording to Equation (4):

$\begin{matrix}{{\alpha = \frac{\left| P_{far} \right|^{2}}{\left| P_{ear} \right|^{2}}},} & (4)\end{matrix}$where P_(far) represents the sound pressure of the acoustic outputapparatus in the far-field (i.e., the sound pressure of the far-fieldsound leakage). P_(ear) represents the sound pressure around the user'sears (i.e., the sound pressure of the near-field sound). The larger thevalue of α is, the larger the far-field leakage relative to thenear-field sound heard will be, indicating that a worse capability ofthe acoustic output apparatus for reducing the far-field leakage.

As shown in FIG. 5, when the frequency is below 6000 Hz, the far-fieldleakage produced by the two point sources may be less than the far-fieldleakage produced by the single point source, and may increase as thefrequency increases. When the frequency is dose to 10000 Hz (forexample, about 8000 Hz or above), the far-field leakage produced by thetwo point sources may be greater than the far-field leakage produced bythe single point source. In some embodiments, a frequency correspondingto an intersection of the variation curves of the two point sources andthe single point source may be determined as an upper limit frequencythat the two point sources are capable of reducing a sound leakage.

For illustrative purposes, when the frequency is relatively small (forexample, in a range of 100 Hz˜1000 Hz), the capability of reducing asound leakage of the two point sources may be strong (e.g., the value ofa is small, such as below −80 dB). In such a frequency band, an increaseof the volume of the sound heard by the user may be determined as anoptimization goal. When the frequency is larger (for example, in a rangeof 1000 Hz˜8000 Hz), the capability of reducing a sound leakage of thetwo point sources may be weak (e.g., above −80 dB). In such a frequencyband, a decrease of the sound leakage may be determined as theoptimization goal.

According to FIG. 5, it may be possible to determine a frequencydivision point based on the variation tendency of the two point sources'capability of reducing a sound leakage. Parameters of the two pointsources may be adjusted according to the frequency division point so asto reduce the sound leakage of the acoustic output apparatus. Forexample, the frequency corresponding to α of a specific value (forexample, −60 dB, −70 dB, −80 dB, −90 dB, etc.) may be used as thefrequency division point. Parameters of the two point sources may bedetermined to improve the near-field sound in a frequency band below thefrequency division point, and/or to reduce the far-field sound leakagein a frequency band above the frequency division point. In someembodiments, a high-frequency band with a high frequency (for example, asound output from a high-frequency acoustic driver) and a low-frequencyband with a low frequency (for example, a sound output from alow-frequency acoustic driver) may be determined based on the frequencydivision point. More details of the frequency division point may bedisclosed elsewhere in the present disclosure, for example, FIG. 7 andthe descriptions thereof.

In some embodiments, the method for measuring and determining the soundleakage may be adjusted according to the actual conditions. For example,a plurality of points on a spherical surface centered by s center pointof the two point sources with a radius of r (for example, 40 centimeter)may be identified, and an average value of amplitudes of the soundpressure at the plurality of points may be determined as the value ofthe sound leakage. The distance between the near-field listeningposition and the point sources may be far less than the distance betweenthe point sources and the spherical surface for measuring the far-fieldleakage. Optionally, the ratio of the distance from the near-fieldlistening position to the center of the two point sources to the radiusr may be less than 0.3, 0.2, 0.15, or 0.1. As another example, one ormore points of the far-field may be taken as the position for measuringthe sound leakage, and the sound volume of the position may be taken asthe value of the sound leakage. As another example, a center of the twopoint sources may be used as a center of a circle at the far field, andsound pressure amplitudes of two or more points evenly distributed atthe circle according to a certain spatial angle may be averaged as thevalue of the sound leakage. These methods may be adjusted by thoseskilled in the art according to actual conditions, and are not intendedto be limiting.

According to FIG. 5, it may be concluded that in the high-frequency band(a higher frequency band determined according to the frequency divisionpoint), the two point sources may have a weak capability to reduce asound leakage. In the low-frequency band (a lower frequency banddetermined according to the frequency division point), the two pointsources may have a strong capability to reduce a sound leakage. At acertain sound frequency, if the distance between the two point sourceschanges, its capability to reduce a sound leakage may be changed, andthe difference between volume of the sound heard by the user (alsoreferred to as “heard sound”) and volume of the leaked sound may also bechanged. For a better description, the curve of a far-field leakage as afunction of the distance between the two point sources may be describedwith reference to FIGS. 6A and 6B.

FIGS. 6A and 6B are exemplary graphs illustrating a volume of anear-field sound and a volume of a far-field leakage as a function of adistance between two point sources according to some embodiments of thepresent disclosure. FIG. 6B may be generated by performing anormalization on the graph in FIG. 6A.

In FIG. 6A, a solid line may represent a variation curve of the volumeof the two point sources as a function of the distance between the twopoint sources, and the dotted line may represent a variation curve ofthe volume of the leaked sound of the two point sources as a function ofthe distance between the two point sources. The abscissa may represent adistance ratio d/d0 of the distance d of the two point sources to areference distance d0. The ordinate may represent a sound volume (theunit is decibel dB). The distance ratio d/d0 may reflect a variation ofthe distance between the two point sources. In some embodiments, thereference distance d0 may be selected within a specific range. Forexample, d0 may be a specific value in the range of 2.5 mm˜10 mm, e.g.,d0 may be 5 mm. In some embodiments, the reference distance d0 may bedetermined based on a listening position. For example, the distancebetween the listening position to the nearest point source may be takenas the reference distance d0. It should be known that the referencedistance d0 may be flexibly selected from any other suitable valuesaccording to the actual conditions, which is not limited here. Merely byway of example, in FIG. 6A, d0 may be 5 mm.

When the sound frequency is a constant, the volume of the sound heard bythe user and volume of the leaked sound of the two point sources mayincrease as the distance between the two point sources increases. Whenthe distance ratio d/d0 of is less than a threshold ratio, an increase(or increment) in the volume of the sound heard by the user may belarger than an increase (or increment) in the volume of the leaked soundas the distance between two point sources increases. That is to say, theincrease in volume of the sound heard by the user may be moresignificant than the increase in volume of the leaked sound. Forexample, as shown in FIG. 6A, when the distance ratio d/d0 is 2, thedifference between the volume of the sound heard by the user and thevolume of the leaked sound may be about 20 dB. When the distance ratiod/d0 is 4, the difference between the volume of the sound heard by theuser and the volume of the leaked sound may be about 25 dB. In someembodiments, when the distance ratio d/d0 reaches the threshold ratio,the ratio of the volume of the sound heard by the user to the volume ofthe leaked sound of the two point sources may reach a maximum value. Atthis time, as the distance of the two point sources further increases,the curve of the volume of the sound heard by the user and the curve ofthe volume of the leaked sound may gradually go parallel, that is, theincrease in volume of the sound heard by the user and the increase involume of the leaked sound may remain substantially the same. Forexample, as shown in FIG. 6B, when the distance ratio d/d0 is 5, 6, or7, the difference between the volume of the sound heard by the user andthe volume of the leaked sound may remain substantially the same, bothof which may be about 25 dB. That is, the increase in volume of thesound heard by the user may be the same as the increase in volume of theleaked sound. In some embodiments, the threshold ratio of the distanceratio d/d0 of the two point sources may be in the range of 0˜7. Forexample, the threshold ratio of d/d0 may be set in the range of 0.5˜4.5.As another example, the threshold ratio of d/d0 may be set in the rangeof 1˜4.

In some embodiments, the threshold ratio value may be determined basedon the variation of the difference between the volume of the sound heardby the user and the volume of the leaked sound of the two point sourcesof FIG. 6A. For example, the ratio corresponding to the maximumdifference between the volume of the sound heard by the user and thevolume of the leaked sound may be determined as the threshold ratio. Asshown in FIG. 6B, when the distance ratio d/d0 is less than thethreshold ratio (e.g., 4), a curve of a normalized sound heard by theuser (also referred to as “normalized heard sound”) may show an upwardtrend (the slope of the curve being larger than 0) as the distancebetween the two point sources increases. That is, the increase in soundheard by the user volume may be greater than the increase in volume ofthe leaked sound. When the distance ratio d/d0 is greater than thethreshold ratio, the slope of the curve of the normalized sound heard bythe user may gradually approach 0 as the distance between the two pointsources increases. That is to say, the increase in volume of the soundheard by the user may be no longer greater than the increase in volumeof the leaked sound as the distance between the two point sourcesincreases.

According to the descriptions above, if the listening position is fixed,the parameters of the two point sources may be adjusted by certainmeans. It may be possible to achieve an effect that the volume of thenear-field sound has a significant increase while the volume of thefar-field leakage only increases slightly (i.e., the increase in thevolume of the near-field sound being greater than the volume of thefar-field leakage). For example, two or more sets of two point sources(such as a set of high-frequency two point sources and a set oflow-frequency two point sources) may be used. For each set, the distancebetween the point sources in the set is adjusted by a certain means, sothat the distance between the high-frequency two point sources may beless than the distance between the low-frequency two point sources. Thelow-frequency two point sources may have a small sound leakage (thecapability to reduce the sound leakage is strong), and thehigh-frequency two point sources have a large sound leakage (thecapability to reduce the sound leakage is weak). The volume of the soundheard by the user may be significantly larger than the volume of theleaked sound if a smaller distance between the two point sources is setin the high-frequency band, thereby reducing the sound leakage.

In some embodiments, each acoustic driver may have a corresponding pairof sound guiding holes. The distance between the sound guiding holescorresponding to each acoustic driver may affect the volume of thenear-field sound transmitted to the user's ears and the volume of thefar-field leakage transmitted to the environment. In some embodiments,if the distance between the sound guiding holes corresponding to ahigh-frequency acoustic driver is less than that between the soundguiding holes corresponding to a low-frequency acoustic driver, thevolume of the sound heard by the user may be increased and the soundleakage may be reduced, thereby preventing the sound from being heard byothers near the user of the acoustic output apparatus. According to theabove descriptions, the acoustic output apparatus may be effectivelyused as an open earphone even in a relatively quiet environment.

FIG. 7 is a schematic diagram illustrating an exemplary acoustic outputapparatus according to some embodiments of the present disclosure. Asshown in FIG. 7, the acoustic output apparatus 700 may include anelectronic frequency division module 710, an acoustic driver 740, anacoustic driver 750, an acoustic route 745, an acoustic route 755, atleast two first sound guiding holes 747, and at least two second soundguiding holes 757. In some embodiments, the acoustic output apparatus700 may further include a controller. The electronic frequency divisionmodule 710 may be part of the controller and configured to generateelectrical signals that are input into different acoustic drivers. Theconnection between different components in the acoustic output apparatus700 may be wired and/or wireless. For example, the electronic frequencydivision module 710 may send signals to the acoustic driver 740 and/orthe acoustic driver 750 through a wired transmission or a wirelesstransmission.

The electronic frequency division module 710 may divide the frequency ofa source signal. The source signal may come from one or more soundsource apparatus (for example, a memory storing audio data). The soundsource apparatus may be part of the acoustic output apparatus 700 or anindependent device. The source signal may be an audio signal that isreceived by the acoustic output apparatus 700 via a wired or wirelessmeans. In some embodiments, the electronic frequency division module 710may decompose the source signal into two or more frequency-dividedsignals having different frequencies. For example, the electronicfrequency division module 710 may decompose the source signal into afirst frequency-divided signal (or frequency-divided signal 1) having ahigh-frequency sound and a second frequency-divided signal (orfrequency-divided signal 2) having a low-frequency sound. For brevity, afrequency-divided signal having the high-frequency sound may be referredto as a high-frequency signal, and a frequency-divided signal having thelow-frequency sound may be referred to as a low-frequency signal.

For the purposes of description, a low-frequency signal described in thepresent disclosure may refer to a sound signal with a frequency in afirst frequency range (or referred to as a low-frequency range). Ahigh-frequency signal may refer to a sound signal with a frequency in asecond frequency range (or referred to as a high-frequency range). Thefirst frequency range and the second frequency range may or may notinclude overlapping frequency ranges. The second frequency range mayinclude frequencies higher than the first frequency range. Merely by wayof example, the first frequency range may include frequencies below afirst threshold frequency. The second frequency range may includefrequencies above a second threshold frequency. The first thresholdfrequency may be lower than the second threshold frequency, or equal tothe second threshold frequency, or higher than the second thresholdfrequency. For example, the first threshold frequency may be lower thanthe second threshold frequency (for example, the first thresholdfrequency may be 600 Hz and the second threshold frequency may be 700Hz), which means that there is no overlap between the first frequencyrange and the second frequency range. As another example, the firstthreshold frequency may be equal to the second frequency (for example,both the first threshold frequency and the second threshold frequencymay be 650 Hz or any other frequency values). As another example, thefirst threshold frequency may be higher than the second thresholdfrequency, which indicates that there is an overlap between the firstfrequency range and the second frequency range. In such cases, in someembodiments, the difference between the first threshold frequency andthe second threshold frequency may not exceed a third thresholdfrequency. The third threshold frequency may be a fixed value, forexample, 20 Hz, 50 Hz, 100 Hz, 150 Hz, or 200 Hz. Optionally, the thirdthreshold frequency may be a value related to the first thresholdfrequency and/or the second threshold frequency (for example, 5% 10%15%, etc., of the first threshold frequency). Alternatively, the thirdthreshold frequency may be a value flexibly set by the user according tothe actual needs, which may be not limited herein. It should be notedthat the first threshold frequency and the second threshold frequencymay be flexibly set according to different situations, and are notlimited herein.

In some embodiments, the electronic frequency division module 710 mayinclude a frequency divider 715, a signal processor 720, and a signalprocessor 730. The frequency divider 715 may be used to decompose thesource signal into two or more frequency-divided signals containingdifferent frequency components, for example, a frequency-divided signal1 having a high-frequency sound component and a frequency-divided signal2 having a low-frequency sound component. In some embodiments, thefrequency divider 715 may be any electronic device that may implementthe signal decomposition function, including but not limited to one of apassive filter, an active filter, an analog filter, a digital filter, orany combination thereof. In some embodiments, the frequency divider 715may divide the source signal based on one or more frequency divisionpoints. A frequency division point may refer to a specific frequencydistinguishing the first frequency range and the second frequency range.For example, when there is an overlapping frequency range between thefirst frequency range and the second frequency range, the frequencydivision point may be a feature point within the overlapping frequencyrange (for example, a low-frequency boundary point, a high-frequencyboundary point, a center frequency point, etc., of the overlappingfrequency range). In some embodiments, the frequency division point maybe determined according to a relationship between the frequency and thesound leakage of the acoustic output apparatus (for example, the curvesshown in FIGS. 5, 6A, and 6B). For example, considering that the soundleakage of the acoustic output apparatus changes with the frequency, afrequency point corresponding to the volume of the leaked soundsatisfying a certain condition may be selected as the frequency divisionpoint, for example, 1000 Hz shown in FIG. 5. In some alternativeembodiments, the user may specify a specific frequency as the frequencydivision point directly. For example, considering that the frequencyrange of sounds that the human ear may hear is 20 Hz-20 kHz, the usermay select a frequency point in this range as the frequency divisionpoint. For example, the frequency division point may be 600 Hz, 800 Hz,1000 Hz, 1200 Hz, or the like. In some embodiments, the frequencydivision point may be determined based on the performance of theacoustic drivers 740 and 750. For example, considering that alow-frequency acoustic driver and a high-frequency acoustic driver havedifferent frequency response curves, the frequency division point may beselected within a frequency range. The frequency range may be above ½ ofthe upper limiting frequency of the low-frequency acoustic driver andbelow 2 times of the lower limiting frequency of the high-frequencyacoustic driver. In some embodiments, the frequency division point maybe selected in a frequency range above ⅓ of the upper limiting frequencyof the low-frequency acoustic driver and below 1.5 times of the lowerlimiting frequency of the high-frequency acoustic driver. In someembodiments, in the overlapping frequency range, the positionalrelationship between point sources may also affect the volume of thesound produced by the acoustic output apparatus in the near field andthe far field. More details may be found in International applicationNo. PCT/CN2019/130886, filed on Dec. 31, 2019, the entire contents ofwhich are hereby incorporated by reference.

The signal processor 720 and the signal processor 730 may furtherprocess a frequency-divided signal to meet the requirements of soundoutput. In some embodiments, the signal processor 720 and/or the signalprocessor 730 may include one or more signal processing components. Forexample, the signal processing components(s) may include, but notlimited to, an amplifier, an amplitude modulator, a phase modulator, adelayer, a dynamic gain controller, or the like, or any combinationthereof. Merely by way of example, the processing of a sound signal bythe signal processor 720 and/or the signal processor 730 may includeadjusting the amplitude of a portion of the sound signal that has aspecific frequency. In some embodiments, if the first frequency rangeand the second frequency range overlap, the signal processors 720 and730 may adjust the intensity of a portion of a sound signal that has thefrequency in the overlapping frequency range (for example, reduce theamplitude of the portion that has the frequency in the overlappingfrequency range). This may avoid that in a final sound outputted byacoustic output apparatus, the portion that corresponds to theoverlapping frequency range may have an excessive volume caused by thesuperposition of multiple sound signals.

After being processed by the signal processors 720 or 730, thefrequency-divided signals 1 and 2 may be transmitted to the acousticdrivers 740 and 750, respectively. In some embodiments, the processedfrequency-divided signal transmitted into the acoustic driver 740 may bea sound signal having a lower frequency range (e.g., the first frequencyrange). Therefore, the acoustic driver 740 may also be referred to as alow-frequency acoustic driver. The processed frequency-dividedtransmitted into the acoustic driver 750 may be a sound signal having ahigher frequency range (e.g., the second frequency range). Therefore,the acoustic driver 750 may also be referred to as a high-frequencyacoustic driver. The acoustic driver 740 and the acoustic driver 850 mayconvert sound signals into a low-frequency sound and a high-frequencysound, respectively, then propagate the converted signals outwards.

In some embodiments, the acoustic driver 740 may be acoustically coupledto at least two first sound guiding holes. For example, the acousticdriver 740 may be acoustically coupled to the two first sound guidingholes 747 via two acoustic routes 745. The acoustic driver 740 maypropagate sound through the at least two first sound guiding holes 747.The acoustic driver 750 may be acoustically coupled to at least twosecond sound guiding holes. For example, the acoustic driver 750 may beacoustically coupled to the two second sound guiding holes 757 via twoacoustic routes 755. The acoustic driver 750 may propagate sound throughthe at least two second sound guiding holes 757. A sound guiding holemay be a small hole formed on the acoustic output apparatus with aspecific opening and allows sound to pass. The shape of a sound guidinghole may include but not limited to a circle shape, an oval shape, asquare shape, a trapezoid shape, a rounded quadrangle shape, a triangleshape, an irregular shape, or the like, or any combination thereof. Inaddition, the number of the sound guiding holes connected to theacoustic driver 840 or 850 may not be limited to two, which may be anarbitrary value instead, for example, three, four, six, or the like.

In some embodiments, in order to reduce the far-field leakage of theacoustic output apparatus 700, the acoustic driver 740 may be used tooutput low-frequency sounds with the same (or approximately the same)amplitude and opposite (or approximately opposite) phases via the atleast two first sound guiding holes. The acoustic driver 750 may be usedto output high-frequency sounds with the same (or approximately thesame) amplitude and opposite (or approximately opposite) phases via theat least two second sound guiding holes. In this way, the far-fieldleakage of low-frequency sounds (or high-frequency sounds) may bereduced according to the principle of acoustic interferencecancellation.

According to FIGS. 5, 6A and 6B, considering that the wavelength of alow-frequency sound is longer than that of a high-frequency sound, andin order to reduce the interference cancellation of the sound in thenear field (for example, near the user's ear), the distance between thefirst sound guiding holes and the distance between the second soundguiding holes may have different values. For example, assuming thatthere is a first distance between the two first sound guiding holes anda second distance between the two second sound guiding holes, the firstdistance may be longer than the second distance. In some embodiments,the first distance and the second distance may be arbitrary values.Merely by way of example, the first distance may not be longer than 40mm, for example, in the range of 20 mm-40 mm. The second distance maynot be longer than 12 mm, and the first distance may be longer than thesecond distance. In some embodiments, the first distance may not beshorter than 12 mm. The second distance may be shorter than 7 mm, forexample, in the range of 3 mm-7 mm. In some embodiments, the firstdistance may be 30 mm, and the second distance may be 5 mm. As anotherexample, the first distance may be at least twice longer than the seconddistance. In some embodiments, the first distance may be at least threetimes longer than the second distance. In some embodiments, the firstdistance may be at least 5 times longer than the second distance.

As shown in FIG. 7, the acoustic driver 740 may include a transducer743. The transducer 743 may transmit a sound to the first sound guidinghole(s) 747 through the acoustic route 745. The acoustic driver 750 mayinclude a transducer 753. The transducer 753 may transmit a sound to thesecond sound guiding hole(s) 757 through the acoustic route 755. In someembodiments, the transducer may include, but not limited to, atransducer of a gas-conducting acoustic output apparatus, a transducerof a bone-conducted acoustic output apparatus, a hydroacoustictransducer, an ultrasonic transducer, or the like, or any combinationthereof. In some embodiments, the transducer may be of a moving coiltype, a moving iron type, a piezoelectric type, an electrostatic type,or a magneto strictive type, or the like, or any combination thereof.

In some embodiments, the acoustic drivers (such as the low-frequencyacoustic driver 740, the high-frequency acoustic driver 750) may includetransducers with different properties or different counts oftransducers. For example, each of the low-frequency acoustic driver 740and the high-frequency acoustic driver 750 may include a transducer, andthe transducers of the frequency acoustic driver 740 and thehigh-frequency acoustic driver 750 may have different frequency responsecharacteristics (such as a low-frequency speaker unit and ahigh-frequency speaker unit). As another example, the low-frequencyacoustic driver 740 may include two transducers 743 (such as twolow-frequency speaker units), and the high-frequency acoustic driver 750may include two transducers 853 (such as two high-frequency speakerunits).

In some embodiments, the acoustic output apparatus 700 may generatesounds with different frequency ranges by other means, for example, atransducer frequency division, an acoustic route frequency division, orthe like. When the acoustic output apparatus 700 uses a transducer or anacoustic route to divide a sound, the electronic frequency divisionmodule 810 (e.g., the part inside the dotted frame in FIG. 7) may beomitted. The source signal may be input to the acoustic driver 740 andthe acoustic driver 750, respectively.

In some embodiments, the acoustic output apparatus 700 may use aplurality of transducers to achieve signal frequency division. Forexample, the acoustic driver 740 and the acoustic driver 750 may convertthe inputted source signal into a low-frequency signal and ahigh-frequency signal, respectively. Specifically, through thetransducer 743 (such as a low-frequency speaker), the low-frequencyacoustic driver 740 may convert the source signal into the low-frequencysound having a low-frequency component. The low-frequency sound may betransmitted to at least two first sound guiding holes 747 along at leasttwo different acoustic routes 745. Then the low-frequency sound may bepropagated outwards through the first sound guiding holes 747. Throughthe transducer 753 (such as a high-frequency speaker), thehigh-frequency acoustic driver 750 may convert the source signal intothe high-frequency sound having a high-frequency component. Thehigh-frequency sound may be transmitted to at least two second soundguiding holes 757 along at least two different acoustic routes 755. Thenthe high-frequency sound may be propagated outwards through the secondsound guiding holes 757.

In some alternative embodiments, an acoustic route (e.g., the acousticroutes 745 and the acoustic routes 755) connecting a transducer and asound guiding hole may affect the nature of the transmitted sound. Forexample, an acoustic route may attenuate or change the phase of thetransmitted sound to some extent. In some embodiments, the acousticroute may include a sound tube, a sound cavity, a resonance cavity, asound hole, a sound slit, a tuning net, or the like, or any combinationthereof. In some embodiments, the acoustic route may include an acousticresistance material, which may have a specific acoustic impedance. Forexample, the acoustic impedance may be in the range of 5 MKS Rayleigh to500 MKS Rayleigh. Exemplary acoustic resistance materials may includebut not limited to plastic, textile, metal, permeable material, wovenmaterial, screen material or mesh material, porous material, particulatematerial, polymer material, or the like, or any combination thereof. Bysetting acoustic routes of different acoustic impedances, the soundsoutput of different transducers may be acoustically filtered. In thiscase, the sounds output through different acoustic routes have differentfrequency components.

In some embodiments, the acoustic output apparatus 700 may utilize aplurality of acoustic routes to achieve signal frequency division.Specifically, the source signal may be inputted into a specific acousticdriver and converted into a sound including high and low-frequencycomponents. The sound may be propagated along an acoustic route having aspecific frequency selection characteristic. For example, the sound maybe propagated along an acoustic route with a low-pass characteristic toa corresponding sound guiding hole to output a low-frequency sound. Inthis process, the high-frequency component of the sound may be absorbedor attenuated by the acoustic route with a low-pass characteristic.Similarly, the sound signal may propagate along an acoustic route with ahigh-pass characteristic to the corresponding sound guiding hole tooutput a high-frequency sound. In this process, the low-frequencycomponent of the sound may be absorbed or attenuated by the acousticroute with the high-pass characteristic.

In some embodiments, the controller in the acoustic output apparatus 700may cause the low-frequency acoustic driver 740 to output a sound in thefirst frequency range (i.e., a low-frequency sound), and cause thehigh-frequency acoustic driver 750 to output a sound in the secondfrequency range (i.e., a high-frequency sound). In some embodiments, theacoustic output apparatus 700 may also include a supporting structure.The supporting structure may be used to carry an acoustic driver (suchas the high-frequency acoustic driver 750, the low-frequency acousticdriver 740), so that the acoustic driver may be positioned away from theuser's ear. In some embodiments, the sound guiding hole(s) acousticallycoupled with the high-frequency acoustic driver 850 may be locatedcloser to an expected position of the user's ears (for example, theentrance of an ear canal), while the sound guiding hole(s) acousticallycoupled with the low-frequency acoustic driver 740 may be locatedfurther away from the expected position. In some embodiments, thesupporting structure may be used to package the acoustic driver. Forexample, the supporting structure may include a housing made of variousmaterials such as plastic, metal, and cloth. The housing may encapsulatethe acoustic driver and form a front chamber and a rear chambercorresponding to the acoustic driver. The front chamber may beacoustically coupled to one of the at least two sound guiding holescorresponding to the acoustic driver. The rear chamber may beacoustically coupled to the other of the at least two sound guidingholes corresponding to the acoustic driver. For example, the frontchamber of the low-frequency acoustic driver 740 may be acousticallycoupled to one of the at least two first sound guiding holes 747. Therear chamber of the low-frequency acoustic driver 740 may beacoustically coupled to the other of the at least two first soundguiding holes 747. The front chamber of the high-frequency acousticdriver 750 may be acoustically coupled to one of the at least two secondsound guiding holes 757. The rear chamber of the high-frequency acousticdriver 750 may be acoustically coupled to the other of the at least twosecond sound guiding holes 757. In some embodiments, a sound guidinghole (such as the first sound guiding hole(s) 747 and the second soundguiding hole(s) 757) may be disposed on the housing.

The above description of the acoustic output apparatus 700 may be merelyprovided by way of example. Those skilled in the art may makeadjustments and changes to the structure, quantity, etc., of theacoustic driver, which is not limiting in the present disclosure. Insome embodiments, the acoustic output apparatus 700 may include anynumber of the acoustic drivers. For example, the acoustic outputapparatus 700 may include two groups of the high-frequency acousticdrivers 750 and two groups of the low-frequency acoustic drivers 740, orone group of the high-frequency acoustic drives 750 and two groups ofthe low-frequency acoustic drivers 740, and thesehigh-frequency/low-frequency drivers may be used to generate a sound ina specific frequency range, respectively. As another example, theacoustic driver 740 and/or the acoustic driver 750 may include anadditional signal processor. The signal processor may have the samestructural component as or different structural component from thesignal processor 720 or 730.

It should be noted that the acoustic output apparatus and its modulesshown in FIG. 7 may be implemented in various ways. For example, in someembodiments, the system and the modules may be implemented by hardware,software, or a combination of both. The hardware may be implemented by adedicated logic. The software may be stored in a storage which may beexecuted by a suitable instruction execution system, for example, amicroprocessor or a dedicated design hardware. It will be appreciated bythose skilled in the art that the above methods and systems may beimplemented by computer-executable instructions and/or embedded incontrol codes of a processor. For example, the control codes may beprovided by a medium such as a disk, a CD or a DVD-ROM, a programmablememory device, such as read-only memory (e.g., firmware), or a datacarrier such as an optical or electric signal carrier. The system andthe modules in the present disclosure may be implemented not only by ahardware circuit in a programmable hardware device in an ultra largescale integrated circuit, a gate array chip, a semiconductor such alogic chip or a transistor, a field programmable gate array, or aprogrammable logic device. The system and the modules in the presentdisclosure may also be implemented by a software to be performed byvarious processors, and further also by a combination of hardware andsoftware (e.g., firmware).

It should be noted that the above description of the acoustic outputapparatus 700 and its components is only for convenience of description,and not intended to limit the scope of the present disclosure. It may beunderstood that, for those skilled in the art, after understanding theprinciple of the apparatus, it is possible to combine each unit or forma substructure to connect with other units arbitrarily without departingfrom this principle. For example, the electronic frequency divisionmodule 710 may be omitted, and the frequency division of the sourcesignal may be implemented by the internal structure of the low-frequencyacoustic driver 740 and/or the high-frequency acoustic driver 750. Asanother example, the signal processor 720 or 730 may be a partindependent of the electronic frequency division module 710. Thosemodifications may fall within the scope of the present disclosure.

FIGS. 8A and 8B are schematic diagrams illustrating exemplary acousticoutput apparatuses according to some embodiments of the presentdisclosure. For the purpose of illustration, sounds outputted bydifferent sound guiding holes coupled with a same transducer may bedescribed as an example. In FIGS. 8A and 8B, each transducer may have afront side and a rear side, and a front chamber and a rear chamber mayexist on the front and rear side of the transducer, respectively. Insome embodiments, these structures may have the same or approximatelythe same equivalent acoustic impedance, such that the transducer may beloaded symmetrically. The symmetrical load of the transducer may formsound sources satisfying an amplitude and phase relationship atdifferent sound guiding holes (such as the “two point sources” having asame amplitude and opposite phases as described above), such that aspecific sound field may be formed in the high-frequency range and/orthe low-frequency range (for example, the near-field sound may beenhanced and the far-field leakage may be suppressed).

As shown in FIGS. 8A and 8B, an acoustic driver (for example, theacoustic driver 810 or 820) may include transducers, and acoustic routesand sound guiding holes connected to the transducers. In order todescribe an actual application scenario of the acoustic output apparatusmore clearly, a position of a user's ear E is shown in FIGS. 8A and 8Bfor explanation. FIG. 8A illustrates an application scenario of theacoustic driver 810. The acoustic driver 810 may include a transducer843 (or referred to as a low-frequency acoustic driver), and thetransducer 843 may be coupled with two first sound guiding holes 847through an acoustic route 845. FIG. 8B illustrates an applicationscenario of the acoustic driver 820. The acoustic driver 920 may includea transducer 853 (or referred to as a high-frequency acoustic driver),and the transducer 853 may be coupled with two second sound guidingholes 857 through an acoustic route 855.

The transducer 843 or 853 may vibrate under the driving of an electricsignal, and the vibration may generate sounds with equal amplitudes andopposite phases (180 degrees inversion). The type of the transducer mayinclude, but not limited to, an air conduction speaker, a boneconduction speaker, a hydroacoustic transducer, an ultrasonictransducer, or the like, or any combination thereof. The transducer maybe of a moving coil type, a moving iron type, a piezoelectric type, anelectrostatic type, a magneto strictive type, or the like, or anycombination thereof. In some embodiments, the transducer 843 or 853 mayinclude a vibration diaphragm, which may vibrate when driven by anelectrical signal, and the front and rear sides of the vibrationdiaphragm may simultaneously output a normal-phase sound and areverse-phase sound. In FIGS. 8A and 8B, “+” and “−” may be used torepresent sounds with different phases, wherein “+” may represent anormal-phase sound, and “−” may represent a reverse-phase sound.

In some embodiments, a transducer may be encapsulated by a casing of asupporting structure, and the interior of the housing may be providedwith sound channels connected to the front and rear sides of thetransducer, respectively, thereby forming an acoustic route. Forexample, a front cavity of the transducer 843 may be coupled to one ofthe two first sound guiding holes 847 through a first acoustic route(i.e., a half of the acoustic route 845), and a rear cavity of thetransducer 843 may acoustically be coupled to the other sound guidinghole of the two first sound guiding holes 847 through a second acousticroute (i.e., the other half of the acoustic route 845). A normal-phasesound and a reverse-phase sound output from the transducer 843 may beoutput from the two first sound guiding holes 847, respectively. Asanother example, a front cavity of the transducer 853 may be coupled toone of the two sound guiding holes 857 through a third acoustic route(i.e., half of the acoustic route 855), and a rear cavity of thetransducer 853 may be coupled to another sound guiding hole of the twosecond sound guiding holes 857 through a fourth acoustic route (i.e.,the other half of the acoustic route 855). A normal-phase sound and areverse-phase sound output from the transducer 853 may be output fromthe two second sound guiding holes 857, respectively.

In some embodiments, an acoustic route may affect the nature of thetransmitted sound. For example, an acoustic route may attenuate orchange the phase of the transmitted sound to some extent. In someembodiments, the acoustic route may include one or more of a sound tube,a sound cavity, a resonance cavity, a sound hole, a sound slit, a tuningnet, or the like, or any combination thereof. In some embodiments, theacoustic route may include an acoustic resistance material, which mayhave a specific acoustic impedance. For example, the acoustic impedancemay be in the range of 5 MKS Rayleigh to 500 MKS Rayleigh. In someembodiments, the acoustic resistance material may include but notlimited to plastics, textiles, metals, permeable materials, wovenmaterials, screen materials, and mesh materials, or the like, or anycombination thereof. In some embodiments, in order to prevent the soundtransmitted by the acoustic driver's front chamber and rear chamber frombeing differently disturbed, the front chamber and rear chambercorresponding to the acoustic driver may have the approximately sameequivalent acoustic impedance. Additionally, sound guiding holes withthe same acoustic resistance material, the same size and/or shape, etc.,may be used.

The distance between the two first sound guiding holes 847 of thelow-frequency acoustic driver may be expressed as d1 (i.e., the firstdistance). The distance between the two second sound guiding holes 857of the high-frequency acoustic driver may be expressed as d2 (i.e., thesecond distance). By setting the distances d1 and d2, a higher soundvolume output in the low-frequency band and a stronger ability to reducethe sound leakage in the high-frequency band may be achieved. Forexample, the distance between the two first sound guiding holes 847 isgreater than the distance between the two second sound guiding holes 857(i.e., d1>d2).

In some embodiments, the transducer 843 and the transducer 853 may behoused together in a housing of an acoustic output apparatus, and beplaced in isolation in a structure of the housing.

In some embodiments, the acoustic output apparatus may include multiplesets of high-frequency acoustic drivers and low-frequency acousticdrivers. For example, the acoustic output apparatus may include a set ofhigh-frequency acoustic drivers and a set of low-frequency acousticdrivers for simultaneously outputting sound to the left and/or rightears. As another example, the acoustic output apparatus may include twosets of high-frequency acoustic drivers and two sets of low-frequencyacoustic drivers, wherein one set of high-frequency acoustic drivers andone set of low-frequency acoustic drivers may be used to output sound toa user's left ear, and the other set of high-frequency acoustic driversand the other set of low-frequency acoustic drivers may be used tooutput sound to a user's right ear.

In some embodiments, the high-frequency acoustic driver and thelow-frequency acoustic driver may have different powers. In someembodiments, the low-frequency acoustic driver may have a first power,the high-frequency acoustic driver may have a second power, and thefirst power may be greater than the second power. In some embodiments,the first power and the second power may be arbitrary values.

FIGS. 9A, 9B, and 9C are schematic diagrams illustrating sound outputscenarios according to some embodiments of the present disclosure.

In some embodiments, the acoustic output apparatus may generate soundsin the same frequency range through two or more transducers, and thesounds may propagate outwards through different sound guiding holes. Insome embodiments, different transducers may be controlled by the samecontroller or different controllers, and may produce sounds that satisfya certain phase and amplitude condition (for example, sounds with thesame amplitude but opposite phases, sounds with different amplitudes andopposite phases, etc.). For example, a controller may make theelectrical signals input into two low-frequency transducers of anacoustic driver have the same amplitude and opposite phases. In thisway, the two low-frequency transducers may output low-frequency soundswith the same amplitude but opposite phases.

Specifically, the two transducers in an acoustic driver (such as alow-frequency acoustic driver 910 or a high-frequency acoustic driver920) may be arranged side by side in an acoustic output apparatus, oneof which may be used to output a normal-phase sound, and the other maybe used to output a reverse-phase sound. As shown in FIG. 9A, theacoustic driver 910 may include two transducers 943, two acoustic routes945, and two first sound guiding holes 947. As shown in FIG. 9B, theacoustic driver 950 may include two transducers 953, two acoustic routes955, and two second sound guiding holes 957. Driven by electricalsignals with opposite phases, the two transducers 943 may generate a setof low-frequency sounds with opposite phases (180 degrees inversion).One of the two transducers 943 (such as the transducer located below)may output a normal-phase sound, and the other (such as the transducerlocated above) may output a reverse-phase sound. The two low-frequencysounds with opposite phases may be transmitted to the two first soundguiding holes 947 along the two acoustic routes 945, respectively, andpropagate outwards through the two first sound guiding holes 947.Similarly, driven by electrical signals with opposite phases, the twotransducers 953 may generate a set of high-frequency sounds withopposite phases (180 degrees inversion). One of the two transducers 953(such as the transducer located below) may output a normal-phasehigh-frequency sound, and the other (such as the transducer locatedabove) may output a reverse-phase high-frequency sound. Thehigh-frequency sounds with opposite phases may be transmitted to the twosecond sound guiding holes 957 along the two acoustic routes 955,respectively, and propagate outwards through the two second soundguiding holes 957.

In some embodiments, the two transducers in an acoustic driver (forexample, the low-frequency acoustic driver 943 and the high-frequencyacoustic driver 953) may be arranged relatively close to each otheralong a straight line, and one of them may be used to output anormal-phase sound and the other may be used to output a reverse-phasesound.

As shown in FIG. 9C, the left side may be the acoustic driver 910, andthe right side may be the acoustic driver 920. The two transducers 943of the acoustic driver 910 may generate a set of low-frequency sounds ofequal amplitude and opposite phases under the control of the controller.One of the transducers 943 may output a normal-phase low-frequencysound, and transmit the normal-phase low-frequency sound along a firstacoustic route to a first sound guiding hole 947. The other transducer943 may output a reverse-phase low-frequency sound, and transmit thereverse-phase low-frequency sound along a second acoustic route toanother first sound guiding hole 947. The two transducers 953 of theacoustic driver 920 may generate high-frequency sounds of equalamplitude and opposite phases under the control of the controller,respectively. One of the transducers 953 may output a normal-phasehigh-frequency sound, and transmit the normal-phase high-frequency soundalong a third acoustic route to a second sound guiding hole 957. Theother transducer 953 may output a reverse-phase high-frequency sound,and transmit the reverse-phase high-frequency sound along a fourthacoustic route to another second sound guiding hole 957.

In some embodiments, the transducer 943 and/or the transducer 953 may beof various suitable types. For example, the transducer 943 and thetransducer 953 may be dynamic coil speakers, which may have thecharacteristics of a high sensitivity in low-frequency, a deep lowfrequency depth, and a small distortion. As another example, thetransducer 943 and the transducer 953 may be moving iron speakers, whichmay have the characteristics of a small size, a high sensitivity, and alarge high-frequency range. As another example, the transducers 943 and953 may be air-conducted speakers or bone-conducted speakers. As yetanother example, the transducer 943 and the transducer 953 may bebalanced armature speakers. In some embodiments, the transducer 943 andthe transducer 953 may be of different types. For example, thetransducer 1043 may be a moving iron speaker, and the transducer 953 maybe a moving coil speaker. As another example, the transducer 943 may bea dynamic coil speaker, and the transducer 953 may be a moving ironspeaker.

In FIGS. 9A-9C, the distance between the two point sources of theacoustic driver 910 may be d1, the distance between the two pointsources of the acoustic driver 920 may be d2, and d1 may be greater thand2. As shown in FIG. 9C, the listening position (that is, the positionof the ear canal when the user wears an acoustic output apparatus) maybe approximately located at a line of a set of two point sources. Insome embodiments, the listening position may be located at any suitableposition. For example, the listening position may be located on a circlecentered at the center point of the two point sources. As anotherexample, the listening position may be on the same side of the two linesof the two sets of point sources.

It may be understood that the simplified structure of the acousticoutput apparatus shown in FIGS. 9A-9C may be merely by way of example,which may be not a limitation for the present disclosure. In someembodiments, the acoustic output apparatus may include a supportingstructure, a controller, a signal processor, or the like, or anycombination thereof.

FIGS. 10A and 10B are schematic diagrams illustrating an acoustic outputapparatus according to some embodiments of the present disclosure.

In some embodiments, acoustic drivers (e.g., acoustic drivers 943 or953) may include multiple narrow-band speakers. As shown in FIG. 10A,the acoustic output apparatus may include a plurality of narrow-bandspeaker units and a signal processing module. On the left or right sideof the user, the acoustic output apparatus may include n groups ofnarrow-band speaker units, respectively. Each group of narrow-bandspeaker units may have different frequency response curves, and thefrequency response of each group may be complementary and collectivelycover the audible sound frequency band. A narrow-band speaker unit usedherein may be an acoustic driver with a narrower frequency responserange than a low-frequency acoustic driver and/or a high-frequencyacoustic driver. Taking the speaker units located at the left side ofthe user as shown in FIG. 10A as an example: A1˜An and B1˜Bn form ngroups of two point sources. When a same electrical signal is input,each two point sources may generate sounds with different frequencyranges. By setting the distance do between each group of two pointsources, the near-field and far-field sound of each frequency band maybe adjusted. For example, in order to enhance the volume of near-fieldsound and reduce the volume of far-field leakage, the distance between apair of two point sources corresponding to a high frequency may be lessthan the distance between a pair of two point sources corresponding to alow frequency.

In some embodiments, the signal processing module may include anEqualizer (EQ) processing module and a Digital Signal Processor (DSP)processing module. The signal processing module may be used to implementsignal equalization and other digital signal processing algorithms (suchas amplitude modulation and phase modulation). The processed signal maybe connected to a corresponding acoustic driver (for example, anarrow-band speaker unit) to output a sound. Preferably, a narrow-bandspeaker unit may be a dynamic coil speaker or a moving iron speaker. Insome embodiments, the narrow-band speaker unit may be a balancedarmature speaker. Two point sources may be constructed using twobalanced armature speakers, and the sound output from the two speakersmay be in opposite phases.

In some embodiments, an acoustic driver (such as acoustic drivers 740,750) may include multiple sets of full-band speakers. As shown in FIG.10B, the acoustic output apparatus may include a plurality of sets offull-band speaker units and a signal processing module. On the left orright side of the user, the acoustic output apparatus may include ngroups of full-band speaker units, respectively. Each full-band speakerunit may have the same or similar frequency response curve, and maycover a wide frequency range.

Taking the speaker units located at the left side of the user as shownin FIG. 10B as an example: A1˜An and B1˜Bn form n groups of two pointsources. The difference between FIGS. 10A and 10B may be that the signalprocessing module in FIG. 10B may include at least one set of filtersfor performing frequency division on the sound source signal to generateelectric signals corresponding to different frequency ranges, and theelectric signals corresponding to different frequency ranges may beinput into each group of full-band speaker units. In this way, eachgroup of speaker units (similar to the two point sources) may producesounds with different frequency ranges separately.

FIGS. 11A-11C are schematic diagrams illustrating an acoustic routeaccording to some embodiments of the present disclosure.

As described above, an acoustic filtering structure may be constructedby setting structures such as a sound tube, a sound cavity, and a soundresistance in an acoustic route to achieve frequency division of sound.FIGS. 11A-11C show schematic structural diagrams of frequency divisionof a sound signal using an acoustic route. It should be noted that FIGS.11A-11C may be examples of setting the acoustic route when using theacoustic route to perform frequency division on the sound signal, andmay not be a limitation on the present disclosure.

As shown in FIG. 11A, an acoustic route may include one or more groupsof lumen structures connected in series, and an acoustic resistancematerial may be provided in the lumen structures to adjust the acousticimpedance of the entire structure to achieve a filtering effect. In someembodiments, a band-pass filtering or a low-pass filtering may beperformed on the sound by adjusting the size of the lumen structuresand/or the acoustic resistance material to achieve frequency division ofthe sound. As shown in FIG. 11B, a structure with one or more sets ofresonant cavities (for example, Helmholtz cavity) may be constructed ona branch of the acoustic route, and the filtering effect may be achievedby adjusting the size of each resonant cavity and the acousticresistance material. As shown in FIG. 11C, a combination of a lumenstructure and a resonant cavity (for example, a Helmholtz cavity) may beconstructed in an acoustic route, and a filtering effect may be achievedby adjusting the size of the lumen structure and/or a resonant cavity,and/or the acoustic resistance material.

FIG. 12 shows a curve of a sound leakage of an acoustic output apparatus(for example, the acoustic output apparatus 700) under the action of twosets of two point sources (a set of high-frequency two point sources anda set of low-frequency two point sources). The frequency division pointsof the two sets of two point sources may be around 700 Hz.

A normalization parameter a may be used to evaluate the volume of theleaked sound (descriptions of a may be found in Equation (4)). As shownin FIG. 12, compared with a single point source, the two sets of twopoint sources may have a stronger ability to reduce sound leakage. Inaddition, compared with the acoustic output apparatus provided with onlyone set of two point sources, the two sets of two point sources mayoutput high-frequency sounds and low-frequency sounds, separately. Thedistance between the low-frequency two point sources may be greater thanthat of the high-frequency two point sources. In the low-frequencyrange, by setting a larger distance (d1) between the low frequency twopoint sources, the increase in the volume of the near-field sound may begreater than the increase in the volume of the far-field leakage, whichmay achieve a higher volume of the near-field sound output in thelow-frequency band. At the same time, in the low-frequency range,because that the sound leakage of the low frequency two point sources isvery small, increasing the distance d1 may slightly increase the soundleakage. In the high-frequency range, by setting a small distance (d2)between the high frequency two point sources, the problem that thecutoff frequency of high-frequency sound leakage reduction is too lowand the audio band of the sound leakage reduction is too narrow may beovercame. Therefore, by setting the distance d1 and/or the distance d2,the acoustic output apparatus provided in the embodiments of the presentdisclosure may obtain a stronger sound leakage suppressing capabilitythan an acoustic output apparatus having a single point source or asingle set of two point sources.

In some embodiments, affected by factors such as the filtercharacteristic of a circuit, the frequency characteristic of atransducer, and the frequency characteristic of an acoustic route, theactual low-frequency and high-frequency sounds of the acoustic outputapparatus may differ from those shown in FIG. 12. In addition,low-frequency and high-frequency sounds may have a certain overlap(aliasing) in the frequency band near the frequency division point,causing the total sound leakage reduction of the acoustic outputapparatus not have a rapid change at the frequency division point asshown in FIG. 12. Instead, there may be a gradient and/or a transitionin the frequency band near the frequency division point, as shown by athin solid line in FIG. 12. It may be understood that these differencesmay not affect the overall leakage reduction effect of the acousticoutput apparatus provided by the embodiments of the present disclosure.

According to FIGS. 7 to 12 and the related descriptions, the acousticoutput apparatus provided by the present disclosure may be used tooutput sounds in different frequency bands by setting high-frequency twopoint sources and low-frequency two point sources, thereby achieving abetter acoustic output effect. In addition, by setting different sets oftwo point sources with different distances, the acoustic outputapparatus may have a stronger capability to reduce the sound leakage ina high frequency band, and meet the requirements of an open acousticoutput apparatus.

In some alternative embodiments, an acoustic output apparatus mayinclude at least one acoustic driver, and the sound generated by the atleast one acoustic driver may propagate outwards through at least twosound guiding holes coupled with the at least one acoustic driver. Insome embodiments, the acoustic output apparatus may be provided with abaffle structure, so that the at least two sound guiding holes may bedistributed on two sides of the baffle. In some embodiments, the atleast two sound guiding holes may be distributed on both sides of theuser's auricle. At this time, the auricle may serve as a baffle thatseparates the at least two sound guiding holes, so that the at least twosound guiding holes may have different acoustic routes to the user's earcanal. More descriptions of two point sources and a baffle may be foundin International applications No. PCT/CN2019/130921 and No.PCT/CN2019/130942, both filed on Dec. 31, 2019, the entire contents ofeach of which are hereby incorporated by reference in the presentdisclosure.

FIG. 13 is a schematic diagram illustrating another exemplary acousticoutput apparatus according to some embodiments of the presentdisclosure. As shown in FIG. 13, the acoustic output apparatus 1300 mayinclude a supporting structure 1310 and an acoustic driver 1320 mountedwithin the supporting structure 1310. In some embodiments, the acousticoutput apparatus 1300 may be worn on the user's body (for example, thehuman body's head, neck, or upper torso) through the supportingstructure 1310. At the same time, the supporting structure 1310 and theacoustic driver 1320 may approach but not block the ear canal, so thatthe user's ear may remain open, thus the user may hear both the soundoutput from the acoustic output apparatus 1300 and the sound of theexternal environment. For example, the acoustic output apparatus 1300may be arranged around or partially around the user's ear, and transmitsounds by means of air conduction or bone conduction.

The supporting structure 1310 may be used to be worn on the user's bodyand include one or more acoustic drivers 1320. In some embodiments, thesupporting structure 1310 may have an enclosed shell structure with ahollow interior, and the one or more acoustic drivers 1320 may belocated inside the supporting structure 1310. In some embodiments, theacoustic output apparatus 1300 may be combined with a product, such asglasses, a headset, a display apparatus, an AR/VR helmet, etc. In thiscase, the supporting structure 1310 may be fixed near the user's ear ina hanging or clamping manner. In some alternative embodiments, a hookmay be provided on the supporting structure 1310, and the shape of thehook may match the shape of the user's auricle, so that the acousticoutput apparatus 1300 may be independently worn on the user's earthrough the hook. The acoustic output apparatus 1300 may communicatewith a signal source (for example, a computer, a mobile phone, or othermobile devices) in a wired or wireless manner (for example, Bluetooth).For example, the acoustic output apparatus 1300 at the left and rightears may be directly in communication connection with the signal sourcein a wireless manner. As another example, the acoustic output apparatus1300 at the left and right ears may include a first output apparatus anda second output apparatus. The first output apparatus may be incommunication connection with the signal source, and the second outputapparatus may be wirelessly connected with the first output apparatus ina wireless manner. The audio output of the first output apparatus andthe second output apparatus may be synchronized through one or moresynchronization signals. A wireless connection disclosed herein mayinclude but not limited to a Bluetooth, a local area network, a widearea network, a wireless personal area network, a near fieldcommunication, or the like, or any combination thereof.

In some embodiments, the supporting structure 1310 may have a shellstructure with a shape suitable for human ears, for example, a circularring, an oval, a polygonal (regular or irregular), a U-shape, a V-shape,a semi-circle, so that the supporting structure 1310 may be directlyhooked at the user's ear. In some embodiments, the supporting structure1310 may include one or more fixed structures. The fixed structure(s)may include an ear hook, a head strip, or an elastic band, so that theacoustic output apparatus 1300 may be better fixed on the user,preventing the acoustic output apparatus 1300 from falling down. Merelyby way of example, the elastic band may be a headband to be worn aroundthe head region. As another example, the elastic band may be a neckbandto be worn around the neck/shoulder region. In some embodiments, theelastic band may be a continuous band and be elastically stretched to beworn on the user's head. In the meanwhile, the elastic band may alsoexert pressure on the user's head so that the acoustic output apparatus1300 may be fixed to a specific position on the user's head. In someembodiments, the elastic band may be a discontinuous band. For example,the elastic band may include a rigid portion and a flexible portion. Therigid portion may be made of a rigid material (for example, plastic ormetal), and the rigid portion may be fixed to the supporting structure1310 of the acoustic output apparatus 1300 by a physical connection. Theflexible portion may be made of an elastic material (for example, cloth,composite, or/and neoprene).

In some embodiments, when the user wears the acoustic output apparatus1300, the supporting structure 1310 may be located above or below theauricle. The supporting structure 1310 may be provided with a soundguiding hole 1311 and a sound guiding hole 1312 for transmitting sound.In some embodiments, the sound guiding hole 1311 and the sound guidinghole 1312 may be located at both sides of the user's auricle,respectively, and the acoustic driver 1320 may output sounds through thesound guiding hole 1311 and the sound guiding hole 1312.

The acoustic driver 1320 may be a component that may receive anelectrical signal, and convert the electrical signal into a sound signalfor output. In some embodiments, in terms of frequency, the type of theacoustic driver 1320 may include a low-frequency acoustic driver, ahigh-frequency acoustic driver, or a full-frequency acoustic driver, orany combination thereof. In some embodiments, the acoustic driver 1320may include a moving coil, a moving iron, a piezoelectric, anelectrostatic, a magnetostrictive driver, or the like, or a combinationthereof.

In some embodiments, the acoustic driver 1320 may include a vibrationdiaphragm. When the vibration diaphragm vibrates, sounds may betransmitted from the front and rear sides of the vibration diaphragm,respectively. In some embodiments, the front side of the vibrationdiaphragm in the supporting structure 1310 may be provided with a frontchamber 1313 for transmitting sound. The front chamber 1313 may beacoustically coupled with the sound guiding hole 1311. The sound on thefront side of the vibration diaphragm may be outputted from the soundguiding hole 1311 through the front chamber 1313. The rear side of thevibration diaphragm in the supporting structure 1310 may be providedwith a rear chamber 1314 for transmitting sound. The rear chamber 1314may be acoustically coupled with the sound guiding hole 1312. The soundon the rear side of the vibration diaphragm may be outputted from thesound guiding hole 1312 through the rear chamber 1314. It should benoted that, when the vibration diaphragm is vibrating, the front sideand the rear side of the vibration diaphragm may simultaneously generatesounds with opposite phases. After passing through the front chamber1313 and rear chamber 1314, respectively, the sounds may propagateoutward from the sound guiding hole 1311 and the sound guiding hole1312, respectively. In some embodiments, by adjusting the structure ofthe front chamber 1313 and the rear chamber 1314, the sounds output bythe acoustic driver 1320 at the sound guiding hole 1311 and the soundguiding hole 1312 may meet specific conditions. For example, bydesigning the lengths of the front chamber 1313 and the rear chamber1314, the sound guiding hole 1311 and the sound guiding hole 1312 mayoutput sounds with a specific phase relationship (for example, oppositephases). Therefore, the problems including a small volume of the soundheard by the user in the near field of the acoustic output apparatus1300 and a large sound leakage in the far field of the acoustic outputapparatus 1300 may be effectively resolved.

In some alternative embodiments, the acoustic driver 1320 may alsoinclude a plurality of vibration diaphragms (e.g., two vibrationdiaphragms). Each of the plurality of vibration diaphragms may vibrateto generate a sound, which may pass through a cavity connected to thevibration diaphragm in the supporting structure, and output fromcorresponding sound guiding hole(s). The plurality of vibrationdiaphragms may be controlled by the same controller or differentcontrollers and generate sounds that satisfy certain phase and amplitudeconditions (for example, sounds of the same amplitude but oppositephases, sounds of different amplitudes and opposite phases, etc.).

As mentioned above, with a certain sound frequency, as the distancebetween two point sources increases, the volume of the sound heard bythe user and the volume of the leaked sound corresponding to the twopoint sources may increase. For a clearer description, the relationshipbetween volume of the sound heard by the user, the volume of soundleakage, and the point source distance d may be further explained inconnection with FIGS. 14 through 16.

FIG. 14 is a schematic diagram illustrating two point sources and alistening position according to some embodiments of the presentdisclosure. As shown in FIG. 14, a point source a1 and a point source a2may be on a same side of the listening position. The point source a1 maybe closer to the listening position, and the point source a1 and thepoint source a2 may output sounds with the same amplitude but oppositephases.

FIG. 15 is a graph illustrating a variation of the volume of the soundheard by the user of two point sources with different distances as afunction of a frequency of sound according to some embodiments of thepresent disclosure. The abscissa may represent the frequency (f) of thesound output by the two point sources (denoted as a1 and a2), and theunit may be hertz (Hz). The ordinate may represent the volume of thesound, and the unit may be decibel (dB). As shown in FIG. 15, as thedistance between the point source a1 and the point source a2 graduallyincreases (for example, from d to 10d), the sound volume at thelistening position may gradually increase. That is, as the distancebetween the point source a1 and the point source a2 increases, thedifference in sound pressure amplitude (i.e., sound pressure difference)between the two sounds reaching the listening position may becomelarger, making the sound cancellation effect weaker, which may increasethe sound volume at the listening position. However, due to theexistence of sound cancellation, the sound volume at the listeningposition may still be less than the sound volume generated by a singlepoint source at a same position in the low and middle frequency band(for example, a frequency of less than 1000 Hz). However, in thehigh-frequency band (for example, a frequency close to 10000 Hz), due tothe decrease in the wavelength of the sound, mutual enhancement of thesound may appear, making the sound generated by the two point sourceslouder than that of the single point source. In some embodiments, asound pressure may refer to the pressure generated by the sound throughthe vibration of the air.

In some embodiments, by increasing the distance between the two pointsources (for example, the point source a1 and the point source a2), thesound volume at the listening position may be increased. But as thedistance increases, the sound cancellation of the two point sources maybecome weaker, which may lead to an increase of the far-field soundleakage. For illustration purposes, FIG. 16 is a graph illustrating avariation of a normalized parameter of different distances between twopoint sources in the far field along with a frequency of sound accordingto some embodiments of the present disclosure. The abscissa mayrepresent the frequency (f) of the sound, the unit may be Hertz (Hz).The ordinate may use a normalization parameter a for evaluating thevolume of the leaked sound, and the unit may be decibel (dB). As shownin FIG. 16, taking the normalization parameter a of a single pointsource as a reference, as the distance between the two point sourcesincreases from d to 10d, the normalization parameter a may graduallyincrease, indicating that the sound leakage may gradually increase. Moredescriptions regarding the normalization parameter a may be found inequation (4) and related descriptions.

In some embodiments, adding a baffle structure to the acoustic outputapparatus may be beneficial to improve the output effect of the acousticoutput apparatus, that is, to increase the sound intensity at thenear-field listening position, while reduce the volume of the far-fieldsound leakage. For illustration, FIG. 17 is a diagram illustrating anexemplary baffle provided between two point sources according to someembodiments of the present disclosure. As shown in FIG. 17, when abaffle is provided between the point source a1 and the point source a2,in the near field, the sound wave of the point source a2 may need tobypass the baffle to interfere with the sound wave of the point sourcea1 at the listening position, which may be equivalent to increasing thelength of the acoustic route from the point source a2 to the listeningposition. Therefore, assuming that the point source a1 and the pointsource a2 have a same amplitude, compared to the case without a baffle,the difference in the amplitude of the sound waves of the point sourcea1 and the point source a2 at the listening position may increase, sothat the degree of cancellation of the two sounds at the listeningposition may decrease, causing the sound volume at the listeningposition to increase. In the far field, because the sound wavesgenerated by the point source a1 and the point source a2 do not need tobypass the baffle in a large space, the sound waves may interfere(similar to the case without a baffle). Compared to the case without abaffle, the sound leakage in the far field may not increasesignificantly. Therefore, a baffle structure being provided between thepoint source a1 and the point source a2 may increase the sound volume atthe near-field listening position significantly while the volume of thefar-field leakage does not increase significantly.

In the present disclosure, when the two point sources are located atboth sides of the auricle, the auricle may serve as a baffle, so theauricle may also be referred to as a baffle for brevity. As an example,due to the existence of the auricle, the result may be equivalent tothat the near-field sound may be generated by two point sources with adistance of D1 (also known as mode 1). The far-field sound may begenerated by two point sources with a distance of D2 (also known as mode2), and D1>D2. FIG. 18 is a graph illustrating a variation of the volumeof a sound heard by a user as a function of the frequency of sound whenthe auricle is located between two point sources according to someembodiments of the present disclosure. As shown in FIG. 18, when thefrequency is low (for example, when the frequency is less than 1000 Hz),the volume at the near-field sound (that is, the sound heard by the userby the user's ear) may basically be the same as that of the near-fieldsound in mode 1, be greater than the volume of the near-field sound inmode 2, and be close to the volume of the near-field sound of a singlepoint source. As the frequency increases (for example, when thefrequency is between 2000 Hz and 7000 Hz), the volume of the near-fieldsound in mode 1 and the two point sources being distributed on bothsides of the auricle may be greater than that of the one point source.It shows that when the user's auricle is located between the two pointsources, the volume of the near-field sound transmitted from the soundsource to the user's ear may be effectively enhanced. FIG. 19 is a graphillustrating a variation of the volume of a leaked sound as a functionof the frequency of sound when the auricle is located between two pointsources according to some embodiments of the present disclosure. Asshown in FIG. 19, as the frequency increases, the volume of thefar-field leakage may increase. When the two point sources aredistributed on both sides of the auricle, the volume of the far-fieldleakage generated by the two point sources may be basically the same asthe volume of the far-field leakage in mode 2, and both of which may beless than the volume of the far-field leakage in mode 1 and the volumeof the far-field leakage of a single point source. It shows that whenthe user's auricle is located between the two point sources, the soundtransmitted from the sound source to the far field may be effectivelyreduced, that is, the sound leakage from the sound source to thesurrounding environment may be effectively reduced. FIG. 20 is a graphillustrating a variation of a normalized parameter as a function of thefrequency of sound when two point sources of an acoustic outputapparatus is distributed on both sides of the auricle according to someembodiments of the present disclosure. As shown in FIG. 20, when thefrequency is less than 10000 Hz, the normalized parameter of the twopoint sources being distributed on both sides of the auricle may be lessthan the normalized parameter in the case of mode 1 (no baffle structurebetween the two point sources, and the distance is D1), mode 2 (nobaffle structure between the two point sources, and the distance is D2),and the single point source, which may show that when the two pointsources are located at both sides of the auricle, the acoustic outputapparatus may have a better capability to reduce the sound leakage.

In order to further explain the effect of the acoustic output apparatuswith or without a baffle between the two point sources or two soundguiding holes, the volume of the near-field sound at the listeningposition and/or volume of the far-field leakage under differentconditions may specifically be described below.

FIG. 21 is a graph illustrating a variation of the volume of a soundheard by the user and volume of a leaked sound as a function of thefrequency of sound with and without a baffle between two point sourcesaccording to some embodiments of the present disclosure. As shown inFIG. 21, after adding a baffle between the two point sources (i.e., twosound guiding holes) of the acoustic output apparatus, in the nearfield, it may be equivalent to increasing the distance between the twopoint sources, and the sound volume at the near-field listening positionmay be equivalent to being generated by a set of two point sources witha large distance. The volume of the near-field sound may besignificantly increased compared to the case without a baffle. In thefar field, because the interference of the sound waves generated by thetwo point sources may be rarely affected by the baffle, the soundleakage may be equivalent to being generated by two point sources with asmall distance, therefore the sound leakage may not change significantlywith or without the baffle. It may be seen that by setting a bafflebetween two sound guiding holes (i.e., two point sources), the abilityof the sound output apparatus to reduce the sound leakage may beeffectively improved, and the volume of the near-field sound of theacoustic output apparatus may be increased significantly. Therefore, therequirements for sound production components of the acoustic outputapparatus may be reduced. At the same time, the simple circuit structuremay reduce the electrical loss of the acoustic output apparatus, so thatthe working time of the acoustic output apparatus may be greatlyprolonged under a certain amount of electricity.

FIG. 22 is a graph illustrating a variation of the volume of a soundheard by the user and the volume of a leaked sound as a function of thedistance between two point sources when the frequency of the two pointsources is 300 Hz according to some embodiments of the presentdisclosure. FIG. 23 is a graph illustrating a variation of the volume ofa sound heard by the user and the volume of a leaked sound as a functionof the distance between two point sources when the frequency of the twopoint sources is 1000 Hz according to some embodiments of the presentdisclosure. As shown in FIGS. 22 and 23, in the near field, when thefrequency is 300 Hz or 1000 Hz, as the increase of the distance d of thetwo point sources, the volume of the sound heard by the user with abaffle between the two point sources may be greater than that without abaffle between the two point sources, which shows that at thisfrequency, the baffle structure between the two point sources mayeffectively increase the volume of the sound heard by the user in thenear field. In the far field, the volume of the leaked sound with abaffle between the two point sources may be equivalent to that without abaffle between the two point sources, which shows that at thisfrequency, with or without a baffle structure arranged between the twopoint sources has little effect on the far-field sound leakage.

FIG. 24 is a graph illustrating a variation of the volume of a soundheard by the user and the volume of a leaked sound as a function of thedistance when the frequency of the two point sources is 5000 Hzaccording to some embodiments of the present disclosure. As shown inFIG. 24, in the near field, when the frequency is 5000 Hz, as thedistance d of the two point sources increases, the volume of the soundheard by the user when there is a baffle between the two point sourcesmay be greater than that when there is no baffle. In the far-field, thevolume of the leaked sound of the two point sources with and withoutbaffle may be fluctuant as a function of the distance d. Overall,whether the baffle structure is arranged between the two point sourceshas little effect on the far-field leakage.

FIGS. 25-27 are graphs illustrating a variation of the volume of a soundheard by the user as a function of the frequency of sound when thedistance d of two point sources is 1 cm, 2 cm, 3 cm, respectively,according to some embodiments of the present disclosure. FIG. 28 is agraph illustrating a variation of a normalized parameter of a far fieldas a function of the frequency of sound when the distance d of two pointsources is 1 cm according to some embodiments of the present disclosure.FIG. 29 is a graph illustrating a variation of a normalized parameter ofa far field as a function of the frequency of sound when the distance dof two point sources is 2 cm according to some embodiments of thepresent disclosure. FIG. 30 is a graph illustrating a variation of anormalized parameter of a far field as a function of the frequency ofsound when the distance d of two point sources is 4 cm according to someembodiments of the present disclosure. As shown in FIGS. 25 through 27,for the different distances d of the sound guiding holes (for example, 1cm, 2 cm, 4 cm), at a certain frequency, in the near-field listeningposition (for example, the user's ear), the sound volume of two soundguiding holes located at both sides of the auricle (i.e., the “baffleeffect” situation shown in the figure) may be greater than the soundvolume of two sound guiding holes located at a same side of the auricle(i.e., the case of “without baffle” as shown in the figures). Thecertain frequency may be below 10000 Hz, below 5000 Hz, or below 1000Hz.

As shown in FIGS. 28 to 30, for the different distances d of the soundguiding holes (for example, 1 cm, 2 cm, and 4 cm), at a certainfrequency, in the far-field position (for example, the environmentposition away from the user's ear), the volume of the leaked soundgenerated when the two sound guiding holes are provided on both sides ofthe auricle may be smaller than that generated when the two soundguiding holes are not provided on both sides of the auricle. It shouldbe noted that as the distance between two sound guiding holes or twopoint sources increases, the interference cancellation of sound at thefar-field position may weaken, leading to a gradual increase in thefar-field leakage and a weaker ability to reduce sound leakage.Therefore, the distance d between two sound guiding holes or the twopoint sources may not be too large. In some embodiments, in order tokeep the output sound as loud as possible in the near field, andsuppress the sound leakage in the far field, the distance d between thetwo sound guiding holes may be set to be no more than, for example, 20cm, 12 cm, 10 cm, 6 cm, or the like. In some embodiments, consideringthe size of the acoustic output apparatus and the structuralrequirements of the sound guiding holes, the distance d between the twosound guiding holes may be set to be in a range of, for example, 1 cm to12 cm, 1 cm to 10 cm, 1 cm to 8 cm, 1 cm to 6 cm, 1 cm to 3 cm, or thelike.

It should be noted that the above description is merely for the purposesof description, and not intended to limit the scope of the presentdisclosure. It may be understood that, for those skilled in the art,after understanding the principle of the present disclosure, variousmodifications and changes in the forms and details of the acousticoutput apparatus may be made without departing from this principle. Forexample, in some embodiments, a plurality of sound guiding holes may beset on both sides of the baffle. The number of the sound guiding holeson both sides of the baffle may be the same or different. For example,the number of sound guiding holes on one side of the baffle may be two,and the number of sound guiding holes on the other side may be two orthree. These modifications and changes may still be within theprotection scope of the present disclosure.

In some embodiments, on the premise of maintaining the distance betweenthe two point sources, a relative position of the listening position tothe two point sources may have a certain effect on the volume of thenear-field sound and the far-field leakage reduction. In order toimprove the acoustic output effect of the acoustic output apparatus, insome embodiments, the acoustic output apparatus may be provided with atleast two sound guiding holes. The at least two sound guiding holes mayinclude two sound guiding holes located at the front and back sides ofthe user's auricle, respectively. In some embodiments, considering thatthe sound propagated from the sound guiding hole located at the rearside of the user's auricle needs to bypass over the auricle to reach theuser's ear canal, the acoustic route between the sound guiding holelocated at the front side of the auricle and the user's ear canal (i.e.,the acoustic distance from the sound guiding hole to the user's earcanal entrance) is shorter than the acoustic route between the soundguiding hole located at the rear side of the auricle and the user's ear.In order to further explain the effect of the listening position on theacoustic output effect, four representative listening positions(listening position 1, listening position 2, listening position 3,listening position 4) may be selected as shown in FIG. 31. The listeningposition 1, the listening position 2, and the listening position 3 mayhave equal distance from the point source a1, which may be r1. Thedistance between the listening position 4 and the point source a1 may ber2, and r2<r1. The point source a1 and the point source a2 may generatesounds with opposite phases, respectively.

FIG. 32 is a graph illustrating the volume of a sound heard by a user oftwo point sources without baffle at different listening positions as afunction of the frequency of sound according to some embodiments of thepresent disclosure. FIG. 33 is a graph illustrating a normalizedparameter of different listening positions as a function of thefrequency of sound. The normalized parameter may be obtained withreference to Equation (4). As shown in FIGS. 32 and 33, for thelistening position 1, since the difference between the acoustic routesfrom the point source a1 and the point source a2 to the listeningposition 1 is small, the difference in amplitude of the sounds producedby the two point sources at the listening position 1 may be small.Therefore, an interference of the sounds of the two point sources at thelistening position 1 may cause the volume of the sound heard by the userto be smaller than that of other listening positions. For the listeningposition 2, compared with the listening position 1, the distance betweenthe listening position 2 and the point source a1 may remain unchanged,that is, the acoustic route from the point source a1 to the listeningposition 2 may not change. However, the distance between the listeningposition 2 and the point source a2 may be longer, and the length of theacoustic route between the point source a2 and the listening position 2may increase. The amplitude difference between the sound generated bythe point source a1 and the sound generated by the point source a2 atthe listening position 2 may increase. Therefore, the volume of thesound transmitted from the two point sources after interference at thelistening position 2 may be greater than that at the listeningposition 1. Among all positions on an arc with a radius of r1, adifference between the acoustic route from the point source a1 to thelistening position 3 and the acoustic route from the point source a2 tothe listening position 3 may be the longest. Therefore, compared withthe listening position 1 and the listening position 2, the listeningposition 3 may have the highest volume of the sound heard by the user.For the listening position 4, the distance between the listeningposition 4 and the point source a1 may be short. The sound amplitude ofthe point source a1 at the listening position 4 may be large. Therefore,the volume of the sound heard by the user at the listening position 4may be large. In summary, the volume of the sound heard by the user atthe near-field listening position may change as the listening positionand the relative position of the two point sources change. When thelistening position is on the line between the two point sources and onthe same side of the two point sources (for example, listening position3), the acoustic route difference between the two point sources at thelistening position may be the largest (the acoustic route difference maybe the distance d between the two point sources). In this case (i.e.,when the auricle is not used as a baffle), the volume of the sound heardby the user at this listening position may be greater than that at otherlocations. According to Equation (4), when the far-field leakage isconstant, the normalization parameter corresponding to this listeningposition may be the smallest, and the leakage reduction capability maybe the strongest. At the same time, reducing the distance r1 between thelistening position (for example, listening position 4) and the pointsource a1 may further increase the volume at the listening position, atthe same time reduce the sound leakage, and improve the capability toreduce leakage.

FIG. 34 is a graph illustrating the volume of the sound heard by theuser of two point sources with baffle (as shown in FIG. 31) at differentlistening positions in the near field as a function of frequencyaccording to some embodiments of the present disclosure. FIG. 35 is agraph of the normalization parameters of different listening positionsobtained with reference to Equation (4) based on FIG. 34, as a functionof frequency. As shown in FIGS. 34 and 35, compared to the case withouta baffle, the volume of the sound heard by the user generated by the twopoint sources at listening position 1 may increase significantly whenthere is a baffle. The volume of the sound heard by the user at thelistening position 1 may exceed that at the listening position 2 and thelistening position 3. The reason may be that the acoustic route from thepoint source a2 to the listening position 1 may increase after a baffleis set between the two point sources. As a result, the acoustic routedifference between the two point sources at the listening position 1 mayincrease significantly. The amplitude difference between the soundsgenerated by the two point sources at the listening position 1 mayincrease, making it difficult to produce sound interferencecancellation, thereby increasing the volume of the sound heard by theuser generated at the listening position 1 significantly. At thelistening position 4, since the distance between the listening positionand the point source a1 is further reduced, the sound amplitude of thepoint source a1 at this position may be larger. The volume of the soundheard by the user at the listening position 4 may still be the largestamong the four listening positions. For listening position 2 andlistening position 3, since the effect of the baffle on the acousticroute from the point source a2 to the two listening positions is notvery obvious, the volume increase effect at the listening position 2 andthe listening position 3 may be less than that at the listening position1 and the listening position 4 which are closer to the baffle.

The volume of the leaked sound in the far field may not change withlistening positions, and the volume of the sound heard by the user atthe listening position in the near field may change with listeningpositions. In this case, according to Equation (4), the normalizationparameter of the acoustic output apparatus may vary in differentlistening positions. Specifically, a listening position with a largevolume of sound heard by the user (e.g., listening position 1 andlistening position 4) may have a small normalization parameter andstrong capability to reduce sound leakage. A listening position with alow volume of sound heard by the user (e.g., listening position 2 andlistening position 3) may have a large normalization parameter and weakcapability to reduce leakage.

Therefore, according to the actual application scenario of the acousticoutput apparatus, the users auricle may serve as a baffle. In this case,the two sound guiding holes on the acoustic output apparatus may bearranged on the front side and the back side of the auricle,respectively, and the ear canal may be located between the two soundguiding holes as a listening position. In some embodiments, by designingthe positions of the two sound guiding holes on the acoustic outputapparatus, the distance between the sound guiding hole on the front sideof the auricle and the ear canal may be smaller than the distancebetween the sound guiding hole on the back side of the auricle and theear canal. In this case, the acoustic output apparatus may produce alarge sound amplitude at the ear canal since the sound guiding hole onthe front side of the auricle is close to the ear canal. The soundamplitude formed by the sound guiding hole on the back of the auriclemay be smaller at the ear canal, which may avoid the interferencecancellation of the sound at the two sound guiding holes at the earcanal, thereby ensuring that the volume of the sound heard by the userat the ear canal is large. In some embodiments, the acoustic outputapparatus may include one or more contact points (e.g., “an inflectionpoint” on a supporting structure to match the shape of the ear) that cancontact with the auricle when it is worn. The contact point(s) may belocated at a line connecting the two sound guiding holes or on one sideof the line connecting the two sound guiding holes. And a ratio of thedistance between the front sound guiding hole and the contact point(s)to the distance between the rear sound guiding hole and the contactpoint(s) may be 0.05-20. In some embodiments, the ratio may be 0.1-10.In some embodiments, the ratio may be 0.2-5. In some embodiments, theratio may be 0.4-2.5.

FIG. 36 is a schematic diagram illustrating two point sources and abaffle (e.g., an auricle) according to some embodiments of the presentdisclosure. In some embodiments, a position of the baffle between thetwo sound guiding holes may have a certain influence on the acousticoutput effect. Merely by way of example, as shown in FIG. 36, a bafflemay be provided between a point source a1 and a point source a2, alistening position may be located at the line connecting the pointsource a1 and the point source a2. In addition, the listening positionmay be located between the point source a1 and the baffle. A distancebetween the point source a1 and the baffle may be L. A distance betweenthe point source a1 and the point source a2 may be d. A distance betweenthe point source a1 and the sound heard by the user may be L1. Adistance between the listening position and the baffle may be L2. Whenthe distance L1 is constant, a movement of the baffle may causedifferent ratios of L to d, thereby obtaining different volumes of thesound heard by the user at the listening position and/or the volumes ofthe far-field leakage.

FIG. 37 is a graph illustrating a variation of the volume of anear-field sound as a function of the frequency of sound when a baffleis at different positions according to some embodiments of the presentdisclosure. FIG. 38 is a graph illustrating a variation of the volume ofa far-field leakage as a function of the frequency of sound when abaffle is at different positions according to some embodiments of thepresent disclosure. FIG. 39 is a graph illustrating a variation of anormalization parameter as a function of the frequency of sound when abaffle is at different positions according to some embodiments of thepresent disclosure. According to FIGS. 37-39, the volume of thefar-field leakage may vary little with the change of the position of thebaffle between the two point sources. In a situation that the distance dbetween the point source a1 and the point source a2 remains constant,when L decreases, the volume at the listening position may increase, thenormalization parameter may decrease, and the capability to reduce soundleakage may be enhanced. In the same situation, when L increases, thevolume at the listening position may increase, the normalizationparameter may increase, and the capability to reduce sound leakage maybe weakened. A reason for the above result may be that when L is small,the listening position may be close to the baffle, an acoustic route ofthe sound wave from the point source a2 to the listening position may beincreased due to the baffle. In this case, an acoustic route differencebetween the point source a1 and the point source a2 to the listeningposition may be increased and the interference cancellation of the soundmay be reduced. As a result, the volume at the listening position may beincreased after the baffle is added. When L is large, the listeningposition may be far away from the baffle. The baffle may have a smalleffect on the acoustic route difference between the point source a1 andthe point source a2 to the listening position. As a result, a volumechange at the listening position may be small after the baffle is added.

As described above, by designing positions of the sound guiding holes onthe acoustic output apparatus, an auricle of a human body may serve as abaffle to separate different sound guiding holes when the user wears theacoustic output apparatus. In this case, a structure of the acousticoutput apparatus may be simplified, and the output effect of theacoustic output apparatus may be further improved. In some embodiments,the positions of the two sound guiding holes may be properly designed sothat a ratio of a distance between the sound guiding hole on the frontside of the auricle and the auricle (or a contact point on the acousticoutput apparatus for contact with the auricle) to a distance between thetwo sound guiding holes may be less than or equal to 0.5 when the userwears the acoustic output apparatus. In some embodiments, the ratio maybe less than or equal to 0.3, In some embodiments, the ratio may be lessthan or equal to 0.1. In some embodiments, the ratio of the distancebetween the sound guiding hole on the front side of the auricle and theauricle (or a contact point on the acoustic output apparatus for contactwith the auricle) to the distance between the two sound guiding holesmay be larger than or equal to 0.05. In some embodiments, a second ratioof the distance between the two sound guiding holes to a height of theauricle may be larger than or equal to 0.2. In some embodiments, thesecond ratio may be less than or equal to 4. In some embodiments, theheight of the auricle may refer to a length of the auricle in adirection perpendicular to a sagittal plane.

It should be noted that an acoustic route from an acoustic driver to asound guiding hole in the acoustic output apparatus may have a certaineffect on the volumes of the near-field sound and far-field soundleakage. The acoustic route may be changed by adjusting a cavity lengthbetween a vibration diaphragm in the acoustic output apparatus and thesound guiding hole. In some embodiments, the acoustic driver may includea vibration diaphragm. The front and rear sides of the vibrationdiaphragm may be coupled to two sound guiding holes through a frontchamber and a rear chamber, respectively. The acoustic routes from thevibration diaphragm to the two sound guiding holes may be different. Insome embodiments, a ratio of the lengths of the acoustic routes betweenthe vibration diaphragm and the two sound guiding holes may be, forexample, 0.5-2, 0.6-1.5, or 0.8-1.2.

In some embodiments, on the premise of keeping the phases of the soundsgenerated at the two sound guiding holes opposite, the amplitudes of thesounds generated at the two sound guiding holes may be changed toimprove the output effect of the acoustic output apparatus.Specifically, impedances of acoustic routes connecting the acousticdriver and the two sound guiding holes may be adjusted so as to adjustthe sound amplitude at each of the two sound guiding holes. In someembodiments, the impedance may refer to a resistance that a medium needsto overcome during displacement when acoustic waves are transmitted. Theacoustic routes may or may not be filled with a damping material (e.g.,a tuning net, a tuning cotton, etc.) so as to adjust the soundamplitude. For example, a resonance cavity, a sound hole, a sound slit,a tuning net, and/or a tuning cotton may be disposed in an acousticroute so as to adjust the acoustic resistance, thereby changing theimpedances of the acoustic route. As another example, an aperture ofeach of the two sound guiding holes may be adjusted to change theacoustic resistance of the acoustic routes corresponding to the twosound guiding holes. In some embodiments, a ratio of the acousticimpedance of the acoustic route between the acoustic driver (thevibration diaphragm) and one of the two sound guiding holes to theacoustic route between the acoustic driver and the other sound guidinghole may be 0.5-2 or 0.8-1.2.

It should be noted that the above descriptions are merely forillustration purposes, and not intended to limit the present disclosure.It should be understood that, for those skilled in the art, afterunderstanding the principle of the present disclosure, variousmodifications and changes may be made in the forms and details of theacoustic output apparatus without departing from this principle. Forexample, the listening position may not be on the line connecting thetwo point sources, but may also be above, below, or in an extensiondirection of the line connecting the two point sources. As anotherexample, a measurement method of the distance from a point source to theauricle, and a measurement method of the height of the auricle may alsobe adjusted according to different scenarios. These similar changes maybe all within the protection scope of the present disclosure.

FIG. 40 is a schematic diagram illustrating another exemplary acousticoutput apparatus according to some embodiments of the presentdisclosure.

For human ears, the frequency band of sound that can be heard may beconcentrated in a mid-low-frequency band. An optimization goal in themid-low-frequency band may be to increase a volume of the sound heard bythe user. If the listening position is fixed, parameters of the twopoint sources may be adjusted such that the volume of the sound heard bythe user may increase significantly while a volume of leaked sound maybe substantially unchanged (an increase in the volume of the sound heardby the user may be greater than an increase in the volume of the soundleakage). In a high-frequency band, a sound leakage reduction effect ofthe two point sources may be weaker. In the high-frequency band, anoptimization goal may be reducing a sound leakage. The sound leakage maybe further reduced by adjusting the parameters of the two point sourcesof different frequencies. In some embodiments, the acoustic outputapparatus 1300 may also include an acoustic driver 1330. The acousticdriver 1330 may output sounds from two of second sound guiding holes.Details regarding the acoustic driver 1330, the second sound guidingholes, and a structure therebetween may be described with reference tothe acoustic driver 1320 and the first sound guiding holes. In someembodiments, the acoustic driver 1330 and the acoustic driver 1320 mayoutput sounds of different frequencies. In some embodiments, theacoustic output apparatus may further include a controller configured tocause the acoustic driver 1320 to output sound in the first frequencyrange, and cause the acoustic driver 1330 to output sound in the secondfrequency range. The second frequency range may include frequencieshigher than the first frequency range. For example, the first frequencyrange may be 100 Hz-1000 Hz, and the second frequency range may be 1000Hz-10000 Hz.

In some embodiments, the acoustic driver 1320 may be a low-frequencyspeaker, and the acoustic driver 1330 may be a mid-high-frequencyspeaker. Due to different frequency response characteristics of thelow-frequency speaker and the mid-high-frequency speaker, frequencybands of the output sound may also be different. High-frequency bandsand low-frequency bands may be divided by using the low-frequencyspeakers and the mid-high-frequency speakers, and accordingly, twolow-frequency point sources and two mid-high-frequency point sources maybe constructed to perform near-field sound output and a far-fieldleakage reduction. For example, the acoustic driver 1320 may provide twopoint sources for outputting low-frequency sound through the soundguiding hole 1311 and the sound guiding hole 1312, which may be mainlyused for outputting sound in low-frequency band. The two low-frequencypoint sources may be distributed on both sides of an auricle to increasea volume near the near-field ear. The acoustic driver 1330 may providetwo point sources for outputting mid-high-frequency sound through twosecond sound guiding holes. A mid-high-frequency sound leakage may bereduced by adjusting a distance between the two second sound guidingholes. The two mid-high-frequency point sources may be distributed onboth sides of the auricle or on the same side of the auricle.Alternatively, the acoustic driver 1320 may provide two point sourcesfor outputting full-frequency sound through the sound guiding hole 1311and the sound guiding hole 1312 so as to further increase the volume ofthe near-field sound.

Further, the distance d2 between the two second sound guiding holes maybe less than the distance d1 between the sound guiding hole 1311 and thesound guiding hole 1312, that is, d1 may be larger than d2. Forillustration purpose, as shown in FIG. 12, it may be possible to obtaina stronger sound leakage reduction capability than a single point sourceand one set of two point sources by setting two sets of two pointsources including one set of two low-frequency point sources and one setof two high-frequency point sources with different distances.

It should be noted that the positions of the sound guiding holes of theacoustic output apparatus may be not limited to the case that the twosound guiding holes 1311 and 1312 corresponding to the acoustic driver1320 are distributed on both sides of the auricle, and the case that thetwo sound guiding holes corresponding to the acoustic driver 1330 aredistributed on the front side of the auricle. For example, in someembodiments, two second sound guiding holes corresponding to theacoustic driver 1330 may be distributed on the same side of the auricle(e.g., a rear side, an upper side, or a lower side of the auricle). Asanother example, in some embodiments, the two second sound guiding holescorresponding to the acoustic driver 1330 may be distributed on bothsides of the auricle. In some embodiments, when the sound guiding holes1311 and the sound guiding hole 1312 (and/or the two second soundguiding holes) are located at the same side of the auricle, a baffle maybe disposed between the sound guiding holes 1311 and the sound guidinghole 1312 (and/or the two second sound guiding holes) so as to furtherincrease the volume of the near-field sound and reduce the far-fieldsound leakage. For a further example, in some embodiments, the two soundguiding holes corresponding to the acoustic driver 1320 may also belocated at the same side of the auricle (e.g., a front side, a rearside, an upper side, or a lower side of the auricle).

FIG. 41 is a schematic cross-sectional view of an exemplary openearphone according to some embodiments of the present disclosure. FIG.42 is a schematic diagram illustrating a vocal structure of an exemplaryopen earphone according to some embodiments of the present disclosure.For example, FIG. 42 may be an enlarged view of a vocal structure 4105as shown in FIG. 41. FIG. 43 is a schematic cross-sectional view of anexemplary structure of a baffle of an open earphone according to someembodiments of the present disclosure. For example, FIG. 43 may be aschematic cross-sectional view facing C-C of the baffle as shown in FIG.41. As shown in FIG. 41, FIG. 42, and/or FIG. 43, the open earphone 4100may include a housing 4110, at least one microphone 4120, an acousticdriver 4130, a sound guiding tube 4140 corresponding to the acousticdriver 4130 (e.g., a sound guiding tube 4140-1, a sound guiding tube4140-2, a sound guiding tube 4140-3, a sound guiding tube 4140-4, etc.),a baffle 4150, a circuit board 4160, a Bluetooth module 4170, and apower module 4180. In some embodiments, the open earphone 4100 mayfurther include an electronic frequency division module (not shown inFIG. 41, may refer to e.g., the electronic frequency division module710). In some embodiments, the electronic frequency division module, theacoustic driver 4130, and the sound guiding tube 4140 may becollectively referred to as an acoustic output component. More detaileddescriptions regarding the acoustic output component may be found in thedescriptions of the acoustic output apparatuses in FIGS. 4-40, and arenot repeated here. In some embodiments, the open earphone 4100 shown inFIGS. 41-43 is only one specific embodiment of the open earphone 200shown in FIGS. 1 and 2. For example, an external structure of theconnecting component of the open earphone 200 may be designed as an earhook structure (e.g., the open earphone 4100). As another example, theexternal structure of the connecting component of the open earphone 200,may be designed as a headband structure (e.g., the open earphone 4600shown in FIG. 46).

In some embodiments, the electronic frequency division module may beplaced in the housing 4110. Exemplary electronic frequency divisionmodule may include a passive filter, an active filter, an analog filter,a digital filter, or the like, or any combination thereof. In someembodiments, by setting the acoustic driver 4130 with differentfrequency response characteristics (e.g, a low-frequency transducer, anintermediate-frequency transducer, and/or a high-frequency transducer),sounds output by the transducer with different frequency responses maycontain different frequency band components. In some embodiments,frequency division processing of audio signals may also be implementedin acoustic routes. For example, the acoustic driver 4130 may generatefull-band sound. By setting the acoustic routes with different acousticimpedances, the sound output by the acoustic driver 4130 may beacoustically filtered, such that sounds output through differentacoustic routes may have different frequency components. Moredescriptions regarding the acoustic route frequency division may referto FIG. 7 and its descriptions, and are not repeated herein. In someembodiments, the frequency division processing of audio signals may alsobe implemented by combining the two or more methods.

The sound signals with different frequencies generated by the acousticdriver 4130 may be output to a user from different sound guiding holes4142 (e.g., a sound guiding hole 4142-1, a sound guiding hole 4142-2, asound guiding hole 4142-3, a sound guiding hole 4142-4, etc.) viadifferent sound guiding tubes 4140. It should be noted that the soundguiding tubes 4140 are merely an exemplary implementation of acousticroutes in which sound may be propagated in the open earphone 4100. Thoseskilled in the art may also think that sound may be propagated in theopen earphone 4100 via other acoustic routes (e.g., a structure of asound cavity, a resonance cavity, a sound hole, a sound slit, a tuningnet, or the like, or any combination thereof) or other manner, and isnot limited herein.

In some embodiments, frequency division signals generated by processingthe audio signal may have frequency bands that are narrower than andwithin the frequency band of the audio signal. For example, thefrequency range of the audio signal may be from 10 Hz to 30 kHz. Thefrequency band of a frequency division signal may be from 100 Hz to 200Hz, which is narrower than and within the frequency band of the audiosignal. In some embodiments, a combination of the frequency bands of thefrequency division signals may completely cover the frequency band ofthe audio signal. Additionally or alternatively, the combination of thefrequency bands of the frequency division signals may partially coverthe frequency band of the audio signal. In some embodiments, at leasttwo of the frequency division signals may have different frequencybands. Different frequency bands may refer to two or more frequencybands with at least one different parameter in a frequency band centervalue and/or a frequency band width. Optionally, each frequency divisionsignal may have a feature frequency band that is different fromfrequency bands of other frequency division signals. That is, thefeature frequency band refers to a frequency band including a frequencyband range that does not overlap with frequency bands of other frequencydivision signals. Different frequency division signals may have the samefrequency bandwidth or different frequency bandwidths. In someembodiments, an overlap between frequency bands of a pair of adjacentfrequency division signals in the frequency domain may be avoided,thereby improving the sound output effect. Among the frequency divisionsignals generated after processing, two frequency division signals withclosest center frequencies may be considered to be adjacent to eachother in the frequency domain. More detailed descriptions regarding thefrequency bands of a pair of adjacent frequency division signals may befound in FIGS. 45A and 45B and the descriptions thereof. In someembodiments, as affected by factors such as filter characteristics ofactual circuit, frequency characteristics of a transducer, frequencycharacteristics of a sound channel, etc., low-frequency andhigh-frequency sounds actually output by the open earphone 4100 maygenerate a certain overlap (aliasing) in a frequency band near afrequency division point. It may be understood that the overlaps may notaffect the reduction effect of the overall sound leakage of the openearphone 4100 provided in the present disclosure.

The housing 4110 may be an external structure of the open earphone 4100.The shape of the housing 4110 may be configured according to the type ofthe open earphone (e.g., an ear hook type, a headband type) and specificrequirements during use, and is not limited herein. FIG. 41 and FIG. 46are schematic diagrams of the exemplary open earphone 200 according tosome embodiments of the present disclosure. As shown in FIG. 41, thehousing 4110 may cooperate with an auricle of the user, and be hung onan ear of the user, such that the open earphone 4100 may not falleasily. The open earphone 4100 with the housing 4110 of the ear hooktype may also be referred to as an ear hook open earphone. As shown inFIG. 46, the housing 4110 may straddle the user's head and be fixed onthe head of the user in a manner similar to a headband. Two ends of thehousing 4110 may be at a distance from the user's ears. The openearphone with the housing 4110 of the headband type may also be referredto as a headband open earphone.

The housing 4110 may be a hollow structure. The microphone 4120, theacoustic driver 4130, the sound guiding tube 4140, the baffle 4150, thecircuit board 4160, the Bluetooth module 4170, and the power module 4180may be placed in the hollow structure. As shown in FIG. 41, themicrophone 4120 and the acoustic driver 4130 may be located at the frontend of the housing 4110. The circuit board 4160 may be located at themiddle of the housing 4110. The Bluetooth module 4170 and the powermodule 4180 may be located at the back end of the housing 4110. In someembodiments, the microphone 4120, the acoustic driver 4130, the soundguiding tube 4140, the baffle 4150, the circuit board 4160, theBluetooth module 4170, and the power module 4180 may be located at anyother suitable positions of the housing 4110, which are not specificallylimited herein. For example, the acoustic driver 4130-1, the microphone4120, and the circuit board 4160 may be located at the front end of thehousing 4110. The Bluetooth module 4170 may be located at the middle ofthe housing 4110. The acoustic driver 4130-2 and the power module 3880may be located at the back end of the housing 4110. As another example,the Bluetooth module 4170 and power module 3880 may be located at thefront end of the housing 4110. The microphone 4120 and the circuit board4160 may be located at the middle of the housing 4110. Both the acousticdriver 4130-1 and the acoustic driver 4130-2 may be located at the backend of the housing 4110. The sound guiding holes may be set at the frontend of the housing 4110 through the sound guiding tubes. It should benoted that positions of the microphone 4120, the acoustic driver 4130,the sound guiding tube 4140, the baffle 4150, the circuit board 4160,the Bluetooth module 4170, and the power module 3880 in the housing 4110may be set according to requirements of open earphone 4100. The specificpositions of the components in the drawings are for illustrativepurposes only, and do not limit the scope of the present disclosure. Asshown in FIG. 43, the acoustic driver 4130-1 and the acoustic driver4130-2 may be separated by the baffle 4150.

In some embodiments, the housing 4110 may be integrally formed. In someembodiments, the housing 4110 may also be assembled by plugging,clamping, or the like. In some embodiments, the housing 4110 may be madeof a metal material (e.g., copper, aluminum, titanium, gold, etc.), analloy material (e.g., aluminum alloy, titanium alloy, etc.), a plasticmaterial (e.g., polyethylene, polypropylene, epoxy resin, nylon, etc.),a fiber material (e.g., acetate fiber, propionate fiber, carbon fiber,etc.), or the like. In some embodiments, a protective casing may be setoutside the housing 4110. The protective casing may be made of a softmaterial with certain elasticity, such as soft silica gel, rubber, etc.,for providing a better touch feeling for the user.

Sound guiding holes, for example, a first sound guiding hole 4142-1, asecond sound guiding hole 4142-2, a third sound guiding hole 4142-3, afourth sound guiding hole 4142-4, etc. may be set on the surface of thehousing 4110. The open earphone 4100 may transmit sound to the userthrough the sound guiding holes 4142 via air. The acoustic driver 4130may convert a frequency division signal (e.g., an electric signal) intoa sound signal. The acoustic driver 4130 may transmit the sound signalto a sound guiding hole through a corresponding sound guiding tube. Thenthe sound may be transmitted to the user through the guiding hole. Inorder to further describe how the setting of the sound guiding holes onthe housing 4110 affects the sound output effect of the open earphone4100, the sound may be regarded as being transmitted outward from thesound guiding hole. The present disclosure may describe the soundguiding holes on the open earphone 4100 as sound sources for outputtingsound (of course, the actual sound source is still a vocal device). Forbrevity and illustrative purposes, when the sizes of the sound guidingholes on the open earphone 4100 are small, each sound guiding hole maybe approximated as a point source.

The microphone 4120 may receive an external sound signal (e.g., a user'svoice signal). The microphone 4120 may convert the received sound signalinto an electrical signal. The sound signal received by the microphone4120 may be processed (e.g., filtered, denoised, amplificated, smoothed,and/or frequency divided, etc.) to obtain an audio signal (or afrequency division signal). The audio signal may be sent to otherobjects or devices that communicate with the open earphone 4100 throughother components of the open earphone 4100 (e.g., a Bluetooth component,a WIFI component).

The acoustic driver 4130 may convert input electrical signals into soundsignals. The conversion technique may be a sound vibration technique. Insome embodiments, the acoustic driver 4130 may process received audiosignals into frequency division signals due to different frequencyresponses of the received audio signals. The acoustic driver 4130 mayconvert the frequency division signals into sound signals in differentfrequency bands. In some embodiments, the acoustic driver 4130 maydirectly receive frequency division signals in different frequencybands. The acoustic driver 4130 may convert the received frequencydivision signals into sound signals. Then, the acoustic driver 4130 mayrespectively output the sound signals to the user who wears the openearphone 4100. In some embodiments, the acoustic driver 4130 may includeat least two speaker units (or transducers). Merely by way of example,FIG. 41, FIG. 42, and FIG. 43 all describe two speaker units, that is, afirst speaker unit 4130-1 and a second speaker unit 4130-2. The firstspeaker unit 4130-1 may correspond to a low-frequency signal, and thesecond speaker unit 4130-2 may correspond to a high-frequency signal. Insome embodiments, the acoustic driver 4130 may include an air-conductedspeaker, a bone-conducted speaker, a hydroacoustic transducer, anultrasonic transducer, or the like, or any combination thereof. In someembodiments, the acoustic driver 4130 may include a dynamic coilspeaker, a moving iron speaker, a piezoelectric speaker, anelectrostatic speaker, a magnetostrictive speaker, a balanced armaturespeaker, or the like, or any combination thereof. In some embodiments,each speaker unit may have the same frequency response characteristic.In some embodiments, each speaker unit may have different frequencyresponse characteristics.

It should be noted that a correspondence between a specific speaker unitand a specific frequency division signal may refer to that a frequencyband of a frequency division signal input to the specific speaker unitmay be the same as a frequency band of the specific frequency divisionsignal. The correspondence between a specific speaker unit and aspecific frequency division signal may also refer to that the specificspeaker unit may generate the specific frequency division signal. Thecorrespondence between a specific speaker unit and a specific frequencydivision signal may also refer to that a frequency band of a soundsignal that is processed by the specific speaker unit and transmittedthrough a sound guiding hole may be the same as a frequency band of thespecific frequency division signal.

Each speaker unit may convert input electrical signals (e.g., differentfrequency division signals) into sound signals through a sound vibrationtechnique for outputting. In some embodiments, each speaker unit maycorrespond to two sound guiding holes 4142. Each speaker unit may outputa set of sound signals with opposite phases and the same intensity,which are transmitted to the user through the sound guiding tube 4140and the corresponding sound guiding holes 4142, respectively. Forexample, the speaker unit may include a diaphragm, which is driven by anelectric signal to generate vibrations. The front and back sides of thediaphragm may simultaneously output a sound with a positive phase and asound with a negative phase respectively. In some embodiments, bysetting positions of the sound guiding holes, phases of the sound with apositive phase and the sound with a negative phase at a listeningposition (i.e., a near field such as the center of an ear hole of theuser's ear) may be the same or close and superimposed, and phases of thesound with a positive phase and the sound with a negative phase at a farfield (common sound leakage points in the surrounding environment) maybe reversed and cancelled. In this way, the open earphone 4100's abilityto reduce sound leakage at far field may be improved while a soundvolume at the near field is ensured. In some embodiments, the two soundguiding holes corresponding to the same speaker unit may be referred toas two point sources. For example, the first sound guiding hole 4142-1and the second sound guiding hole 4142-2 corresponding to the speakerunit 4130-1 may be referred to as two point sources. The third soundguiding hole 4142-3 and the fourth sound guiding hole 4142-4corresponding to the speaker unit 4130-2 may also be referred to as twopoint sources. In some embodiments, frequency division signalstransmitted from sound guiding holes of the two point sources mayinclude the same frequency band and amplitude, and different (e.g.,opposite) phases. In some embodiments, the frequency division signalstransmitted from the sound guiding holes of the two point sources mayinclude the same frequency band and phase. In some embodiments, thespeaker unit may only correspond to a single sound guiding hole. Thatis, the speaker unit may correspond to a single point source. Thespeaker unit may only output a unique frequency division signal. Forexample, a side of the speaker unit 4130-1 facing the sound guiding hole4142-2 may be dosed. Two point sources may be constructed by using twospeaker units (i.e., two single point sources). For example,high-frequency two point sources may be constructed using two balancedarmature speakers (i.e., the two point sources corresponding tohigh-frequency signals). In some embodiments, parameters such as afrequency, a phase, and an amplitude derivative of the frequencydivision signal corresponding to each single point source in each groupof two point sources may be adjusted individually. For example, eachsingle point source in each group of two point sources may include thesame frequency, and the same or different phases. As another example,each single point source in each group of two point sources may includethe same frequency, and the same or different amplitudes.

In some embodiments, the higher the frequency of frequency divisionsignal corresponding to the speaker unit is, the shorter the distancebetween the sound guiding holes corresponding the speaker unit may be.For example, the first speaker unit 4130-1 may output low-frequencysignals, and the second speaker unit 4130-2 may output high-frequencysignals. The distance between the first sound guiding hole 4142-1 andthe second sound guiding hole 4142-2 corresponding to the first speakerunit 4130-1 may be greater than the distance between the third soundguiding hole 4142-3 and the fourth sound guiding hole 4142-4corresponding to the second speaker unit 4130-2. By setting the distancebetween sound guiding holes corresponding to a speaker unit, the abilityof the open earphone 4100 to reduce sound leakage may be improved. Whenthe two point sources have a fixed distance, the sound leakage generatedby the two point sources may increase as the audio frequency increases,and the ability to reduce sound leakage may decrease as the audiofrequency increases. When a value of the frequency is greater than acertain value, the sound leakage generated by the two point sources maybe greater than that generated by a single point source. A frequencywith the certain value may be an upper limit frequency under which thetwo point sources may reduce the sound leakage. More descriptionsregarding the frequency and the distance between the two point sources,and the upper limit frequency for reducing sound leakage may be foundelsewhere in the present disclosure (e.g., FIG. 5, FIG. 6 and thedescriptions thereof). For different frequency division signals, it ispossible to obtain a stronger sound leakage reduction capability thansingle point sources by setting multiple groups of two point sourceswith different distances. For example, the audio signal may be dividedinto three (e.g., low, medium, and high) frequency bands. Differentdistances may be set to obtain two low-frequency point sources, twomedium-frequency point sources and two high-frequency point sources. Thedistance of the low-frequency point sources may be the largest, thedistance of the intermediate-frequency point sources distance may bemedium, and the distance of the high-frequency point sources may be thesmallest. In the low-frequency band, as an increased volume of the soundlistening is larger than an increased volume of the sound leakage afterenlarging the distance between sound sources, a higher volume output maybe achieved in the low-frequency band. At the same time, as the soundleakage of the two point sources in the low-frequency band is originallysmall, the sound leakage that increases slightly after enlarging thedistance between sound sources may remain at a low level. In thehigh-frequency band, by reducing the distance between sound sources, theproblems of low upper limit frequency and narrow frequency band in thereduction of sound leakage may be overcame. In a higher frequency band,the effect of reducing sound leakage may be stronger, which may meet therequirements of an open earphone.

In some embodiments, the acoustic driver 4130 may include only the firstspeaker unit 4130-1 and the second speaker unit 4130-2. The firstspeaker unit 4130-1 may correspond to a low-frequency signal, and thesecond speaker unit 4130-2 may correspond to a high-frequency signal. Insome embodiments, a frequency division point between the low and highfrequencies may be between 600 Hz-1.2 kHz. In some embodiments, thefirst speaker unit 4130-1 may correspond to two sound guiding holes4142-1 and 4142-2. The second speaker unit 4130-2 may correspond to twosound guiding holes 4142-3 and 4142-4. The distance (denoted as d_(l))between the sound guiding holes 4142-1 and 4142-2 and the distance(denoted as d_(h)) between the sound guiding holes 4142-3 and 4142-4 maybe any value. Merely by way of example, d_(l) may be greater than d_(h),for example, d_(l) being not greater than 40 mm (e.g., in the range of20 mm-40 mm), and d_(h) being not greater than 12 mm. Preferably, d_(l)may not be less than 12 mm, and d_(h) may not be greater than 7 mm(e.g., in the range of 3 mm-7 mm). More preferably, d_(l) may be 30 mm,and d_(h) may be 5 mm. As another example, d_(l) may be at least twotimes more than d_(h). Preferably, d_(l) may be at least three timesmore than d_(h). Preferably, d_(l) may be at least 5 times more thand_(h). In some embodiments, a range of

$\frac{d_{l}}{d_{h}}$may be 2-10. Preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 2.5-9.5. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 3-9. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 3.5-8.5. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 4-8. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 4.5-7.5. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 5-7. More preferably, the range of

$\frac{d_{l}}{d_{h}}$may be 5.5-6.5. More preferably,

$\frac{d_{l}}{d_{h}}$may be 6.

In some embodiments, each group of two point sources may include anear-ear point source and a far-ear point source. For example, when theuser wears the open earphone 4100, the first sound guiding hole 4142-1may be closer to the ear hole than the second sound guiding hole 4142-2,and the third sound guiding hole 4142-3 may be closer to the ear holethan the fourth sound guiding hole 4142-4. The first sound guiding hole4142-1 and the third sound guiding hole 4142-3 may be referred to asnear-ear point sources, and the second sound guiding hole 4142-2 and thefourth sound guiding hole 4142-4 may be referred to as far-ear pointsources. In some embodiments, the distance (denoted as L) between thefirst sound guiding hole 4142-1 and the third sound guiding hole 4142-3may not be greater than 20 mm. Optionally, L may not be greater than 18mm. More preferably, L may not be greater than 16 mm. More preferably, Lmay not be greater than 14 mm. More preferably, L may not be greaterthan 12 mm. More preferably, L may not be greater than 10 mm. Morepreferably, L may not be greater than 9 mm. More preferably, L may notbe greater than 8 mm. More preferably, L may not be greater than 7 mm.More preferably, L may not be greater than 6 mm. More preferably, L maynot be greater than 5 mm. More preferably, L may not be greater than 4mm. More preferably, L may not be greater than 3 mm. More preferably, Lmay not be greater than 2 mm. More preferably, L may not be greater than1 mm. More preferably, L may be equal to zero. When L is equal to 0, thenear-ear point sources may be combined into a single sound guiding hole,which may be used as a main sound guiding hole to transmit sound to theuser's ear hole. For example, the first sound guiding hole 4142-1 andthe third sound guiding hole 4142-3 may be combined into a single soundguiding hole (e.g., a sound guiding hole 4142-5 as shown in FIG. 44). Insome embodiments, at least a portion of the structure of the at leastone sound guiding hole may face the ear of the user, such that the soundemitted from the sound guiding hole may be transmitted toward the user'sear hole (as shown in FIG. 44).

In some embodiments, the shape of a sound guiding hole may include butnot limited to a stripe, a circle, an oval, a square, a trapezoid, arounded quadrilateral, a triangle, an irregular shape, or the like, orany combination thereof. In some embodiments, the shape of each soundguiding hole may be the same or different. For example, shapes of thefirst sound guiding hole 4142-1 and the third sound guiding hole 4142-3may be circles, and shapes of the second sound guiding hole 4142-2 andthe fourth sound guiding hole 4142-4 may be ovals. As another example,the shape of the first sound guiding hole 4142-1 may be a stripe, theshape of the second sound guiding hole 4142-2 may be an oval, the shapeof the third sound guiding hole 4142-3 may be a circle, and the shape ofthe fourth sound guiding hole 4142-4 may be a triangle. As anotherexample, shapes of the first sound guiding hole 4142-1, the second soundguiding hole 4142-2, the third sound guiding hole 4142-3, and the fourthsound guiding hole 4142-4 may be stripes.

In some embodiments, diameters or sizes of sound guiding holescorresponding to different speaker units may be the same or different.In some embodiments, when the size of each sound guiding hole isdifferent, the corresponding volume of listening and/or sound leakagemay also be different. In some embodiments, the two point sources mayachieve a stronger capacity of reducing sound leakage by setting anappropriate near-far aperture ratio (i.e., a ratio of the size of asound guiding hole at a near-ear point to the size of a sound guidinghole at a far-ear point). In some embodiments, the higher the frequencyband of the frequency division signal corresponding to the two pointsources is, the smaller the near-far aperture ratio may be. That is, asthe frequency band of the frequency division signal corresponding to thetwo point sources becomes higher, an aperture of the sound source at anear-ear point and an aperture of the sound source at a far-ear pointmay gradually become the same. For example, for two point sourcescorresponding to low-frequency signals, the aperture of the sound sourceat a near-ear point may be set larger than the aperture of the soundsource at a far-ear point. For two point sources corresponding tohigh-frequency signals, the aperture of the sound source at a near-earpoint may be set to be the same as or similar to that of the soundsource at a far-ear point.

In some embodiments, for the two point sources corresponding to lowfrequency signals, the near-far aperture ratio may not be less than 1.Optionally, the near-far aperture ratio may not be less than 5.Preferably, the near-far aperture ratio may not be less than 10. Morepreferably, the near-far aperture ratio may not be less than 15. Morepreferably, the near-far aperture ratio may not be less than 20. Morepreferably, the near-far aperture ratio may not be less than 25. Morepreferably, the near-far aperture ratio may not be less than 30.

In some embodiments, for the two point sources corresponding tohigh-frequency signals, the near-far aperture ratio may not be greaterthan 10. Preferably, the near-far aperture ratio may not be greater than8. More preferably, the near-far aperture ratio may not be greater than6. More preferably, the near-far aperture ratio may not be greater than4. More preferably, the near-far aperture ratio may not be greater than3. More preferably, the near-far aperture ratio may not be greater than2. More preferably, the near-far aperture ratio may be equal to 1.

In some embodiments, the user may obtain different listening effects byadjusting positions of different sound guiding holes. More descriptionsregarding positions of the sound guiding holes and the listeningposition may be found elsewhere in the present disclosure (e.g., FIG. 31and the description thereof). In some embodiments, in order to ensurethat the user has a better listening effect, the distance (denoted asD_(n)) between the center point of the sound source at a near-ear pointof each group of two point sources and the center point of the user'sear hole 4410 may not be greater than 10 cm. Preferably, 1), may not begreater than 9 cm. More preferably, D_(n) may not be greater than 8 cm.More preferably, D_(n) may not be greater than 7 cm. More preferably,D_(n) may not be greater than 6 cm. More preferably, D_(n) may not begreater than 5 cm. More preferably, D_(n) may not be greater than 4 cm.More preferably, D_(n) may not be greater than 3 cm. More preferably,D_(n) may not be greater than 2.5 cm. More preferably, D_(n) may not begreater than 2 cm. More preferably, D_(n) may not be greater than 1.5cm. More preferably, D_(n) may not be greater than 1 cm. Morepreferably, D_(n) may not be greater than 0.5 cm. More preferably, D_(n)may not be greater than 0.4 cm. More preferably, D_(n) may not begreater than 0.3 cm. More preferably, D_(n) may not be greater than 0.2cm. More preferably, D_(n) may not be greater than 0.1 cm.

In some embodiments, the open earphone 4100 may include a low-frequencyspeaker unit and a high-frequency speaker unit. The near-ear soundguiding holes corresponding to the low-frequency speaker unit and thenear-ear sound guiding holes corresponding to the high-frequency speakerunit may be combined into a single sound guiding hole. For example, asshown in FIG. 44, the first sound guiding hole 4142-1 and the thirdsound guiding hole 4142-3 may be combined into the sound guiding hole4142-5. In some embodiments, one end of the sound guiding hole 4142-5may be set on an end surface 4112, and the other end of the soundguiding hole 4142-5 may be set on an end surface 4114. In this way, whenthe user wears the open earphone 4100, the first sound guiding hole4142-1 and the third sound guiding hole 4142-3 (i.e., sound sources atthe near-ear point) may face the user's ear hole, such that a volume ofsound heard by the user may be higher. In some embodiments, a secondsound guiding hole 4142-2 may be set on the end surface 4112. A fourthsound guiding hole 4142-4 may be set on the end surface 4116. In someembodiments, the first sound guiding hole 4142-1, the second soundguiding hole 4142-2, the third sound guiding hole 4142-3, and the fourthsound guiding hole 4142-4 may be set on the end surface 4112 (or the endsurface 4116). In some embodiments, the third sound guiding hole 4142-3may be set on the end surface 4112, and the fourth sound guiding hole4142-4 may be set on an opposite side of the end surface 4112. In someembodiments, as shown in FIG. 41, the first sound guiding hole 4142-1and the second sound guiding hole 4142-2 may be set on any position ofthe front end of the housing 4110 (e.g., the end surface 4112, the endsurface 4114, or the end surface 4116). The third sound guiding hole4142-3 and the fourth sound guiding hole 4142-4 may be set on anyposition on the back end of the housing 4110. In some embodiments, thefirst sound guiding hole 4142-1 and the third sound guiding hole 4142-3may be set on the front end of the housing 4110, the second soundguiding hole 4142-2 and the fourth sound guiding hole 4142-4 may be seton the back end of the housing 4110. In some embodiments, when the userwears the open earphone 4100, the distance (denoted as D) between thecenter point of the sound guiding hole 4142-5 and the center point ofthe ear hole near the sound guiding hole (e.g, the ear hole 4410) maynot be greater than 10 cm. Preferably, D may not be greater than 9 cm.More preferably, D may not be greater than 8 cm. More preferably, D maynot be greater than 7 cm. More preferably, D may not be greater than 6cm. More preferably, D may not be greater than 5 cm. More preferably, Dmay not be greater than 4 cm. More preferably, D may not be greater than3 cm. More preferably, D may not be greater than 2.5 cm. Morepreferably, D may not be greater than 2 cm. More preferably, D may notbe greater than 1.5 cm. More preferably, D may not be greater than 1 cm.More preferably, D may not be greater than 0.5 cm. More preferably, Dmay not be greater than 0.4 cm. More preferably, D may not be greaterthan 0.3 cm. More preferably, D may not be greater than 0.2 cm. Morepreferably, D may not be greater than 0.1 cm.

In some embodiments, a baffle structure may be set between the two pointsources, such that the volume of sound leakage at the far field may notbe increased significantly and the volume of the listening at the nearfield may be significantly increased, thereby improving the user'slistening effect. More descriptions regarding improving the listeningeffect by setting the baffle between the two point sources may be foundelsewhere in the present disclosure (e.g., FIGS. 14-37 and thedescriptions thereof). In some embodiments, two low-frequency pointsources may include a sound guiding hole set at the near-ear point, anda corresponding sound guiding hole at the far-ear point set at the backend of the housing 4110. In this way, when the user wears the openearphone 4100, the sound source at the near-ear point may be separatedfrom the sound source at the far-ear point by the user's ear contour. Inthis situation, the ear contour may play a role of the baffle, whichsignificantly increases the volume of the listening at the near-fieldposition and improves the user's listening effect.

In some embodiments, as the internal friction or viscous force of mediumin a sound guiding tube may have a great impact on sound transmission, adiameter of the sound guiding tube may not be too small, otherwiseexcessive loss of sound may be caused and the output volume may bereduced. However, when the diameter of the sound guiding tube is toolarge and the transmitted sound is greater than a certain frequency,higher-order waves may be generated in the sound guiding tube.Therefore, in order to avoid the sound guiding tube from generatinghigher-order waves in the range of sound to be transmitted and ensureonly planar waves propagating along a direction of the sound guidingtube, the radius of the sound guiding tube may be set reasonably. Insome embodiments, the radius of the sound guiding tube may be 0.5 mm-10mm. Preferably, the radius of the sound guiding tube may be 0.5 mm-9 mm.More preferably, the radius of the sound guiding tube may be 0.7 mm-8mm. More preferably, the radius of the sound guiding tube may be 0.9mm-7.5 mm. More preferably, the radius of the sound guiding tube may be1 mm-7 mm. More preferably, the radius of the sound guiding tube may be1.5 mm-6.5 mm. More preferably, the radius of the sound guiding tube maybe 2 mm-6 mm. More preferably, the radius of the sound guiding tube maybe 2.5 mm-5.5 mm. More preferably, the radius of the sound guiding tubemay be 3 mm-5 mm. More preferably, the radius of the sound guiding tubemay be 3.5 mm-4.5 mm. More preferably, the radius of the sound guidingtube may be 3.7 mm-4.2 mm.

In some embodiments, the sound guiding tube may interact with animpedance of a nozzle (i.e., the sound guiding hole), causing a soundwith a specific frequency to form a standing wave in the sound guidingtube. The sound output from the sound guiding hole may formpeaks/valleys at certain frequencies, which affects the sound outputeffect. The longer the length of the sound guiding tube is, the lowerthe frequency of generating peaks/valleys may be and the greater thenumber (or count) of peaks/valleys may be. Preferably, the length of thesound guiding tube may not be more than 300 mm. More preferably, thelength of the sound guiding tube may not be more than 250 mm. Morepreferably, the length of the sound guiding tube is not more than 200mm. More preferably, the length of the sound guiding tube may not bemore than 150 mm. More preferably, the length of the sound guiding tubemay not be more than 100 mm. More preferably, the length of the soundguiding tube may not be more than 50 mm. More preferably, the length ofthe sound guiding tube may not be more than 30 mm. More preferably, thelength of the sound guiding tube may not be more than 20 mm. Morepreferably, the length of the sound guiding tube may not be more than 10mm. In some embodiments, an impedance matching layer may be set at thesound guiding hole to reduce the effect of peaks/valleys.

In some embodiments, a length-diameter ratio (i.e., a ratio of length todiameter) of a sound guiding tube may affect the sound inside the soundguiding tube, which has an effect of low-pass filtering and damping andeventually reduces the sound volume. The attenuation of the sound volumein a high frequency may be greater that in a low frequency. In order toensure that the attenuation of the sound volume does not affectlistening, the length-diameter ratio of the sound guiding tube may notbe greater than 200. Preferably, the length-diameter ratio of the soundguiding tube may not be greater than 180. More preferably, thelength-diameter ratio of the sound guiding tube may not be greater than160. More preferably, the length-diameter ratio of the sound guidingtube may not be greater than 150. More preferably, the length-diameterratio of the sound guiding tube may not be greater than 130. Morepreferably, the length-diameter ratio of the sound guiding tube may notbe greater than 110. More preferably, the length-diameter ratio of thesound guiding tube may not be greater than 80. More preferably, thelength-diameter ratio of the sound guiding tube may not be greater than50. More preferably, the length-diameter ratio of the sound guiding tubemay not be greater than 30. More preferably, the length-diameter ratioof the sound guiding tube may not be greater than 10.

In some embodiments, parameters (e.g., a length, a radius, alength-diameter ratio, etc.) of each sound guiding tube may be the sameor different. For example, the length of the first sound guiding tube4140-1 may be 5 mm, and the length of the second sound guiding tube4140-2 may be 30 mm. As another example, lengths of the first soundguiding tube 4140-1 and the third sound guiding tube 4140-3 may both be5 mm.

In some embodiments, as the phase of a frequency division signalcorresponding to each point source may be different and the volume ofthe listening and sound leakage may also be different, different outputeffects may be achieved by adjusting the phase of the each point source.In some embodiments, in order to reduce a far-field sound leakage of theopen earphone 4100, the acoustic driver 4130-1 may generatelow-frequency sounds with the same (or approximately equal) amplitudeand opposite (or approximately opposite) phases at the first soundguiding hole 4142-1 and the second sound guiding hole 4142-2,respectively. The acoustic driver 4130-2 may generate high-frequencysounds of equal (or approximately equal) amplitude and opposite (orapproximately opposite) phases at the third sound guiding hole 4142-3and the fourth sound guiding hole 4142-4, respectively. In someembodiments, the higher a frequency band of the frequency divisionsignal corresponding to the two point sources is, the larger the phasedifference may be. For example, for two point sources formed by settingtwo speaker units, if the two point sources correspond to low-frequencysignals, the phase difference of the low-frequency signals transmittedfrom the two point sources may be adjusted to be equal to orapproximately equal to 0°. If the two point sources correspond tohigh-frequency signals, the phase difference of the high-frequencysignals transmitted from the two point sources may be adjusted to beequal to or approximately equal to 180°. In some embodiments, byadjusting the phases of the two point sources, the phase difference ofthe two point sources at the near-field listening position (or thecenter of the ear hole) may be equal to or approximately equal to 0°,and the phase difference of the two point sources at the far field maybe equal to or approximately equal to 180°. In some embodiments, thephase difference of two point sources may be equal to 5°, 10°, 20°, 50°,70°, 90°, 100°, 120°, 130°, 150°, 170°, 175°, 180°, or the like, or anycombination thereof.

The circuit board 4160 may integrate one or more components to achieveone or more functions. For example, a frequency division processing unitmay be integrated on the circuit board 4160 to implement a frequencydivision process on audio signals. As another example, a signalprocessing unit may be integrated on the circuit board to adjust thephase and amplitude of the audio signals. The Bluetooth module 4170 maybe used to enable the open earphone 4100's communication with externaldevices. For example, the open earphone 4100 and external audioequipment may communicate through the Bluetooth module 4170. In someembodiments, the Bluetooth module 4170 may be integrated on the circuitboard 4160. The power module 3880 may be used to provide power to one ormore components of the open earphone 4100. In some embodiments, thepower module 3880 may include a storage battery, a dry battery, alithium battery, a Daniel battery, a fuel cell, or the like. Structuressuch as the circuit board 4160, the Bluetooth module 4170, and the powermodule 3880 of the open earphone 4100 may be set with reference tosettings of conventional headphones, and is not repeated here.

It should be noted that the above description of the open earphone 4100is merely for illustrative purposes, and not intended to limit the scopeof the present disclosure. For those skilled in the art, various changesand modifications may be made according to the description of thepresent disclosure. The feature, structure, method, and other featuresof the exemplary embodiment described herein may be combined in variousways to obtain additional and/or alternative exemplary embodiments. Insome embodiments, the open earphone 4100 may include one or moreadditional components. Additionally or alternatively, one or morecomponents of the open earphone 4100 may be omitted. For example, afeedback microphone may be added to the open earphone 4100. The feedbackmicrophone may be used to reduce residual noise (e.g., circuit currentnoise). As another example, the baffle 4150 may be omitted. As anotherexample, one or more buttons (e.g., a volume up button, a volume downbutton, a power on/off button, a Bluetooth switch, etc.) may be set onthe housing 4110. As another example, the housing 4110 may be designedas a waterproof structure. For details, see descriptions elsewhere inthe present disclosure (e.g., FIGS. 46-65 and descriptions thereof). Asanother example, the open earphone 4100 may be connected to the userterminal through the Bluetooth module 4170. The user terminal maydisplay a control interface, through which the user may send controlinstructions such as increasing/decreasing the volume. The controlinstructions may be received by the Bluetooth module 4170 for furthercontrolling the open earphone 4100. In some embodiments, the Bluetoothmodule 4170 may be omitted. The open earphone 4100 may communicate withexternal devices via a data cable.

FIG. 45A is a schematic diagram illustrating an exemplary frequencyresponse 4510 of the first speaker unit 4130-1 and an exemplaryfrequency response 4520 of the second speaker unit 4130-2 according tosome embodiments of the present disclosure. FIG. 45B is a schematicdiagram illustrating an exemplary frequency response 4510 of the firstspeaker unit 4130-1 and another exemplary frequency response 4520 of thesecond speaker unit 4130-2 according to some embodiments of the presentdisclosure. The first speaker unit 4130-1 may process an audio signal togenerate a first frequency division signal. The second speaker unit4130-2 may process an audio signal to generate a second frequencydivision signal. In the frequency division signals, the second frequencydivision signal may be adjacent to the first frequency division signal nthe frequency domain.

In some embodiments, the frequency responses of the first speaker unit4130-1 and the second speaker unit 4130-2 may have the same frequencybandwidth. For example, as shown in FIG. 45A, the frequency response4510 of the first speaker unit 4130-1 may include a low half power pointf1, a high half power point f2, and a center frequency f3. As usedherein, a half-power point of a certain frequency response may refer toa frequency point with a specific power suppression (e.g., −3 dB). Thefrequency bandwidth of frequency response 4510 may be equal to thedifference between f2 and f1. The frequency response 4520 of the secondspeaker unit 4130-2 may include a low half power point f2, a high halfpower point f4, and a center frequency f5. The frequency bandwidth offrequency response 4520 may be equal to the difference between f4 andf2. The frequency bandwidths of the first speaker unit 4130-1 and thesecond speaker unit 4130-2 may be equal to each other.

In some embodiments, the frequency responses of the first speaker unit4130-1 and the second speaker unit 4130-2 may have different frequencybandwidths. For example, as shown in FIG. 45B, the frequency response4530 of the second speaker unit 4130-2 may include a low half powerpoint f2, a high half power point f7 (greater than f4), and a centerfrequency f6. The frequency bandwidth 4530 of the second speaker unit4130-2 may be equal to the difference between f7 and f2, which isgreater than the frequency bandwidth of the frequency response 4510 ofthe first speaker unit 4130-1.

In some embodiments, the frequency responses of the first speaker unit4130-1 and the second speaker unit 4130-2 may intersect at a specificfrequency point. The intersection point of the frequency responses maycause a certain overlapping range between the first and second frequencyresponses. In an ideal case, there may be no overlapping between thefrequency responses of the first speaker unit 4130-1 and the secondspeaker unit 4130-2. However, in practice, there may be a certainoverlapping range, causing an interference between the first frequencydivision signal and the second frequency division signal and affectingthe quality of the first frequency division signal and the secondfrequency division signal. For example, the larger the overlapping rangeis, the larger the interference may be, and the lower the quality of thefirst and second frequency division signals may be.

In some embodiments, the specific frequency point where the frequencyresponses of the first speaker unit 4130-1 and the second speaker unit4130-2 intersect may be close to the half power point of the frequencyresponse of the first speaker unit 4130-1 and/or the half power point ofthe frequency response of the second speaker unit 4130-2. Taking FIG.45A as an example, the frequency response 4510 and the frequencyresponse 4520 may intersect at a high half power point f2 of thefrequency response 4510, wherein the intersection point may be a lowhalf power point of the frequency response 4520. As used herein, if apower level difference between a frequency point and a half power pointis not greater than a threshold (e.g., 2 dB), the frequency point may beconsidered to be close to the half power point. In this case, there maybe less energy loss or repetition in the frequency responses of thefirst speaker unit 4130-1 and the second speaker unit 4130-2, which mayresult in an appropriate overlapping range between the frequencyresponses of the first speaker unit 4130-1 and the second speaker unit4130-2. For example, when the half power point is −3 dB and thethreshold is −2 dB, if the frequency responses intersect at a frequencypoint at a power level greater than −5 dB and/or less than −1 dB, theoverlap range may be considered to be relatively small. In someembodiments, a center frequency and/or bandwidth of the frequencyresponses of the first speaker unit 4130-1 and the second speaker unit4130-2 may be adjusted to obtain a narrower or appropriate overlappingrange between the frequency responses of the first speaker unit 4130-1and the second speaker unit 4130-2, which may avoid an overlap betweenthe frequency bands of the first and second frequency division signals.

It should be noted that the examples shown in FIGS. 45A and 45B aremerely for illustration purposes, and not intended to limit the scope ofthe present disclosure. For those skilled in the art, many changes andmodifications may be made under the teaching of the present disclosure.However, those variations and modifications do not depart from the scopeof the present disclosure. For example, one or more parameters (e.g.,the frequency bandwidth, the high half power point, the low half powerpoint, and/or the center frequency) of the frequency response(s) of thefirst speaker unit 4130-1 and/or the second speaker unit 4130-2 may bevariable.

FIG. 46 is a schematic diagram illustrating an exemplary open earphoneaccording to some embodiments of the present disclosure. As shown inFIG. 46, the open earphone 4600 may be referred to as a headbandearphone. The open earphone 4600 may have a similar configuration to theopen earphone 4100. For example, the open earphone 4600 may include ahousing 4610, a microphone, acoustic drivers (e.g., speaker units),sound guiding tubes corresponding to the acoustic drivers, a baffle, acircuit board, a Bluetooth module, a power module, etc. A first soundguiding hole 4620-1, a second sound guiding hole 4620-2, a third soundguiding hole 4620-3, and a fourth sound guiding hole 4620-4corresponding to the acoustic drivers may be set on the housing 4310. Asshown in FIG. 46, the first sound guiding hole 4620-1 and the secondsound guiding hole 4620-2 of the open earphone 4600 may correspond to alow-frequency speaker unit; and the third sound guiding hole 4620-3 andthe fourth sound guiding hole 4620-4 may correspond to a high-frequencyspeaker unit. In some embodiments, the first sound guiding hole 4620-1may be set on the end face 4614, the second sound guiding hole 4620-2may be set on the end surface 4612 and located at the top of the housing4610, and the third sound guiding hole 4620-3 and the fourth soundguiding hole 4620-4 may be set on the end surface 4612 and located atthe middle of the left end and/or the right end of the housing 4610.More descriptions regarding the open earphone 4600 may refer to thedescription of the open earphone 4100, and are not repeated here. Forexample, when the user wears the open earphone 4600, the distancebetween the center point of the first sound guiding hole 4620-1 and thecenter point of the user's ear hole on the nearest side may be the sameas the distance between the center point of the sound guiding hole4142-5 in the open earphone 4400 and the center point of the user's earhole on the nearest side. As another example, the shapes and sizes ofthe first sound guiding hole 4620-1, the second sound guiding hole4620-2, the third sound guiding hole 4620-3 and the fourth sound guidinghole 4620-4 in the open earphone 4600 may be the same as that of thefirst sound guiding hole 4142-1, the second sound guiding hole 4142-2,the third sound guiding hole 4142-3 and the fourth sound guiding hole4142-4 in the open earphone 4100, respectively.

It should be noted that the ear hook earphone may be taken as an exampleto illustrate the open earphone disclosed in the present disclosure, andnot intended to limit the application scope of the present disclosure inother open earphones. The positions of the acoustic drivers, soundguiding tubes, and sound guiding holes on the open earphone disclosed inthe present disclosure may also be for illustration purposes, and notintended to limit the scope of the present disclosure. For those skilledin the art, various changes and modifications may be made according tothe description of the present disclosure. The feature, structure,method, and other features of the exemplary embodiment described hereinmay be combined in various ways to obtain additional and/or alternativeexemplary embodiments. For example, the open earphone 4100 may includethree speaker units, and the three speaker units may respectivelycorrespond to a low-frequency audio signal, a medium-frequency audiosignal, and a high-frequency audio signal (i.e., a low-frequency speakerunit, a medium-frequency speaker unit, and a high-frequency speakerunit). The low-frequency speaker unit and a corresponding sound guidingtube and a corresponding sound guiding hole may be located at the frontend of the housing 4110. The medium-frequency speaker unit and acorresponding sound guiding tube and a corresponding sound guiding holemay be located at the middle of the housing 4110. The high-frequencyspeaker unit and corresponding sound guiding tube and sound guiding holemay be located at the back end of the housing 4110. As another example,the low-frequency speaker unit, the medium-frequency speaker unit andthe high-frequency speaker unit may be set at the back end of thehousing 4110, and each sound guiding hole may be located at the frontend of the housing 4110 through corresponding sound guiding tubes. Asanother example, the high-frequency/low-frequency speaker units in theopen earphone 4600 may correspond to four sound guiding tubes and foursound guiding holes. The four sound guiding holes may be divided intotwo pairs, each of which is respectively set on the left or right sideof the housing 4610 as a low-frequency two point sources for the left orright ear of the user.

FIG. 47 is a schematic diagram illustrating an exemplary structure of anear hook of the open earphone 200 shown in FIG. 3 according to someembodiments of the present disclosure. FIG. 48 is a schematic diagramillustrating a partial cross-sectional view of the open earphone 200shown in FIG. 3 according to some embodiments of the present disclosure.In some embodiments, describing in connection with FIGS. 3, 47 and 48,the ear hook 10 may include an elastic metal wire 11, a lead wire 12, afixed casing 13, and a plug end 14 and a plug end 15 set at both ends ofthe elastic metal wire 11. In some embodiments, the ear hook 10 may alsoinclude a protective casing 16 and a housing casing 17 that isintegrally formed with the protective casing 16. The protective casing16 may be injection-molded on the periphery of the elastic wire 11, thewire 12, the fixed casing 13, the plug end 14, and the plug end 15, suchthat the protective casing 16 may be fixedly connected to the elasticmetal wire 11, the wire 12, the fixed casing 13, the plug end 14 and theplug end 15, respectively. Therefore, it is not necessary toinjection-mold the protective casing 16 separately to cover theperiphery of the elastic wire 11, the plug end 14, and the plug end 15,thereby the manufacturing and assembling process may be simplified, andthe protective casing 16 may be more firmly and stably fixed.

In some embodiments, when the protective casing 16 is molded, thehousing casing 17 may be integrally molded with the protective casing 16on a side near the plug end 15 simultaneously. In some embodiments, thehousing casing 17 may be integrally molded with the protective casing 16into a whole. The circuit housing 30 may be connected to one end of theear hook 10 by fixing with the plug end 15. A socket 22 of the chiphousing 20 may be connected to another end of the ear hook 10 by fixingwith the plug end 14. The housing casing 17 may cover the periphery ofthe circuit housing 30. In some embodiments, the protective casing 16and the housing casing 17 may be made of a soft material with a certainelasticity, such as soft silicone, rubber, or the like. In someembodiments, the housing casing 17 may include a bag-shaped structurewith one end open, such that the circuit housing 30 may enter the insideof the housing casing 17 through the open end of the housing casing 17.Specifically, the open end of the housing casing 17 may be an end of thehousing casing 17 departing from the protective casing 16, such that thecircuit housing 30 may enter the inside of the housing casing 17 fromthe end of the housing casing 17 away from the protective casing 16 andbe covered by the housing casing 17.

FIG. 49 is a schematic diagram illustrating a partially enlarged view ofpart E in FIG. 3 according to some embodiments of the presentdisclosure. In connection with FIGS. 3 and 47, in some embodiments, anannular flange 171 protruding inward may be set on the open end of thehousing casing 17. The end of the circuit housing 30 away from the earhook 10 may be set as a stair shape, thereby forming an annular platform37. When the housing casing 17 covers the periphery of the circuithousing 30, the annular flange 171 may be in contact with the annularplatform 37. The annular flange 171 may be formed by the inner wallsurface of the open end of the housing casing 17 protruding to a certainthickness toward the inside of the housing casing 17. The annular flange171 may include a flange surface 172 facing the ear hook 10. The annularplatform 37 may be opposite to the flange surface 172 and face adirection of the circuit housing 30 departing from the ear hook 10. Theheight of the flange surface 172 of the annular flange 171 may not begreater than the height of the annular platform 37, such that when theflange surface 172 of the annular flange 171 is in contact with theannular platform 37, the inner wall surface of the housing casing 17 maybe in fully contact with the sidewall surface of the circuit housing 30,such that the housing casing 17 may tightly cover the periphery of thecircuit housing 30. In some embodiments, a sealant may be applied in ajoint region of the annular flange 171 and the annular platform 37.Specifically, when the housing casing 17 is coated, a sealant may bepasted on the annular platform 37 to firmly connect the housing casing17 with the circuit housing 30.

In some embodiments, a positioning block 38 may be set on the circuithousing 30. The positioning block 38 may be configured on the annularplatform 37. The positioning block 38 may extend along a direction ofthe circuit housing 30 away from the ear hook 10. Specifically, thepositioning block 38 may be configured on an auxiliary sidewall 34 ofthe circuit housing 30. A thickness of the positioning block 38protruding on the auxiliary sidewall 34 may be consistent with theheight of the annular platform 37. One or more positioning blocks 38 maybe set according to requirements. Accordingly, a positioning groove 173corresponding to the positioning block 38 may be configured at theannular flange 171 of the housing casing 17, such that when the housingcasing 17 covers the periphery of the circuit housing 30, thepositioning groove 173 may cover at least a portion of the positioningblock 38.

FIG. 50 is a schematic diagram illustrating an exemplary exploded viewof a circuit housing and a button structure according to someembodiments of the present disclosure. FIG. 51 is a schematic diagramillustrating an exemplary partial cross-sectional view of a circuithousing, a button structure, and an ear hook according to someembodiments of the present disclosure. FIG. 52 is a schematic diagramillustrating an exemplary partial enlarged view of part G shown in FIG.51 according to some embodiments of the present disclosure. Inconnection with FIGS. 3, 50, 51, and 52, in some embodiments, a buttonstructure may be set on the open earphone 200. In some embodiments, thecircuit housing 30 may be set as a flat shape. Two sidewalls oppositelyconfigured with relatively large areas of the circuit housing 30 may bethe main sidewalls 33. Two sidewalls oppositely configured withrelatively small areas connected to the two main sidewalls 33 may beauxiliary sidewalls 34. A first recessed area 341 may be set on theouter surface of each auxiliary sidewall 34 of the circuit housing 30. Abutton hole 342 may be further set in the first recessed area 341. Thebutton hole 342 may connect the outer surface and the inner surface ofthe auxiliary sidewall 34. The auxiliary sidewalls 34 of the circuithousing 30 may include an auxiliary sidewall 34 facing the back side ofa user's head when the user wears the open earphone 200, and may alsoinclude an auxiliary sidewall 34 facing the lower side of the user'shead when the user wears the open earphone 200. The number (or count) ofthe first recessed areas 341 may be one or more. One or more buttonholes 342 may be set in each first recessed area 341 according to actualrequirements, which is not specifically limited herein.

In some embodiments, the open earphone 200 may also include an elasticpad 82 and a button 83, and the control circuit 60 may include a buttoncircuit board 61. The elastic pad 82 may be set on the first recessedarea 341. Specifically, the elastic pad 82 may be fixed on the outersurface of an auxiliary sidewall 34 corresponding to the first recessedarea 341 to cover the outside of the button hole 342. Thereby, theelastic pad 82 may play a role of sealing and waterproofing, such thatexternal liquid may be prevented from entering the inside of the circuithousing 30 through the button hole 342. In some embodiments, a secondrecessed area 821 corresponding to the button hole 342 may be set on theelastic pad 82. The second recessed area 821 may extend to the inside ofthe button hole 342. In some embodiments, the elastic pad 82 may be madeof a soft material, such as a soft silicone or rubber. In addition, theelastic pad 82 may be thin. It may be difficult for the thin elastic pad82 to be adhered firmly when the thin elastic pad 82 is directly bondedto the outer surface of the auxiliary sidewall 34. As the elastic pad 82is set between the button 83 and the button hole 342, when the userpresses the button, the elastic pad 82 may generate a force opposite tothe pressing direction due to the deformation, preventing the buttonfrom moving relative to the button hole 342.

In some embodiments, a rigid pad 84 may be disposed between the elasticpad 82 and the circuit housing 30. The rigid pad 84 and the elastic pad82 may be closely fixed to each other, specifically, by means of gluing,bonding, injection molding, etc. The rigid pad 84 and the auxiliarysidewall 34 may further be bonded. Specifically, double-sided adhesivemay be used to form an adhesive layer between the rigid pad 84 and theauxiliary sidewall 34, such that the elastic pad 82 may be firmly fixedon the outer surface of the auxiliary sidewall 34. In addition, as theelastic pad 82 is soft and thin, it is difficult to maintain a flatstate when the user presses the button. By abutting the rigid pad 84,the elastic pad 82 may be kept flat.

In some embodiments, a through hole 841 may be set on the rigid pad 84,such that the second recessed area 821 of the elastic pad 82 may furtherextend to the inside of the button hole 342 through the through hole841. In some embodiments, the rigid pad 84 may be made of stainlesssteel, or other rigid materials (e.g., plastic). The rigid pad 84 mayabut the elastic pad 82 by integral molding.

In some embodiments, the button 83 may include a button body 831 and abutton contact point 832 protruding on a side of the button body 831.The button body 831 may be disposed on a side of the elastic pad 82 awayfrom the circuit housing 30, and the button contact point 832 may extendto the inside of the second recessed area 821 and further extend to thebutton hole 342. As the open earphone 200 in this embodiment isrelatively thin and light and the pressing travel of the button 83 isshort, using a soft button may reduce the user's pressing feeling andbring an unsatisfactory experience, while using the button 83 made of ahard plastic material may bring a well pressing feeling for the user.

The button circuit board 61 may be disposed inside the circuit housing30, and a button switch 611 corresponding to the button hole 342 may beset on the button circuit board 61. Therefore, when the user presses thebutton 83, the button contact point 832 may contact and trigger thebutton switch 611 to further implement corresponding function.

In this embodiment, by setting the second recessed area 821 on theelastic pad 82, on one hand, the second recessed area 821 may cover theentire button hole 342, thereby improving the waterproof performance. Onthe other hand, in the natural state, the button contact point 832 mayextend to the inside of the button hole 342 through the second recessedarea 821, thereby shortening the button pressing travel and reducing thespace occupied by the button structure. Therefore, the open earphone 200may both have a good waterproof performance and occupy less space.

In some embodiments, the button 83 may include one or more button singlebodies 833. In an application scenario, the button 83 may include atleast two button single bodies 833 disposed away from each other and atleast one connecting portion 834 connected to the button single bodies833. The button single bodies 833 and the connecting portion(s) 834 maybe integrally formed. Correspondingly, a button contact point 832 may beset on each button single body 833. Each button single body 833 mayfurther correspond to a button hole 342 and a button switch 611. Aplurality of button single bodies 833 may be set on each of the firstrecessed areas 341. The user may trigger different button switches 611by pressing different button single bodies 833 to further realizevarious functions.

In some embodiments, elastic bumps 822 may be set on the elastic pad 82for supporting the connecting portion 834. As the button 83 includes aplurality of connected button single bodies 833, the setting of theelastic bumps 822 may enable a specific button single body 833 beingindividually pressed when the user presses the specific button singlebody 833, avoiding other button single bodies 833 being pressed togetherdue to linkage. Thereby, the ability to accurately trigger thecorresponding button switch 611 may be provided. It should be noted thatthe elastic bump 822 may not be necessary. For example, the elastic bump822 may be a protruding structure without elasticity, or the protrudingstructure may not be set according to actual requirements. In someembodiments, a groove 174 corresponding to the button 83 may be set onthe inner wall of the housing casing 17, such that the outer peripheryof the circuit housing 30 and the button may be coated.

FIG. 53 is a schematic diagram illustrating an exemplary exploded viewof a partial structure of a circuit housing and auxiliary pieceaccording to some embodiments of the present disclosure. FIG. 54 isschematic diagram illustrating an exemplary partial structure of acircuit housing and an auxiliary piece according to some embodiments ofthe present disclosure. In connection with FIGS. 3, 53 and 54, in someembodiments, the open earphone 200 may also include the auxiliary piece86 located inside the circuit housing 30. The auxiliary piece 86 mayinclude a board 861. A hollowed area 8611 may be set on the board 861.The board 861 may be disposed on the inner surface of the main sidewall33 by means of hot melting, hot pressing, or bonding, such that amounting hole 331 set on the main sidewall 33 may be located inside thehollowed area 8611. Specifically, the board surface of the board 861 mayabut the inner surface of the main sidewall 33 in parallel. Theauxiliary piece 86 may have a certain thickness. When disposed on theinner surface of the main sidewall 33, the auxiliary piece 86 with theinner sidewall of the hollowed area 8611 of the auxiliary piece 86 andthe main sidewall 33 may together form a glue groove 87 located at theperiphery of the conductive column 85 inserted into the mounting hole331.

In some embodiments, a sealant may be applied in the glue groove 87 toseal the mounting hole 331 from the inside of the circuit housing 30 toimprove a sealing performance of the circuit housing 30, therebyimproving the waterproof performance of the open earphone 200.

In some embodiments, the material of the auxiliary piece 86 may be thesame as that of the circuit housing 30. The auxiliary piece 86 may bemolded separately from the circuit housing 30. It should be noted that,during the molding stage of the circuit housing 30, there may often beother structures near the mounting hole 331, such as molding the buttonhole 342. Molds corresponding to these structures during molding mayneed to be removed from the inside of the circuit housing 30. At thistime, if the glue groove 87 corresponding to the mounting hole 331 isintegrally formed directly inside the circuit housing 30, the protrusionof the glue groove 87 may interfere with the removal of the molds ofthese structures, thereby causing inconvenience in production. In thisembodiment, the auxiliary piece 86 and the circuit housing 30 may beseparate structures. After the two structures being separately molded,the auxiliary piece 86 may be installed inside the circuit housing 30and form the glue groove 87 together with the main sidewall 33 of thecircuit housing 30, such that during the molding stage of the circuithousing 30, the molds of part of the structures may not be blocked whenremoving from the inside of the circuit housing 30, which causes asmooth progress in production.

In some embodiments, when the circuit housing 30 is molded, the removalof the molds may only occupy a part of the space of the glue groove 87.A part of the glue groove 87 may be integrally formed on the innersurface of the main sidewall 33 without affecting the removal of themold, and the other part of the glue groove 87 may still be formed bythe auxiliary piece 86.

In some embodiments, a first strip rib 332 may be integrally formed onthe inner surface of the main sidewall 33, and the location of the firststrip rib 332 may not affect the removal of the mold of the circuithousing 30. A notch 8612 may be set in the hollowed area 8611 of theauxiliary piece 86. The first stripe rib 332 may correspond to the notch8612. After the circuit housing 30 and the auxiliary piece 86 beingrespectively formed, the auxiliary piece 86 may be placed on the innersurface of the main sidewall 33, such that the first strip rib 332 atleast partially fits the notch 8612, and then the first strip rib 332and the auxiliary piece 86 may cooperate to make the glue groove 87closed.

In this embodiment, as the first strip rib 332 may not block the removalof the molds, the sidewall of the glue groove 87 may be composed of thefirst strip rib 332 and auxiliary piece 86 which are integrally formedon the inner surface of the main sidewall 33.

In some embodiments, the first stripe rib 332 may further extend to abutthe side edge 8613 of the board 861, thereby positioning the board 861.The first strip rib 332 may include a rib main body 3321 and apositioning arm 3322. The rib main body 3321 may be configured to matchand fit the notch 8612 of the hollowed area 8611, thereby forming asidewall of the glue groove 87. The positioning arm 3322 may be formedby extending from one end of the rib main body 3321 to a side edge 8613of the board 861 to abut the side edge 8613, thereby positioning theboard 861 at the side edge 8613.

In some embodiments, the height of the first strip rib 332 protruding onthe inner surface of the main sidewall 33 may be greater than, lessthan, or equal to the thickness of the auxiliary piece 86, as long asthe first strip rib 332 can form the glue groove 87 together with theauxiliary piece 86 and position the board 861 of the auxiliary piece 86,which is not specifically limited herein.

In some embodiments, a positioning hole 8614 may be set on the board861. The positioning hole 8641 may pass through a motherboard surface ofthe board 861. A positioning column 333 corresponding to the positioninghole 8614 may be integrally formed on the inner surface of the mainsidewall 33. After the auxiliary piece 86 being set on the inner surfaceof the main sidewall 33, the positioning column 333 may be inserted intothe positioning hole 8614, thereby further positioning the auxiliarypiece 86. The numbers (counts) of the positioning holes 8614 and thepositioning columns 333 may be the same. In some embodiments, thenumbers of the positioning holes 8614 and the positioning columns 333may both be two.

In an application scenario, at least two lugs 8615 may be formed on theside edge 8613 of the board 861, and two positioning holes 8614 may berespectively disposed on the corresponding lugs 8615. A second strip rib334 may be integrally formed on the inner surface of the main sidewall33. The second strip rib 334 may be extended in a direction toward theauxiliary sidewall 34, and be perpendicular to an extending direction ofthe positioning arm 3322 of the first strip rib 332. A positioninggroove 8616 with a strip shape corresponding to the second strip rib 334may be set on the board 861. The positioning groove 8616 may be recessedin a direction away from the main sidewall 33. One end of thepositioning groove 8616 may be connected to the side edge 8613 of theboard 861 and be perpendicular to the side edge 8613.

In an application scenario, the positioning groove 8616 may be formedonly by a recessed surface of the board 861 that is conformed to themain sidewall 33. The depth of the positioning groove 8616 may be lessthan the thickness of the board 861. At this time, the surface of theboard 861 opposite to the recessed surface may not be affected by thepositioning groove 8616. In another application scenario, the depth ofthe positioning groove 8616 may be greater than the depth of the board861, such that when a surface of the board 861 near the main sidewall 33is recessed, the other opposite surface protrudes toward the recesseddirection, thereby cooperating to form the positioning groove 8616.After the auxiliary piece 86 being set on the inner surface of the mainsidewall 33, the second strip rib 334 may be embedded in the strippositioning groove 8616 with strip shape to further position the board861.

In connection with FIG. 3, FIG. 49 and FIG. 50, in some embodiments, anexposed hole 175 corresponding to the conductive column 85 may be set onthe housing casing 17. After the housing casing 17 being covered aroundthe periphery of the circuit housing 30, an end of the conductive column85 located outside the circuit housing 30 may further be exposed throughthe exposed hole 175 to be further connected to external circuits of theopen earphone 200, such that the open earphone 200 may be charged ortransmit data through the conductive column 85.

In some embodiments, the outer surface of the circuit housing 30 may berecessed with a glue groove 39 surrounding a plurality of mounting holes331. Specifically, the shape of the glue groove 39 may be an oval ring,and the plurality of mounting holes 331 may be respectively set on thecircuit housing 30 surrounded by the groove 39. A sealant may be appliedon the glue groove 39. After the housing casing 17 and the circuithousing 30 being assembled, the housing casing 17 may be in sealedconnection with the circuit housing 30 through the sealant at theperipheries of the mounting holes 331, such that when external liquidenters the inside of the housing casing 17 through the exposed hole 175,the housing casing 17 may slide around the periphery of the circuithousing 30. In addition, the mounting hole 331 may be further sealedfrom the outside of the circuit housing 30 to further improve thesealing performance of the circuit housing 30, thereby improving thewaterproof performance of the open earphone 200.

It should be noted that the above description of the open earphone 200is merely for illustration purposes, and not intended to limit the scopeof the present disclosure. For those skilled in the art, various changesand modifications may be made according to the description of thepresent disclosure. However, the changes and modifications may notdepart from the spirit of the present disclosure. For example, thenumber (or count) of the first recessed areas 341 may be one or more,and one or more button holes 342 may be set on each of the firstrecessed areas 341, which is not limited herein. All such modificationsare within the scope of the present disclosure.

FIG. 55 is a schematic diagram illustrating an exemplary cross-sectionalview of a circuit housing, a conductive column, and a main controlcircuit board according to some embodiments of the present disclosure.FIG. 56 is a schematic diagram illustrating an exemplary partialenlarged view of part H in FIG. 11 according to some embodiments of thepresent disclosure. FIG. 57 is a schematic diagram illustrating anexemplary conductive column according to some embodiments of the presentdisclosure.

As shown in FIG. 55, in some embodiments, the open earphone 200 mayinclude at least one conductive column, and the control circuitcontained in the circuit housing 30 may include the main control circuitboard 62. The conductive column may connect the main control circuitboard 62 inside the circuit housing 30 and a charging circuit and/ordata transmission line outside the circuit housing 30 to charge the openearphone 200 and/or transmit data for the open earphone 200.

In connection with FIGS. 55-57, in some embodiments, at least onemounting hole 331 may be set on the main sidewall 33 of the circuithousing 30. The conductive column 85 may be inserted into thecorresponding mounting hole 331. The conductive column 85 and themounting hole 331 may correspond in a one-to-one manner. In thisembodiment, the numbers (counts) of the conductive columns 85 and themounting holes 331 may both be four. The four conductive columns 85 maybe respectively inserted into the corresponding mounting holes 331, andbe arranged side by side in a straight line at regular intervals. Twoconductive columns 85 located at the outside may be used as charginginterfaces, and two conductive columns 85 located at the middle may beused as data transmission interfaces.

In some embodiments, for each of the conductive columns 85, theconductive column 85 may include a columnar body 851 inserted into themounting hole 331. In some embodiments, a positioning protrusion 852 maybe set on the outer peripheral surface of the columnar body 851. Thepositioning protrusion 852 may be engaged with the inner surface of themain sidewall 33, thereby fixing the conductive column 85 to themounting hole 331. Specifically, the positioning protrusion 852 may beset in an annular shape around the circumferential direction of thecolumnar body 851. An extended inclined surface 853 connecting the outerperipheral surface of the columnar body 851 and the positioningprotrusion 852 may be set on a side of the annular positioningprotrusion 852 facing the inside of the circuit housing 30. Wheninstalling the conductive column 85, the conductive column 85 may begradually inserted into the inside of the circuit housing 30 along theextended inclined surface 853 and the mounting hole 331 from the outsideof the circuit housing 30. Further, the positioning protrusion 852 maycompletely pass the mounting hole 331. The positioning protrusion 852may face a platform outside the circuit housing 30, and be engaged withthe inner surface of the main sidewall 33, such that the conductivecolumn 85 may be fixed in the mounting hole 331 through the positioningprotrusion 852.

In this embodiment, by the setting of the positioning protrusion 852during the assembly process, the conductive column 85 may be insertedinto the mounting hole 331 from the outer surface of the main sidewall33 of the circuit housing 30. Further, the positioning protrusion 852may be pressed into the mounting hole 331 so as to be fixed to the innersurface of the main sidewall 33 of the circuit housing 30 withoutinstalling from the inside of the circuit housing 30. As a result, theassembly of the open earphone 200 may be more convenient and efficiencyof production may be improved. Further, by the setting of the extendedinclined surface 853, the positioning protrusion 852 may pass throughthe mounting hole 331 more smoothly during the assembly process. Thepositioning protrusion 852 may enable the conductive column 85 to beengaged with the inner surface of the main sidewall 33 when theconductive column 85 enters the mounting hole 331, such that theconductive column 85 may be firmly fixed in the mounting hole 331.

In some embodiments, the columnar body 851 may be divided into a firstcolumnar body 8511 and a second columnar body 8512, with respect to aninsertion direction of the columnar body 851 along the mounting hole331. The two columnar bodies may be integrally formed by a conductivemetal material such as copper, silver, or an alloy into an integratedstructure. In a direction perpendicular to the insertion direction ofthe conductive column 85 into the mounting hole 331, a cross section ofthe first columnar body 8511 may be larger than a cross section of thesecond columnar body 8512. The positioning protrusion 852 may be set onthe second columnar body 8512.

In some embodiments, the mounting hole 331 may be divided into a firsthole section 3311 and a second hole section 3312 corresponding to thefirst columnar body 851 and the second columnar body 852 in crosssection along the insertion direction, and an annular platform 3313 maybe formed at the junction of the first hole section 3311 and the secondhole section 3312. The annular platform 3313 may connect the outersurface of the main sidewall 33. When the columnar body 851 is insertedinto the mounting hole 331, a side of the first columnar body 8511facing the second columnar body 8512 may be supported on the annularplatform 3313. At the same time, a side of the positioning protrusion852 on the outer peripheral surface of the second columnar body 8512facing the first columnar body 8511 may be engaged with the innersurface of the main sidewall 33. Therefore, the conductive column 85 maysimultaneously be engaged with both the inner and outer sides of themain sidewall 33 around the mounting hole 331, such that the conductivecolumn 85 may be fixed in the mounting hole 331.

In some embodiments, an accommodating cavity 8513 along the axialdirection may be set on the columnar body 851. An open end of theaccommodating cavity 8513 may be on an end surface of the secondcolumnar body 8512 facing the inside of the circuit housing 30. In someembodiments, the accommodating cavity 8513 may pass through a portion ofthe second columnar body 8512 located at the inner side of the circuithousing 30 along a direction parallel to the insertion direction, andstop before reaching the positioning protrusion 852. In someembodiments, the specific position of the accommodating cavity 8513 maybe set according to requirements, which is not limited herein.

In some embodiments, the conductive column 85 may also include a spring854 inside the accommodating cavity 8513 and a conductive contact point855. One end of the conductive contact point 855 may abut the spring 854inside the accommodating cavity 8513, and the other end of theconductive contact point 855 may be exposed to the inside of the circuithousing 30 through the open end of the accommodating cavity 8513. Insome embodiments, the material of the conductive contact point 855 maybe the same as that of the columnar body 851. The spring 854 may beconnected to the second columnar body 851 and the conductive contactpoint 855 by a certain manner such as bonding or welding. Alternatively,the spring 854 may be directly placed in the accommodating cavity 8513and elastically clamped in the accommodating cavity 8513 through theengagement of the columnar body 851 and the main sidewall 33 of thecircuit housing 30 and the engagement of the conductive contact point855 and the main control circuit board 62.

In some embodiments, contacts corresponding to the position of theconductive column 85 may be set on the main control circuit board 62inside the circuit housing 30. In some embodiments, the main controlcircuit board 62 may include a main surface 622 with a relatively largearea and a side surface 623 with a relatively small area connected tothe main surface 622. The main surface 622 of the main control circuitboard 62 may be parallel or approximately parallel to the main sidewall33 of the circuit housing 30, and the contacts may be correspondinglydisposed on the main surface 622 of the main control circuit board 62.

The insertion direction of the conductive column 85 into the mountinghole 331 may be parallel to the axial direction of the conductive column85 and be perpendicular to the main sidewall 33 and the main surface 622of the main control circuit board 62. After the conductive column 85being installed in the mounting hole 331, the spring 854 may beelastically deformed when clamped by the conductive contact point 855and the columnar body 851. Then, the conductive contact point 855 may beelastically pressed on the corresponding contact, thereby achieving theelectrical connection between the conductive column 85 and the maincontrol circuit board 62.

It should be noted that the above description of the open earphone 200is merely for illustrative purposes, and not intended to limit the scopeof the present disclosure. For those skilled in the art, various changesand modifications may be made according to the description of thepresent disclosure. However, the changes and modifications may notdepart from the spirit of the present disclosure. For example, theconductive column 85 and the mounting hole 311 may not be limited to ahorizontal arrangement as shown in the drawings, and may also include avertical arrangement, matrix arrangement, circular arrangement and otherregular or irregular arrangements. All such modifications are within thescope of the present disclosure.

FIG. 58 is a schematic diagram illustrating an exemplary explodedstructure of an electronic component according to some embodiments ofthe present disclosure. FIG. 59 is a schematic diagram illustrating anexemplary partial cross-sectional view of an electronic componentaccording to some embodiments of the present disclosure. FIG. 60 is aschematic diagram illustrating an exemplary enlarged view of part A inFIG. 59 according to some embodiments of the present disclosure. Theelectronic component in the present disclosure may be applied to otherelectronic devices. The electronic devices may be any electronic devicethat needs to sealed, such as earphones, MP3 players, hearing aids,mobile phones, tablet computers, glasses with circuit components andelectronic devices, etc., which is not specifically limited herein. Insome embodiments, the electronic component may include a circuit housingand internal circuits as shown in FIG. 3. In some embodiments, theelectronic component may also be referred to as a circuit housing.

In connection with FIGS. 58-60, in some embodiments, the electroniccomponent (or the circuit housing) may include an accommodating body 110and a cover 120. A cavity 111 having an opening 112 at one end thereofmay be set on the accommodating body 110. The cover 120 may be coveredon the opening 112 of the cavity 111 to seal the cavity 111.

In some embodiments, the accommodating body 110 may be at least a partof an electronic device. The accommodating body 110 in this embodimentmay specifically be a structure to accommodate one or more components(e.g., a circuit board, a battery, electronic components, etc.) of anelectronic device, e.g., the whole or a part of the circuit housing 30of the open earphone 200. In some embodiments, the accommodating body110 may accommodate the circuit board, the battery, and the electroniccomponents through the cavity 111 with the opening 112.

The shape of the cover 120 may be at least partially matched with theopening 112, such that the cover 120 may be placed on the opening 112 toseal the cavity 111. The material of the cover 120 may be different fromor partially the same as the accommodating body 110. In someembodiments, the cover 120 may include a rigid support 121 and a softcover layer 122. The rigid support 121 may be physically connected tothe accommodating body 110. The cover layer 122 may be integrallyinjection-molded on the surface of the rigid support 121 to provide aseal for the cavity 111 after the rigid support 121 is connected to theaccommodating body 110.

In some embodiments, the material of the rigid support 121 may includehard plastic, and the material of the cover layer 122 may include softsilicone or rubber. The shape of a side of the rigid support 121 facingthe accommodating body 110 may be matched with the opening 112. Therigid support 121 may be fixed to the opening 112 of the cavity 111 bymeans of plugging, buckling, etc., so as to be physically connected tothe accommodating body 110. A gap may be formed at the physicalconnection between the rigid support 121 and the accommodating body 110,which may reduce the sealing performance of the cavity 111. Further, thesoft cover layer 122 may be integrally injection-molded on the outersurface of the rigid support 121 away from the accommodating body 110and cover the connection between the rigid support 121 and theaccommodating body 11, thereby achieving the sealing of the cavity 111.

In some embodiments, the rigid support 121 may include an insertionportion 1211 and a cover portion 1212. The cover portion 1212 may becovered on the opening 112. The insertion portion 1211 may be set on aside of the cover portion 1212 and extend into the cavity 111 along theinner wall of the cavity 111 to fix the cover portion 1212 on theopening 112.

In some embodiments, the insertion portion 1211 may not be insertedthrough the inner wall of the cavity 111. For example, a plug-in portionmatching with the shape of the insertion portion 1211 of the rigidsupport 121 may be set inside the cavity 111, such that the insertionportion 1211 may be engaged with the plug-in portion and fix the plugportion inside the cavity 111. For example, the shape of the insertionportion 1211 may include a cylinder, and the shape of the plug-inportion may include a cylindrical ring that may surround the cylindricalinsertion portion 1211. An inner diameter of the plug-in portion withthe cylindrical ring shape may be appropriately less than an outerdiameter of the cylindrical insertion portion 1211, such that when theinsertion portion 1211 is inserted into the plug-in portion, theinterference fit between the insertion portion 1211 and the insertionportion may cause the rigid support 121 to be stably connected to thecavity 111. In some embodiments, other insertion technique may also beused as long as the insertion portion 1211 is inserted into the cavity111 and fixed to the cavity 111.

The covering portion 1212 may be disposed on a side of the insertionportion 1211 away from the cavity 111. The covering portion may coverthe opening 112 after the insertion portion 1211 is inserted into thecavity 111. The covering portion 1212 may include a complete structure,or some holes may be set on the covering portion 1212 as needed toachieve a certain function.

FIG. 61 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along A-A axis inFIG. 58 according to some embodiments of the present disclosure. Inconnection with FIGS. 58 and 61, in some embodiments, the accommodatingbody 110 may include an opening edge 113 that matches with the opening112. The covering portion 1212 may be pressed on an inner region 1131 ofthe opening edge 113 close to the opening 112. The cover layer 122 maycover an outer surface of the cover portion 1212 away from theaccommodating body 110 and be pressed on an outer region 1132 on theperiphery of the inner region 1131 of the opening edge 113, which mayachieve the sealing with the opening edge 113.

The inner region 1131 and the outer region 1132 of the opening edge 113may both belong to the opening edge 113, and not other regions outsidethe opening edge 113. The inner region 1131 of the opening edge 113 maybe a region of the opening edge 113 dose to the opening 112, and theouter region 1132 of the opening edge 113 may be a region of the openingedge 113 away from the opening 112.

In some embodiments, the covering portion 1212 of the rigid support 121may be pressed on the inner region 1131 of the opening edge 113 dose tothe opening 112, such that the covering portion 1212 may initially sealthe opening edge 113. However, as materials of the accommodating body110 and the rigid support 121 may both be hard materials, the connectionbetween the accommodating body 110 and the rigid support 121 and thefurther covering of the covering portion 1212 may not achieve a goodsealing effect. A gap may be easily formed between the opening edge 113and an end of the cover portion 1212 that is pressed on the opening edge113 away from the opening 112, and further the cavity 111 may beconnected to the gap, thereby reducing the sealing performance.

According to the above description, in some embodiments, the cover layer122 may cover the outer surface of the covering portion 1212 away fromthe accommodating body 110. The cover layer 122 may further be pressedon the outer region 1132 on the periphery of the inner region 1131 ofthe opening edge 113, such that the gap formed between the cover portion1212 of the rigid support 121 and the opening edge 113 may be furthercovered. As the material of the cover layer 122 is a soft material, thesealing effect and waterproof performance of the electronic componentmay be improved.

FIG. 62 is a schematic diagram illustrating an exemplary enlarged viewof part B in FIG. 61 according to some embodiments of the presentdisclosure. In connection with FIGS. 58, 61, and 62, in someembodiments, when the cover 120 is fastened, the periphery of thecovering portion 1212 may cover the inner region 1131 of the openingedge 113 and contact with the inner region 1131 of the opening edge 113.The cover layer 122 may be set on a side of the covering portion 1212away from the accommodating body 110, such that the covering portion1212 located at the inner region 1131 of the opening edge 113 may besandwiched between the inner region 1131 of the opening edge 113 and thecover layer 122. The cover layer 122 may further extend along adirection away from the opening 112 and along a direction toward theopening edge 113 until contacting the outer region 1132 of the openingedge 113. Therefore, a contact end surface of the cover portion 1212 andthe opening edge 113 and a contact end surface of the cover layer 122and the opening edge 113 may be flat as each other, and a structure of“opening edge 113—covering portion 1212—cover layer 122” may be formedon the inner region 1131 of the opening edge 113,

FIG. 63 is a schematic diagram illustrating an exemplary partialcross-sectional view of an electronic component according to someembodiments of the present disclosure. In connection with FIGS. 58, 60and 63, in some embodiments, after the cover layer 122 extends tocontact the outer region 1132 of the opening edge 113, the cover layer122 may further extend along a region between the cover portion 1212 andthe opening edge 113 to the inner region 1131 of the opening edge 113.It is assumed that between the inner region 1131 of the opening edge 113and the covering portion 1212, the covering portion 1212 may be pressedon the inner region 1131 of the opening edge 113 to form a structure of“opening edge 113—cover layer 122—covering portion 1212−cover layer122”. In some embodiments, the soft cover layer 122 may further extendbetween the rigid support 121 and the opening edge 113 on the basis ofcovering the covering portion 1212 of the rigid support 121, therebyfurther improving the sealing performance between the cavity 111 and thecover 120 and the waterproof effect of the electronic component.

In some embodiments, the electronic component may also include a circuitcomponent 130 disposed in the cavity 111. A switch 1311 may be set onthe circuit component 130. In some embodiments, the circuit component130 may include a first circuit board 131, and the switch 1311 may bedisposed on an outer side of the first circuit board 131 facing theopening 112 of the cavity 111.

Accordingly, a switch hole 1213 corresponding to the switch 1311 may beset on the rigid support 121. The cover layer 122 may further cover theswitching hole 1213, and a pressing portion 1221 may be set at aposition corresponding to the switching hole 1213. The pressing portion1221 may extend toward the inside of the cavity 111 through theswitching hole 1213. When a corresponding position of the cover layer122 is pressed, the pressing portion 1221 may press the switch 1311 ofthe circuit component 130, thereby triggering the circuit component 130to execute a preset function.

The pressing portion 1221 set on the cover layer 122 may be formed byprotruding a side of the cover layer 122 facing the rigid support 121toward the switch hole 1213 and the switch 1311. The shape of thepressing portion 1221 may be matched with the switch hole 1213, suchthat when a corresponding position of the cover layer 122 is pressed,the pressing portion 1221 may pass through the switch hole 1213 andreach the corresponding switch 1311 on the first circuit board 131. Atthe same time, a length of the pressing portion 1221 in a directiontoward the switch 1311 may be set to satisfy a condition that the switch1311 may not be pressed when the corresponding position of the coverlayer 122 is not pressed, and the switch 1311 may be pressed when thecorresponding position of the cover layer 122 is pressed.

In some embodiments, a pressing portion 1222 may be formed at a positionon the cover layer 122 corresponding to the pressing portion 1221protruding toward a side away from the rigid support 121, such that theuser may clarify the position of the switch 1311 and press thecorresponding pressing portion 1222 to trigger the circuit component 130to execute corresponding function.

FIG. 64 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along B-B axis inFIG. 58 according to some embodiments of the present disclosure. Inconnection with FIGS. 58 and 64, the electronic component may include afirst microphone element 1312. In some embodiments, the first microphoneelement 1312 may be disposed on the first circuit board 131 of thecircuit component 130 to be accommodated in the cavity 111. For example,the first microphone element 1312 and the switch 1311 may be disposed onthe first circuit board 131 at intervals. The first microphone element1312 may be used to receive sound signals from outside of the electroniccomponent, and convert the sound signals into electrical signals foranalysis and processing.

In some embodiments, a microphone hole 1214 corresponding to the firstmicrophone element 1312 may be set on the rigid support 121. A firstsound guiding hole 1223 corresponding to the microphone hole 1214 may beset on the cover layer 122. A first sound blocking element 1224 may beset at a position corresponding to the microphone hole 1214. The firstsound blocking element 1224 may extend toward the inside of the cavity111 through the microphone hole 1214 and match with a sound guidingchannel 12241. One end of the sound guiding channel 12241 may connectthe first sound guiding hole 1223 with the cover layer 122. The firstmicrophone element 1312 may be inserted into the sound guiding channel12241 from the other end of the sound guiding channel 12241.

In some embodiments, when the electronic component further includes theswitch 1311, the switch hole 1213 and the microphone hole 1214 may bedisposed on the rigid support 121 at intervals.

In some embodiments, the first sound guiding hole 1223 may be setthrough the cover layer 122 and correspond to the position of the firstmicrophone element 1312. The first sound guiding hole 1223 maycorrespond to the microphone hole 1214 on the rigid support 121, andfurther communicate the first microphone element 1312 with the outsideof the electronic component, such that the sound outside the electroniccomponent may be received by the first microphone element 1312 throughthe first sound guiding hole 1223 and the microphone hole 1214.

The shape of the first sound guiding hole 1223 may be any shape as longas sound from the outside of the electronic component may be input. Insome embodiments, the first sound guiding hole 1223 may include acircular hole with a relatively small size, which is set in a region ofthe cover layer 122 corresponding to the microphone hole 1214. The firstsound guiding hole 1223 with the small size may reduce the communicationbetween the first microphone element 1312 or the like in the electroniccomponent and the outside, thereby improving the sealing performance ofthe electronic component.

In some embodiments, the first sound blocking element 1224 may extendfrom the cover layer 122 to the periphery of the first sound guidinghole 1223, pass through the microphone hole 1214, and extend to theinside of the cavity until reaching the periphery of the firstmicrophone element 1312. Therefore, the sound guiding channel 12241 fromthe first sound guiding hole 1223 to the first microphone element 1312may be formed, such that the sound signal entering the sound guidingholes of the electronic component may directly reach the firstmicrophone element 1312 through the sound guiding channel 12241.

In some embodiments, the shape of the sound guiding channel 12241 in across-section perpendicular to a length direction of the sound guidingchannel 12241 may be the same as or different from the shape of themicrophone hole 1214 or the first microphone element 1312. In someembodiments, the cross-sectional shapes of the microphone hole 1214 andthe first microphone element 1312 in a direction perpendicular to therigid support 121 toward the cavity 111 may be squares. The size of themicrophone hole 1214 may be slightly larger than the outer dimension ofthe sound guiding channel 12241. The internal size of the sound guidingchannel 12241 may not be less than the outer dimension of the firstmicrophone element 1312. Therefore, the sound guiding channel 12241 maypass through the first sound guiding hole 1223 to the first microphoneelement 1312 and cover the periphery of the first microphone element1312.

In this way, the first sound guiding hole 1223 and the sound guidingchannel 12241 that cover the periphery of first microphone element 1312may be set on the cover layer 122 of the electronic component. The soundguiding channel 12241 may pass through the microphone hole 1214 from thefirst sound guiding hole 1223 to the first microphone element 1312. Thesound guiding channel 12241 may enable the sound signal to reach thefirst microphone element 1312 through the first sound guiding hole 1223and to be received by the first microphone element 1312, therebyreducing the leakage of the sound signal in propagation process andimproving the efficiency of the electronic component for receiving thesound signal.

In some embodiments, the electronic component may also include awaterproof mesh 140 disposed in the sound guiding channel 12241. Thewaterproof mesh 140 may abut a side of the cover layer 122 facing thefirst microphone element 1312, and cover the first sound guiding hole1223.

In some embodiments, the rigid support 121 may protrude at a positionclose to the first microphone element 1312 within the sound guidingchannel 12241 to form a convex surface opposite to the first microphoneelement 1312, such that the waterproof mesh 140 may be sandwichedbetween the first microphone element 1312 and the convex surface. Insome embodiments, the waterproof mesh 140 may be directly bonded to theperiphery of the first microphone element 1312. The specific settingmanner of the waterproof mesh 140 may not be limited herein.

In addition to the waterproof effect of the first microphone element1312, the waterproof mesh 140 may also have functions such as soundtransmission. Such sound transmission function may avoid adverselyaffecting the sound receiving effect of a sound receiving area 13121 ofthe first microphone element 1312.

In some embodiments, the cover 120 may include a strip shape, A mainaxis of the first sound guiding hole 1223 and a main axis of the soundreceiving area 13121 of the first microphone element 1312 may be spacedfrom each other in a width direction of the cover 120. The main axis ofthe sound receiving area 13121 of the first microphone element 1312 mayrefer to a main axis of the sound receiving area 13121 of the firstmicrophone element 1312 in the width direction of the cover 120, such asthe axis n as shown in FIG. 64. The main axis of the first sound guidinghole 1223 may be the axis m as shown in FIG. 64.

It should be noted that, due to the need of the circuit component 130,the first microphone element 1312 may be disposed at a first position ofthe first circuit board 131. When the first sound guiding hole 1223 isset, the first sound guiding hole 1223 may be disposed at a secondposition of the cover 120 due to requirements such as beauty andconvenience. In some embodiments, as the main axis of the first soundguiding hole 1223 and the main axis of the sound receiving area 13121 ofthe first microphone element 1312 may be spaced from each other in thewidth direction of the cover 120, the sound input through the firstsound guiding hole 1223 may not be able to reach the sound receivingarea 13121 of the first microphone element 1312 along a straight path.

In some embodiments, in order to guide the sound signal to the firstmicrophone element 1312 through the first sound guiding hole 1223, thesound guiding channel 12241 may be set in a curved shape.

In some embodiments, the main axis of the first sound guiding hole 1223may be in the middle of the cover 120 in the width direction of thecover 120.

In some embodiments, the cover 120 may be a part of the housing of theelectronic device. In order to meet an overall aesthetic requirement ofthe electronic device, the first sound guiding hole 1223 may be disposedin the middle in the width direction of the cover body 120, such thatthe first sound guiding hole 1223 looks more symmetrical and meets thevisual requirements of people.

In some embodiments, the guide channel 12241 may be set to have a stairshape along the cross section along B-B axis as shown in FIG. 58, suchthat the sound signal introduced by the first sound guiding hole 1223may be transmitted to the first microphone element 1312 through thestair-shaped sound guiding channel 12241 and be received by the firstmicrophone element 1312.

FIG. 65 is a schematic diagram illustrating an exemplary cross-sectionalview of the electronic component in an assembled state along C-C axis inFIG. 58 according to some embodiments of the present disclosure. Inconnection with FIG. 58 and FIG. 65, in some embodiments, the electroniccomponent may further include a light emitting element 1313. The lightemitting element 1313 may be set on the first circuit board 131 of thecircuit component 130 to be accommodated in the cavity 111. For example,the light emitting element 1313 may be arranged on the first circuitboard 131 in a certain arrangement together with the switch 1311 and thefirst microphone element 1312.

In some embodiments, a light emitting hole 1215 corresponding to thelight emitting element 1313 may be set on the rigid support 121. Thecover layer 122 may cover the light emitting hole 1215. The thickness ofa region of the cover layer 122 corresponding to the light emitting hole1215 may be set to allow light generated by the light emitting element1313 to be transmitted through the cover layer 122.

In some embodiments, in situations of covering the light emitting hole1215, the cover layer 122 may transmit the light emitted from the lightemitting element 1313 to the outside of the electronic component throughcertain means. In some embodiments, the thickness of the cover layer 122corresponding to an entire region or a part of region of the lightemitting hole 1215 may be less than the thickness of the cover layer 122corresponding to an outer region of the light emitting hole 1215, suchthat the light emitted by the light emitting element 1313 may passthrough the light emitting hole 1215 and be transmitted through thecover layer 122. Of course, other manners may be used to enable theregion where the cover layer 122 covers the light hole 1215 to transmitthe light, which is not specifically limited herein.

In some embodiments, on the basis of covering the light emitting hole1215 corresponding to the light emitting element 1313, the cover layer122 may further be set to enable the light emitted by the light emittingelement 1313 to be transmitted from the cover layer 122 to the outsideof the electronic component. Therefore, the light emitting element 1313may be sealed by the cover layer 122 without affecting the lightemitting function of the electronic component, so as to improve thesealing performance and waterproof performance of the electroniccomponent.

It should be noted that the above description of the electroniccomponents is merely for illustrative purposes, and not intended tolimit the scope of the present disclosure. For those skilled in the art,various changes and modifications may be made according to thedescription of the present disclosure. For example, the number (orcount) of openings may be one or more, which is not limited herein. Asanother example, the number (or count) of switches may be one or more.When the number (or count) of switches is more than one, the switchesmay be arranged on the first circuit board 131 at intervals. All suchmodifications are within the scope of the present disclosure.

The beneficial effects that the present disclosure may include but arenot limited to: (1) open coupling between the earphone and the ear holemay be achieved, avoiding the problems of ear hearing loss and hiddensafety hazards caused by the user wearing the earphone for a long time;(2) a better sound output effect may be realized by setting thehigh-frequency two point sources and the low-frequency two point sources(the sound may be output in different frequency bands); (3) the openearphone may have a stronger effect of reducing sound leakage in higherfrequency bands by setting two point sources with different distances;(4) the circuit housing may be firmly connected to the protective casingas being closely covered by the protective casing, which improves thewaterproof performance of the open earphone; (5) the elastic pad may becovered on the outside of the button hole, which avoids external liquidfrom entering the inside of the circuit housing to achieve thewaterproof performance of the buttons; (6) a glue groove including aplurality of mounting holes may be set on the outside surface of thecircuit housing. A sealant may be pasted on the glue groove to make thehousing casing firmly connect to the circuit housing on the periphery ofthe mounting holes by the sealant. Thereby, the external liquid may beprevented from entering the housing casing through holes, furtherimproving the waterproof performance of the open earphone; (7) the softcover layer may be beneficial to fit the gap between the support rob andthe accommodating body, which improves the sealing performance and thewaterproof performance of the earphone. It should be noted thatdifferent embodiments may have different beneficial effects. Indifferent embodiments, the possible beneficial effects may include anyone or more combination of above described beneficial effects, or anyother potential beneficial effects.

Having thus described the basic concepts, it may be rather apparent tothose skilled in the art after reading this detailed disclosure that theforegoing detailed disclosure is intended to be presented by way ofexample only and is not limiting. Various alterations, improvements, andmodifications may occur and are intended to those skilled in the art,though not expressly stated herein. These alterations, improvements, andmodifications are intended to be suggested by this disclosure, and arewithin the spirit and scope of the exemplary embodiments of thisdisclosure.

Moreover, certain terminology has been used to describe embodiments ofthe present disclosure. For example, the terms “one embodiment,” “anembodiment,” and/or “some embodiments” mean that a particular feature,structure or characteristic described in connection with the embodimentis included in at least one embodiment of the present disclosure.Therefore, it is emphasized and should be appreciated that two or morereferences to “an embodiment” or “one embodiment” or “an alternativeembodiment” in various portions of this specification are notnecessarily all referring to the same embodiment. Furthermore, theparticular features, structures or characteristics may be combined assuitable in one or more embodiments of the present disclosure.

Further, it will be appreciated by one skilled in the art, aspects ofthe present disclosure may be illustrated and described herein in any ofa number of patentable classes or context including any new and usefulprocess, machine, manufacture, or composition of matter, or any new anduseful improvement thereof. Accordingly, aspects of the presentdisclosure may be implemented entirely hardware, entirely software(including firmware, resident software, micro-code, etc.) or combiningsoftware and hardware implementation that may all generally be referredto herein as a “unit,” “module,” or “system”. Furthermore, aspects ofthe present disclosure may take the form of a computer program productembodied in one or more computer readable media having computer readableprogram code embodied thereon.

A computer readable signal medium may include a propagated data signalwith computer readable program code embodied therein, for example, inbaseband or as part of a carrier wave. Such a propagated signal may takeany of a variety of forms, including electro-magnetic, optical, or thelike, or any suitable combination thereof. A computer readable signalmedium may be any computer readable medium that is not a computerreadable storage medium and that may communicate, propagate, ortransport a program for use by or in connection with an instructionexecution system, apparatus, or device. Program code embodied on acomputer readable signal medium may be transmitted using any appropriatemedium, including wireless, wireline, optical fiber cable, RF, or thelike, or any suitable combination of the foregoing.

Computer program code for carrying out operations for aspects of thepresent disclosure may be written in any combination of one or moreprogramming languages, including an object oriented programming languagesuch as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB. NET,Python or the like, conventional procedural programming languages, suchas the “C” programming language, Visual Basic, Fortran 2103, Perl, COBOL2102, PHP, ABAP, dynamic programming languages such as Python, Ruby andGroovy, or other programming languages. The program code may executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer may be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection may be made to anexternal computer (for example, through the Internet using an InternetService Provider) or in a cloud computing environment or offered as aservice such as a Software as a Service (SaaS).

Furthermore, the recited order of processing elements or sequences, orthe use of numbers, letters, or other designations therefore, is notintended to limit the claimed processes and methods to any order exceptas may be specified in the claims. Although the above disclosurediscusses through various examples what is currently considered to be avariety of useful embodiments of the disclosure, it is to be understoodthat such detail is solely for that purpose, and that the appendedclaims are not limited to the disclosed embodiments, but, on thecontrary, are intended to cover modifications and equivalentarrangements that are within the spirit and scope of the disclosedembodiments. For example, although the implementation of variouscomponents described above may be embodied in a hardware device, it mayalso be implemented as a software only solution, for example, aninstallation on an existing server or mobile device.

Similarly, it should be appreciated that in the foregoing description ofembodiments of the present disclosure, various features are sometimesgrouped together in a single embodiment, figure, or description thereoffor the purpose of streamlining the disclosure aiding in theunderstanding of one or more of the various inventive embodiments. Thismethod of disclosure, however, is not to be interpreted as reflecting anintention that the claimed subject matter requires more features thanare expressly recited in each claim. Rather, inventive embodiments liein less than all features of a single foregoing disclosed embodiment.

In some embodiments, the numbers expressing quantities or propertiesused to describe and claim certain embodiments of the application are tobe understood as being modified in some instances by the term “about,”“approximate,” or “substantially.” For example, “about,” “approximate,”or “substantially” may indicate ±20% variation of the value itdescribes, unless otherwise stated. Accordingly, in some embodiments,the numerical parameters set forth in the written description andattached claims are approximations that may vary depending upon thedesired properties sought to be obtained by a particular embodiment. Insome embodiments, the numerical parameters should be construed in lightof the number of reported significant digits and by applying ordinaryrounding techniques. Notwithstanding that the numerical ranges andparameters setting forth the broad scope of some embodiments of theapplication are approximations, the numerical values set forth in thespecific examples are reported as precisely as practicable.

Each of the patents, patent applications, publications of patentapplications, and other material, such as articles, books,specifications, publications, documents, things, and/or the like,referenced herein is hereby incorporated herein by this reference in itsentirety for all purposes, excepting any prosecution file historyassociated with same, any of same that is inconsistent with or inconflict with the present document, or any of same that may have alimiting affect as to the broadest scope of the claims now or laterassociated with the present document. By way of example, should there beany inconsistency or conflict between the descriptions, definition,and/or the use of a term associated with any of the incorporatedmaterial and that associated with the present document, the description,definition, and/or the use of the term in the present document shallprevail.

In closing, it is to be understood that the embodiments of theapplication disclosed herein are illustrative of the principles of theembodiments of the application. Other modifications that may be employedmay be within the scope of the application. Thus, by way of example, butnot of limitation, alternative configurations of the embodiments of theapplication may be utilized in accordance with the teachings herein.Accordingly, embodiments of the present application are not limited tothat precisely as shown and described.

We claim:
 1. A waterproof open earphone, comprising: a housing, whereinthe housing is placed on a head or at least one ear of a user while notblocking an ear canal of the user; at least one button set on thehousing, wherein each of the at least one button corresponds to a buttonhole; at least one elastic pad corresponding to the at least one button,respectively, wherein each elastic pad prevents the corresponding buttonfrom moving relative to the button hole, wherein the elastic pad is seton a first recessed area and a second recessed area corresponding to thebutton hole is set on the elastic pad, the second recesses areaextending to inside of the button hole; and at least one pair of speakerunits, wherein each pair of the at least one pair of speaker unitsgenerate sound within a frequency range from two sound guiding holesthrough two sound guiding tubes.
 2. The waterproof open earphone ofclaim 1, wherein the at least one pair of speaker unit includes a pairof low-frequency speaker units and a pair of high-frequency speakerunits, wherein the pair of first frequency speaker units generate soundwithin a first frequency range from two first sound guiding holesthrough two first sound guiding tubes, and the pair of second frequencyspeaker units generate sound within a second frequency range from twosecond sound guiding holes through two second sound guiding tubes,wherein the second frequency range includes a frequency higher than thefirst frequency range.
 3. The waterproof open earphone of claim 2,wherein the two first guiding holes are spaced apart from each other bya first distance, the two second guiding holes are spaced apart fromeach other by a second distance, the first distance being greater thanthe second distance.
 4. The waterproof open earphone of claim 2, whereina center point of one of the first sound guiding holes or the secondsound guiding holes is not greater than 10 cm from a center point of theear canal of the user.
 5. The waterproof open earphone of claim 2,wherein the sound generated by the pair of first frequency speaker unitsor the pair of second frequency speaker units are in opposite phases. 6.The waterproof open earphone of claim 1, further comprising: a circuithousing including an accommodating body and a cover, wherein a cavitythat has an opening at one end of the accommodating body is set on theaccommodating body and the cover is covered on the opening of the cavityto seal the cavity.
 7. The waterproof open earphone of claim 6, whereinthe circuit housing further includes a main sidewall and an auxiliarysidewall connected to the main sidewall, wherein the first recessed areais configured on an outer surface of the auxiliary sidewall.
 8. Thewaterproof open earphone of claim 7, wherein the button includes abutton body and a button contact point, wherein the button body isdisposed on a side of the elastic pad away from the circuit housing andthe button contact point extends to inside of the second recessed area.9. The waterproof open earphone of claim 8, further comprising: a rigidpad disposed between the elastic pad and the circuit housing, wherein athrough hole is set on the rigid pad and the second recessed areafurther extends to the inside of the button hole through the throughhole, wherein the elastic pad and the rigid pad abut each other.
 10. Thewaterproof open earphone of claim 6, further comprising: a housingcasing covering periphery of the circuit housing and periphery of thebutton.
 11. The waterproof open earphone of claim 10, wherein thehousing casing includes a bag-shaped structure with one end open and thecircuit housing and the button enter the inside of the housing casingthrough the open end.
 12. The waterproof open earphone of claim 11,wherein an annular flange protruding inward is set on the open end ofthe housing casing, an end of the circuit housing is set as a stairshape and forms an annular platform, wherein when the housing casingcovers periphery of the circuit housing, the annular flange is incontact with the annular platform.
 13. The waterproof open earphone ofclaim 12, wherein a sealant is applied in a joint region of the annularflange and the annular platform to firmly connect the housing casingwith the circuit housing.
 14. The waterproof open earphone of claim 8,further comprising: an auxiliary piece, wherein the auxiliary pieceincludes a board, and a hollowed area is set on the board and a mountinghole is set on the main sidewall and located inside the hollowed area.15. The waterproof open earphone of claim 14, further comprising: aconductive column inserted into the mounting hole, wherein a glue grooveis formed at periphery of the conductive column.
 16. The waterproof openearphone of claim 15, wherein a notch is set in the hollowed area of theauxiliary piece and a first strip rib is integrally formed on the innersurface of the main sidewall corresponding to the notch, wherein thefirst strip rib fit and the auxiliary piece cooperate to make the gluegroove closed.
 17. The waterproof open earphone of claim 6, wherein thecover includes a rigid support and a cover layer, wherein the rigidsupport is physically connected to the accommodating body and the coverlayer provides a seal for the cavity after the rigid support isconnected to the accommodating body.
 18. The waterproof open earphone ofclaim 17, wherein a shape of a side of the rigid support facing theaccommodating body is matched with the opening and the cover layercovers the outer surface of the rigid support away from theaccommodating body.
 19. The waterproof open earphone of claim 18,wherein the rigid support includes an insertion portion and a coverportion, wherein the cover portion is covered on the opening and theinsertion portion is set on a side of the cover portion and extends intothe cavity along an inner wall of the cavity to fix the cover portion onthe opening.
 20. The waterproof open earphone of claim 19, wherein theaccommodating body includes an opening edge that matches with theopening, the covering portion is pressed on an inner region of theopening edge close to the opening, and the cover layer cover an outersurface of the cover portion away from the accommodating body and ispressed on an outer region on the periphery of the inner region of theopening edge which achieves a sealing with the opening edge.